Patent US5952712A successfully refreshed from Google Patents.
US5952712A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Packaged semiconductor device and method of manufacturing the same
Assignee: NEC Corp
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Filing: 1997-07-16
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Granted: 1999-09-14
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Expires: 2017-07-16
Abstract
Abstract A packaged semiconductor device includes an LSI chip, a chip size package integrally bonded to the LSI chip to mount and hold the LSI chip thereon in order to connect an electrode of a board on which the LSI chip is to be mounted and an electrode of the LSI chip to each other, an electrode formed on a surface of the package opposite to a surface thereof which is bonded to the LSI chip, so as to be connected to the electrode of the board, at least one through hole formed to extend through the LSI chip and the package, and a connecting conductor formed to extend through the through hole in order to connect the electrode of the package and the electrode of the LSI package to each other.
Inventors
- 👤 Kazuhiro Ikuina
- 👤 Yuzo Shimada
- 👤 Kazuaki Utsumi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 09:16
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W99/00; H10W20/00; H10W20/01; H10W20/021; H10W20/023; H10W20/20; H10W70/00; H10W70/60; H10W70/67; H10W70/68
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
158 words
A packaged semiconductor device comprising: an LSI chip having an electrode positioned on an upper surface of said LSI chip; a chip size package integrally bonding to said LSI chip on an opposite surface of said LSI chip electrode, and further connecting an electrode of a board on which said LSI chip is to be mounted and said LSI chip electrode to each other; an electrode formed on a surface of said package opposite to said surface bonded to said LSI chip, said package surface connecting to said board electrode; at least one through hole extending through said LSI chip and said package; and a connecting conductor extending through the through hole of said LSI chip and said package and further extending on the upper surface of said LSI chip to a side surface of said LSI chip electrode so as to connect the side surface of said LSI chip electrode and said package electrode to each other.
Claim 2
Dependent Claim
158 words
A packaged semiconductor device comprising: an LSI chip having an electrode positioned on an upper surface of said LSI chip; a chip size package integrally bonding to said LSI chip on an opposite surface of said LSI chip electrode, and further connecting an electrode of a board on which said LSI chip is to be mounted and said LSI chip electrode to each other; an electrode formed on a surface of said package opposite to said surface bonded to said LSI chip, said package surface connecting to said board electrode; at least one through hole extending through said LSI chip and said package; and a connecting conductor extending through the through hole of said LSI chip and said package and further extending on the upper surface of said LSI chip to a side surface of said LSI chip electrode so as to connect the side surface of said LSI chip electrode and said package electrode to each other.
Claim 3
Dependent Claim
30 words
A device according to claim 2, wherein said package is made of a material having a thermal expansion coefficient close to that of an Si wafer constituting said LSI chip.
Claim 4
Dependent Claim
13 words
A device according to claim 2, wherein said package is made of glass.
Claim 5
Dependent Claim
14 words
A device according to claim 2, wherein said package is made of a ceramic.
Claim 6
Dependent Claim
16 words
A device according to claim 3, wherein said package is made of SiO 2 -based glass.
Claim 7
Dependent Claim
14 words
A device according to claim 4, wherein said package is made of glass ceramic.
Claim 8
Dependent Claim
13 words
A device according to claim 4, wherein said package is made of alumina.
Claim 9
Dependent Claim
13 words
A device according to claim 4, wherein said package is made of mullite.
Claim 10
Dependent Claim
13 words
A device according to claim 4, wherein said package is made of cordierite.
Claim 11
Dependent Claim
14 words
A device according to claim 4, wherein said package is made of aluminum nitride.
Claim 12
Dependent Claim
24 words
A device according to claim 1, wherein said package and said LSI chip are bonded to each other by using glass as an adhesive.
Claim 13
Dependent Claim
27 words
A device according to claim 11, wherein the glass serving as the adhesive has a low softening temperature and can maintain a viscosity at about 1,000° C.
Claim 14
Dependent Claim
15 words
A device according to claim 1, wherein said package is formed of a multilayer substrate.
References Cited (Backward Citations)
US3560257A
Cited
US4499655A
Cited
JPS6068687A
Cited
US4733291A
Cited
US4991090A
Cited
US5325265A
Cited
US5065228A
Cited
US5198695A
Cited
US5229647A
Cited
EP0575813A2
Cited
US5399898A
Cited
US5404044A
Cited
US5406125A
Cited
US5386142A
Cited
US5530288A
Cited
US5552633A
Cited
US5825080A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-09-13 | 2003-03-15 | 2003-09-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-09-13 | 2007-03-15 | 2007-09-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-09-13 | 2011-03-15 | 2011-09-14 | $7700.00 | Window Closed / Lapsed |