Programmable high-density electronic device testing

Abstract

Abstract Generally, in one aspect, apparatus features a structure for routing test signals between pads of a device under test and a tester circuit. The structure features a probe support that includes a substrate having contact points, one for each of the pads to be tested, a number of conductors for connection to the tester circuit, the number of conductors being fewer than the number of contact points on the substrate, and switching circuitry mounted on the probe support for routing the test signals between the conductors and the contact points. In another aspect, a method routes test signals between pads of a device under test and terminals of a tester circuit, the method features providing a test head in the vicinity of the device under test, the test head having a contact for each pad to be tested on the device under test and a separate conductor connecting each contact to a switching circuit located on the test head, passing test signals between the pads of the device under test and the switching circuit via the conductors, and passing test signals between the switching circuit and the terminals of the tester via wires that number fewer than half of the number of conductors on the test head.

Inventors

• 👤 Fu Chiung Chong

Bibliographic Details