US5491427A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Probe and electrical part/circuit inspecting apparatus as well as electrical part/circuit inspecting method
Assignee: Agilent Technologies Inc
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Filing: 1994-08-10
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Granted: 1996-02-13
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Expires: 2014-08-10
Abstract
Abstract An apparatus and method for providing durable, high performance, probing of semiconductor devices having a large number of narrow pitch terminals. A single probe of the present invention provides flexible probing of a wide range of the devices having various sizes and terminal arrangements. In contrast, teachings of the prior art require a separate probe to be manufactured or a probe to be re-formed for each different size and terminal arrangement of the devices. The probe of the invention includes electrodes electrically coupled with a test system in such a way so as to provide the devices to be probed with a selection of more than two arrangements in which device terminals contacting the probe electrodes are not shorted with each other by the probe.
Inventors
- 👤 Toshiaki Ueno
- 👤 You Kondoh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 02:02
CPC Classifications
G; G01; G01R; G01R31/00; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07307; G01R1/0735; G01R1/07364
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
187 words
An apparatus for probing semiconductor devices having terminal comprising: a substrate (1) having a surface; probe electrodes (B) disposed on the surface of the substrate, wherein the electrodes are arranged on the surface of the substrate in a plurality of columns for probing the semiconductor device, each probing column extending outwardly from a central portion of the substrate surface towards a perimeter of the substrate surface; and means (6; S1-S10; S) for electrically coupling probe electrodes with a test system in such a way so as to provide the devices to be probed with a selection of more than two arrangements in which device terminals contacting the probe electrodes are not shorted with each other by the coupling means, wherein the coupling means includes a plurality of line patterns (6), each line electrically interconnecting the electrode of a respective one of the probing columns, wherein the probe electrodes are arrayed in a grid pattern at contacting regions with the device to be probed by a signal path switching means (S1-S10; S), and wherein said probe electrode and signal path switching means are both formed on the substrate.
Claim 2
Independent Claim
187 words
An apparatus for probing semiconductor devices having terminal comprising: a substrate (1) having a surface; probe electrodes (B) disposed on the surface of the substrate, wherein the electrodes are arranged on the surface of the substrate in a plurality of columns for probing the semiconductor device, each probing column extending outwardly from a central portion of the substrate surface towards a perimeter of the substrate surface; and means (6; S1-S10; S) for electrically coupling probe electrodes with a test system in such a way so as to provide the devices to be probed with a selection of more than two arrangements in which device terminals contacting the probe electrodes are not shorted with each other by the coupling means, wherein the coupling means includes a plurality of line patterns (6), each line electrically interconnecting the electrode of a respective one of the probing columns, wherein the probe electrodes are arrayed in a grid pattern at contacting regions with the device to be probed by a signal path switching means (S1-S10; S), and wherein said probe electrode and signal path switching means are both formed on the substrate.
Claim 3
Dependent Claim
71 words
An apparatus as in claim 1 further comprising: means (3) for aligning the electrodes disposed on the substrate surface with the device terminals so as to select a respective probing column for each terminal of the device; and means (2) for pressing a respective selected electrode into electrical contact with each terminal of the device, so as to provide electrical coupling between each device terminal and the respective selected probing column.
Claim 4
Dependent Claim
30 words
An apparatus as in claim 1 wherein said signal path switching means is a semiconductor switch or a mechanical switch (31, 32, 33, 34, 35) fabricated by a micro-machining technology.
Claim 5
Dependent Claim
23 words
An apparatus as in claim 1 wherein said signal path switching means is constructed so that it opens a signal path by melting.
Claim 6
Independent Claim
24 words
An apparatus as in claims 1 wherein the substrate comprises an insulative flexible synthetic resin film having a front surface coupled with the electrodes.
Claim 7
Dependent Claim
24 words
An apparatus as in claim 5, further comprising an elastic body mechanically coupled with a rear surface of the insulative flexible synthetic resin film.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-02-12 | 1999-08-14 | 2000-02-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-02-12 | 2003-08-14 | 2004-02-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-02-12 | 2007-08-14 | 2008-02-13 | $7700.00 | Window Closed / Lapsed |