← Back to Patent Explorer
US5993686A Expired / Lapsed US ⏱️ 0.0 years remaining

Fluoride additive containing chemical mechanical polishing slurry and method for use of same

Assignee: CMC Materials LLC
•
Filing: 1996-06-06
•
Granted: 1999-11-30
•
Expires: 2016-06-06
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A chemical mechanical polishing slurry comprising an oxidizing agent, a fluoride containing additive and an abrasive and a method for using the fluoride containing additive chemical mechanical polishing slurry to remove tungsten and titanium from substrates.

Inventors

  • 👤 Christopher C. Streinz
  • 👤 Brian L. Mueller
  • 👤 Michael A. Lucarelli
  • 👤 Max H. Walters

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 21:38
CPC Classifications
C; C09; C09G; C09G1/00; C09G1/02; H; H10; H10P; H10P50/00

Claims Analysis

Total Claims: 37
Claim 1
Independent Claim 107 words
An aqueous chemical mechanical polishing slurry comprising: (a) an oxidizing agent selected from the group consisting of oxidizing metal salts, oxidizing metal complexes, peracetic acids, periodic acids, iron salts, iron sulfites, iron nitrites, iron EDTA, iron citrates, potassium ferricyanide, hydrogen peroxide, potassium dichromate, potassium iodate, potassium bromate, vanadium trioxide, aluminum salts, sodium salts, potassium salts, ammonium salts, quaternary ammonium salts, phosphonium salts, cationic salts of peroxides, cationic, salts of chlorates, cationic salts of perchlorates, cationic salts of nitrates, cationic salts of permanganates, cationic salts of persulfates and mixtures thereof; (b) an abrasive; and (c) from about 0.01 to about 0.3 weight percent of a fluoride containing additive.
Claim 2
Dependent Claim 107 words
An aqueous chemical mechanical polishing slurry comprising: (a) an oxidizing agent selected from the group consisting of oxidizing metal salts, oxidizing metal complexes, peracetic acids, periodic acids, iron salts, iron sulfites, iron nitrites, iron EDTA, iron citrates, potassium ferricyanide, hydrogen peroxide, potassium dichromate, potassium iodate, potassium bromate, vanadium trioxide, aluminum salts, sodium salts, potassium salts, ammonium salts, quaternary ammonium salts, phosphonium salts, cationic salts of peroxides, cationic, salts of chlorates, cationic salts of perchlorates, cationic salts of nitrates, cationic salts of permanganates, cationic salts of persulfates and mixtures thereof; (b) an abrasive; and (c) from about 0.01 to about 0.3 weight percent of a fluoride containing additive.
Claim 3
Dependent Claim 24 words
The chemical mechanical polishing slurry of claim 1 wherein the fluoride containing additives is selected from fluoride containing acids, fluoride salts, and mixtures thereof.
Claim 4
Dependent Claim 35 words
The chemical mechanical polishing slurry of claim 2 wherein the fluoride containing additive is a fluoride containing acid selected from the group consisting of hydrofluoric acid, fluorosilicic acid, fluoboric acid, fluotitanic acid, and mixtures thereof.
Claim 5
Dependent Claim 36 words
The chemical mechanical polishing slurry of claim 2 wherein the fluoride containing additive is a fluoride salt selected from the group consisting of ammonium fluoride, potassium fluoride, ammonium hydrogen difluoride, potassium hydrogen difluoride, and mixtures thereof.
Claim 6
Dependent Claim 38 words
The chemical mechanical polishing slurry of claim 1 wherein the oxidizing agent is selected from the group comprising iron salts, potassium salts, ammonium salts, quartenary ammonium salts, phosphonium salts, peroxides, chlorates, perchlorates, nitrates, permanganates, persulfates, and mixtures thereof.
Claim 7
Dependent Claim 15 words
The chemical mechanical polishing slurry of claim 5 wherein the oxidizing agent is ferric nitrate.
Claim 8
Dependent Claim 18 words
The chemical mechanical polishing slurry of claim 6 having a pH of from about 1.5 to about 3.0.
Claim 9
Dependent Claim 18 words
The chemical mechanical polishing slurry of claim 1 having a pH of from about 1.0 to about 5.0.
Claim 10
Dependent Claim 16 words
The chemical mechanical polishing slurry of claim 1 wherein the fluoride containing additive is hydrofluoric acid.
Claim 11
Dependent Claim 15 words
The chemical mechanical polishing slurry of claim 1 wherein the abrasive is a metal oxide.
Claim 12
Dependent Claim 28 words
The chemical mechanical polishing slurry of claim 10 wherein the metal oxide abrasive is selected from the group including alumina, ceria, germania, silica, titania, zirconia, and mixtures thereof.
Claim 13
Dependent Claim 19 words
The chemical mechanical polishing slurry of claim 1 wherein the abrasive is an aqueous dispersion of a metal oxide.
Claim 14
Dependent Claim 13 words
The chemical mechanical polishing slurry of claim 1 wherein the abrasive is alumina.
Claim 15
Dependent Claim 14 words
The chemical mechanical polishing slurry of claim 13 wherein the alumina is fumed alumina.
Claim 16
Dependent Claim 17 words
The chemical mechanical polishing slurry of claim 1 wherein the abrasive consists of fine metal oxide particles.
Claim 17
Dependent Claim 21 words
The chemical mechanical polishing slurry of claim 15 wherein the fine metal oxide particles comprise precipitated alumina or a fumed alumina.
Claim 18
Dependent Claim 12 words
The chemical mechanical polishing slurry of claim 1 further including a surfactant.
Claim 19
Dependent Claim 27 words
The chemical mechanical polishing slurry of claim 1 further including a compound selected from the group consisting of organic acids, salts of organic acids, and mixtures thereof.
Claim 20
Dependent Claim 25 words
The chemical mechanical polishing slurry of claim 1 further including a compound selected from the group consisting of inorganic acids, inorganic salts, and mixtures thereof.
Claim 21
Dependent Claim 48 words
An aqueous chemical mechanical polishing slurry useful for polishing substrates including titanium and tungsten comprising: from about 1 to about 7 weight percent ferric nitrate; from about 1 to about 12 weight percent alumina; and from about 0.01 to about 2.0 weight percent of a fluoride containing additive.
Claim 22
Dependent Claim 48 words
An aqueous chemical mechanical polishing slurry useful for polishing substrates including titanium and tungsten comprising: from about 1 to about 7 weight percent ferric nitrate; from about 1 to about 12 weight percent alumina; and from about 0.01 to about 2.0 weight percent of a fluoride containing additive.
Claim 23
Dependent Claim 24 words
The chemical mechanical polishing slurry of claim 20 wherein the fluoride containing additive is selected from fluoride containing acids, fluoride salts, and mixtures thereof.
Claim 24
Dependent Claim 43 words
The chemical mechanical polishing slurry of claim 20 wherein the fluoride containing additive further comprises at least one fluoride containing acid and at least one fluoride salt wherein the chemical mechanical polishing slurry has a pH of from about 1.5 to about 3.0.
Claim 25
Dependent Claim 17 words
The chemical mechanical polishing slurry of claim 20 wherein the alumina is an aqueous dispersion of alumina.
Claim 26
Dependent Claim 14 words
The chemical mechanical polishing slurry of claim 20 wherein the alumina is fumed alumina.
Claim 27
Dependent Claim 19 words
The chemical mechanical polishing slurry of claim 20 having a tungsten to titanium polishing selectivity (W:Ti) of about 3:1-1:2.
Claim 28
Independent Claim 168 words
A method for polishing a substrate including a titanium adhesion layer comprising: (a) admixing, an oxidizing agent selected from the group consisting of oxidizing metal salts, oxidizing metal complexes, peracetic acids, periodic acids, iron salts, iron sulfites, iron nitrites, iron EDTA, iron citrates, potassium ferricyanide, hydrogen peroxide, potassium dichromate, potassium iodate, potassium bromate, vanadium trioxide, aluminum salts, sodium salts, potassium salts, ammonium salts, quaternary ammonium salts, phosphonium salts, cationic salts of peroxides, cationic salts of chlorates, cationic salts of perchlorates, cationic salts of nitrates, cationic salts of permanganates, cationic salts of persulfates and mixtures thereof, from about 0.01 to about 0.3 weight percent of a fluoride containing additive and an abrasive to give a chemical mechanical polishing slurry having a pH of from about 1.0 to about 5.0; (b) applying the chemical mechanical polishing slurry to the substrate; and (c) removing a least a portion of the titanium adhesion layer by bringing a pad into contact with the substrate and moving the pad in relation to the substrate.
Claim 29
Independent Claim 168 words
A method for polishing a substrate including a titanium adhesion layer comprising: (a) admixing, an oxidizing agent selected from the group consisting of oxidizing metal salts, oxidizing metal complexes, peracetic acids, periodic acids, iron salts, iron sulfites, iron nitrites, iron EDTA, iron citrates, potassium ferricyanide, hydrogen peroxide, potassium dichromate, potassium iodate, potassium bromate, vanadium trioxide, aluminum salts, sodium salts, potassium salts, ammonium salts, quaternary ammonium salts, phosphonium salts, cationic salts of peroxides, cationic salts of chlorates, cationic salts of perchlorates, cationic salts of nitrates, cationic salts of permanganates, cationic salts of persulfates and mixtures thereof, from about 0.01 to about 0.3 weight percent of a fluoride containing additive and an abrasive to give a chemical mechanical polishing slurry having a pH of from about 1.0 to about 5.0; (b) applying the chemical mechanical polishing slurry to the substrate; and (c) removing a least a portion of the titanium adhesion layer by bringing a pad into contact with the substrate and moving the pad in relation to the substrate.
Claim 30
Dependent Claim 26 words
The method of claim 26 wherein the chemical mechanical polishing slurry is applied to the pad before the pad is placed into contact with the substrate.
Claim 31
Dependent Claim 111 words
The method of claim 26 wherein the oxidizing agent and the fluoride containing additive are held as an aqueous solution in a first container and an aqueous dispersion of abrasive is held in a second container and wherein a portion of the contents of the first container are combined with at least a portion of the contents of the second container to give an aqueous chemical mechanical polishing slurry comprising from about 1 to about 7 weight percent of the oxidizing agent, from about 1 to about 6 weight percent abrasive, and from about 0.01 to about 2.0 weight percent fluoride containing additive prior to applying the slurry to the pad.
Claim 32
Dependent Claim 28 words
The method of claim 28 wherein the fluoride containing additive is a fluoride containing acid selected from the group consisting of hydrofluoric acid, fluorosilicic acid and mixtures thereof.
Claim 33
Dependent Claim 13 words
The method of claim 29 wherein the fluoride containing additive is hydrofluoric acid.
Claim 34
Dependent Claim 30 words
The method of claim 28 wherein the fluoride containing additive is a fluoride salt selected from the group consisting of ammonium fluoride, potassium fluoride, ammonium hydrogen difluoride, and mixtures thereof.
Claim 35
Dependent Claim 24 words
The method of claim 31 wherein the fluoride salt is potassium fluoride in an amount ranging from about 0.2 to about 1.0 wt %.
Claim 36
Independent Claim 139 words
A method for polishing a substrate including a titanium adhesion layer and a tungsten layer comprising: (a) admixing, ferric nitrate, alumina, and hydrofluoric acid with deionized water to give a mechanical chemical polishing slurry comprising from about 1 to about 7 weight percent ferric nitrate, from about 1 to about 6 weight percent alumina, and from about 0.1 to about 0.3 weight percent hydrofluoric acid wherein the chemical mechanical polishing slurry has a pH of from about 1.5 to about 2.5 and a tungsten to titanium polishing selectivity (W:Ti) of about 3:1-1:2. (b) applying the chemical mechanical polishing slurry to the substrate; and (c) removing a least a portion of the titanium adhesion layer and a portion of the tungsten layer by bringing a pad into contact with the substrate and moving the pad in relation to the substrate.
Claim 37
Independent Claim 139 words
A method for polishing a substrate including a titanium adhesion layer and a tungsten layer comprising: (a) admixing, ferric nitrate, alumina, and hydrofluoric acid with deionized water to give a mechanical chemical polishing slurry comprising from about 1 to about 7 weight percent ferric nitrate, from about 1 to about 6 weight percent alumina, and from about 0.1 to about 0.3 weight percent hydrofluoric acid wherein the chemical mechanical polishing slurry has a pH of from about 1.5 to about 2.5 and a tungsten to titanium polishing selectivity (W:Ti) of about 3:1-1:2. (b) applying the chemical mechanical polishing slurry to the substrate; and (c) removing a least a portion of the titanium adhesion layer and a portion of the tungsten layer by bringing a pad into contact with the substrate and moving the pad in relation to the substrate.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2002-11-29 2003-05-31 2003-11-30 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2006-11-29 2007-05-31 2007-11-30 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2010-11-29 2011-05-31 2011-11-30 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag