US5869787A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electrically conductive projections
Assignee: Micron Technology Inc
•
Filing: 1997-04-30
•
Granted: 1999-02-09
•
Expires: 2017-04-30
Abstract
Abstract An electrically conductive apparatus includes, a) an electrically non-conducting substrate, the substrate having a base surface and an adjacent elevated surface, the elevated surface being spaced from the base surface by a first distance thereby defining a step having a step wall; b) a capping layer of first electrically conductive material coating the elevated surface only portions of the step wall, the capping layer having outer top and outer side portions; and c) a conductive trace of second electrically conductive material which is different from the first electrically conductive material; the conductive trace overlying the substrate, portions of the step wall not covered by the capping layer, and the outer side portions of the capping layer. Methods are disclosed for producing such a construction, for forming an electrically conductive projection outwardly extending from a substrate, and for providing an electrical interconnection between adjacent different elevation areas on a substrate.
Inventors
- 👤 Salman Akram
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 05:40
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/06711; G01R1/06733; G01R1/06738; G01R1/06755; G01R1/06761; H; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/0698; H10W70/00; H10W70/60; H10W70/67; H10W70/68; G01R1/06744; H05; H05K; H05K3/00; H05K3/02; H05K3/04; H05K3/046; H05K3/048; H05K3/06; H05K3/061; H05K3/064; H05K3/40; H05K3/4007; Y; Y10; Y10S; Y10S438/00; Y10S438/902
Claims Analysis
Total Claims: 46
Claim 1
Independent Claim
107 words
An electrically conductive apparatus comprising: an electrically non-conducting substrate; a pillar outwardly projecting from the substrate, the pillar having a top surface and having side surfaces extending to the substrate; a cap of first electrically conductive material coating the pillar outermost top surface and only portions of the pillar side surfaces outwardly of the substrate, the cap having outer top and outer side portions; and a conductive trace of second electrically conductive material which is different from the first electrically conductive material; the conductive trace overlying the substrate, portions of the pillar side surfaces not covered by the cap, and the outer side portions of the cap.
Claim 2
Dependent Claim
107 words
An electrically conductive apparatus comprising: an electrically non-conducting substrate; a pillar outwardly projecting from the substrate, the pillar having a top surface and having side surfaces extending to the substrate; a cap of first electrically conductive material coating the pillar outermost top surface and only portions of the pillar side surfaces outwardly of the substrate, the cap having outer top and outer side portions; and a conductive trace of second electrically conductive material which is different from the first electrically conductive material; the conductive trace overlying the substrate, portions of the pillar side surfaces not covered by the cap, and the outer side portions of the cap.
Claim 3
Dependent Claim
12 words
The electrically conductive apparatus of claim 1 wherein the substrate comprises silicon.
Claim 4
Dependent Claim
23 words
The electrically conductive apparatus of claim 1 wherein the substrate comprises a silicon bulk substrate having a coating layer of an insulating material.
Claim 5
Dependent Claim
17 words
The electrically conductive apparatus of claim 1 wherein the pillar constitutes the same material as the substrate.
Claim 6
Dependent Claim
22 words
The electrically conductive apparatus of claim 1 wherein the substrate and pillar comprise silicon having a coating layer of an insulating material.
Claim 7
Dependent Claim
30 words
The electrically conductive apparatus of claim 1 wherein the substrate and pillar comprise silicon having a coating layer of an insulating material, and the cap and conductive trace comprise metals.
Claim 8
Dependent Claim
18 words
The electrically conductive apparatus of claim 1 wherein the conductive trace does not overlie the cap top portion.
Claim 9
Dependent Claim
12 words
The electrically conductive apparatus of claim 7 wherein the substrate comprises silicon.
Claim 10
Dependent Claim
23 words
The electrically conductive apparatus of claim 7 wherein the substrate comprises a silicon bulk substrate having a coating layer of an insulating material.
Claim 11
Dependent Claim
17 words
The electrically conductive apparatus of claim 7 wherein the pillar constitutes the same material as the substrate.
Claim 12
Dependent Claim
22 words
The electrically conductive apparatus of claim 7 wherein the substrate and pillar comprise silicon having a coating layer of an insulating material.
Claim 13
Dependent Claim
30 words
The electrically conductive apparatus of claim 7 wherein the substrate and pillar comprise silicon having a coating layer of an insulating material, and the cap and conductive trace comprise metals.
Claim 14
Dependent Claim
114 words
An electrically conductive apparatus comprising: an electrically non-conducting substrate, the substrate having a base surface and an adjacent elevated surface, the elevated surface being spaced from the base surface by a first distance thereby defining a step having a step wall; a capping layer of first electrically conductive material coating the elevated surface and only portions of the step wall, the capping layer having outer top and outer side portions; and a conductive trace of second electrically conductive material which is different from the first electrically conductive material; the conductive trace overlying the substrate, portions of the step wall not covered by the capping layer, and the outer side portions of the capping layer.
Claim 15
Dependent Claim
114 words
An electrically conductive apparatus comprising: an electrically non-conducting substrate, the substrate having a base surface and an adjacent elevated surface, the elevated surface being spaced from the base surface by a first distance thereby defining a step having a step wall; a capping layer of first electrically conductive material coating the elevated surface and only portions of the step wall, the capping layer having outer top and outer side portions; and a conductive trace of second electrically conductive material which is different from the first electrically conductive material; the conductive trace overlying the substrate, portions of the step wall not covered by the capping layer, and the outer side portions of the capping layer.
Claim 16
Dependent Claim
19 words
The electrically conductive apparatus of claim 13 wherein the conductive trace does not overlie the capping layer top portion.
Claim 17
Dependent Claim
25 words
The electrically conductive apparatus of claim 13 wherein the electrically non-conducting substrate comprises a silicon bulk substrate having a coating layer of an insulating material.
Claim 18
Dependent Claim
107 words
An assembly formed on a semiconductor substrate, comprising: a pillar generally projecting away from the substrate, the pillar having a top surface and having at least one side surface extending to the substrate; a layer of a first electrically conductive material over the top surface, the first conductive material layer over the top surface not extending to the substrate proximate the pillar; and a conductive member formed of a second electrically conductive material electrically coupling the first conductive material to a second location, the second electrically conductive material physically contacting the first electrically conductive material, and wherein the conductive member does not overlie the pillar top surface.
Claim 19
Dependent Claim
107 words
An assembly formed on a semiconductor substrate, comprising: a pillar generally projecting away from the substrate, the pillar having a top surface and having at least one side surface extending to the substrate; a layer of a first electrically conductive material over the top surface, the first conductive material layer over the top surface not extending to the substrate proximate the pillar; and a conductive member formed of a second electrically conductive material electrically coupling the first conductive material to a second location, the second electrically conductive material physically contacting the first electrically conductive material, and wherein the conductive member does not overlie the pillar top surface.
Claim 20
Dependent Claim
106 words
An assembly formed on a semi-conductor substrate, comprising: a pillar generally projecting away from the substrate, the pillar having a top surface and having at least one side surface extending to the substrate, the pillar comprising a semiconductive material coated with an insulating dielectric material; a layer of a first electrically conductive material over the top surface, the first conductive material layer over the top surface not extending to the substrate proximate the pillar; and a conductive member formed of a second electrically conductive material electrically coupling the first conductive material to a second location, wherein the conductive member does not overlie the pillar top surface.
Claim 21
Dependent Claim
106 words
An assembly formed on a semi-conductor substrate, comprising: a pillar generally projecting away from the substrate, the pillar having a top surface and having at least one side surface extending to the substrate, the pillar comprising a semiconductive material coated with an insulating dielectric material; a layer of a first electrically conductive material over the top surface, the first conductive material layer over the top surface not extending to the substrate proximate the pillar; and a conductive member formed of a second electrically conductive material electrically coupling the first conductive material to a second location, wherein the conductive member does not overlie the pillar top surface.
Claim 22
Dependent Claim
105 words
An assembly formed on a semi-conductor substrate, comprising: a pillar generally projecting away from the substrate, the pillar having a top surface and having at least one side surface extending to the substrate; a layer of a first electrically conductive material over the top surface, the first conductive material layer over the top surface not extending to the substrate proximate the pillar; and a conductive member formed of a second electrically conductive material electrically coupling the first conductive material to a second location, wherein the conductive member does not overlie the pillar top surface, the second conductive material being different from the first conductive material.
Claim 23
Dependent Claim
105 words
An assembly formed on a semi-conductor substrate, comprising: a pillar generally projecting away from the substrate, the pillar having a top surface and having at least one side surface extending to the substrate; a layer of a first electrically conductive material over the top surface, the first conductive material layer over the top surface not extending to the substrate proximate the pillar; and a conductive member formed of a second electrically conductive material electrically coupling the first conductive material to a second location, wherein the conductive member does not overlie the pillar top surface, the second conductive material being different from the first conductive material.
Claim 24
Dependent Claim
118 words
An assembly formed on a semi-conductor substrate, comprising: a pillar generally projecting away from the substrate, the pillar having a top surface and having at least one side surface extending to the substrate; a layer of a first electrically conductive material over the top surface, the first conductive material layer over the top surface not extending to the substrate proximate the pillar; a conductive member formed of a second electrically conductive material electrically coupling the first conductive material to a second location, wherein the conductive member does not overlie the pillar top surface; and wherein the pillar comprises semiconductive material coated with an insulating dielectric material, and the second conductive material is different from the first conductive material.
Claim 25
Dependent Claim
118 words
An assembly formed on a semi-conductor substrate, comprising: a pillar generally projecting away from the substrate, the pillar having a top surface and having at least one side surface extending to the substrate; a layer of a first electrically conductive material over the top surface, the first conductive material layer over the top surface not extending to the substrate proximate the pillar; a conductive member formed of a second electrically conductive material electrically coupling the first conductive material to a second location, wherein the conductive member does not overlie the pillar top surface; and wherein the pillar comprises semiconductive material coated with an insulating dielectric material, and the second conductive material is different from the first conductive material.
Claim 26
Dependent Claim
106 words
An assembly formed on a semiconductor substrate, comprising: a pillar generally projecting away from the substrate, the pillar having an outer surface, the outer surface having a first portion proximate the substrate and a second portion relatively removed from the substrate; a layer of a first conductive material over the second portion of the pillar but not over the first portion of the pillar; and an electrical interconnect of a second conductive material provided between the first conductive material layer and a second location, the second conductive material physically contacting the first conductive material and wherein the electrical interconnect does not overlie the pillar top surface.
Claim 27
Dependent Claim
106 words
An assembly formed on a semiconductor substrate, comprising: a pillar generally projecting away from the substrate, the pillar having an outer surface, the outer surface having a first portion proximate the substrate and a second portion relatively removed from the substrate; a layer of a first conductive material over the second portion of the pillar but not over the first portion of the pillar; and an electrical interconnect of a second conductive material provided between the first conductive material layer and a second location, the second conductive material physically contacting the first conductive material and wherein the electrical interconnect does not overlie the pillar top surface.
Claim 28
Dependent Claim
107 words
An assembly formed on a semi-conductor substrate, comprising: a pillar generally projecting away from the substrate, the pillar having an outer surface, the outer surface having a first portion proximate the substrate and a second portion relatively removed from the substrate, the pillar comprising a semiconductive material coated with an insulating dielectric material; a layer of a first conductive material over the second portion of the pillar but not over the first portion of the pillar; and an electrical interconnect of a second conductive material provided between the first conductive material layer and a second location wherein the electrical interconnect does not overlie the pillar top surface.
Claim 29
Dependent Claim
107 words
An assembly formed on a semi-conductor substrate, comprising: a pillar generally projecting away from the substrate, the pillar having an outer surface, the outer surface having a first portion proximate the substrate and a second portion relatively removed from the substrate, the pillar comprising a semiconductive material coated with an insulating dielectric material; a layer of a first conductive material over the second portion of the pillar but not over the first portion of the pillar; and an electrical interconnect of a second conductive material provided between the first conductive material layer and a second location wherein the electrical interconnect does not overlie the pillar top surface.
Claim 30
Dependent Claim
106 words
An assembly formed on a semi-conductor substrate, comprising: a pillar generally projecting away from the substrate, the pillar having an outer surface, the outer surface having a first portion proximate the substrate and a second portion relatively removed from the substrate; a layer of a first conductive material over the second portion of the pillar but not over the first portion of the pillar; and an electrical interconnect of a second conductive material provided between the first conductive material layer and a second location, wherein the electrical interconnect does not overlie the pillar top surface, the second conductive material being different from the first conductive material.
Claim 31
Dependent Claim
106 words
An assembly formed on a semi-conductor substrate, comprising: a pillar generally projecting away from the substrate, the pillar having an outer surface, the outer surface having a first portion proximate the substrate and a second portion relatively removed from the substrate; a layer of a first conductive material over the second portion of the pillar but not over the first portion of the pillar; and an electrical interconnect of a second conductive material provided between the first conductive material layer and a second location, wherein the electrical interconnect does not overlie the pillar top surface, the second conductive material being different from the first conductive material.
Claim 32
Dependent Claim
120 words
An assembly formed on a semi-conductor substrate, comprising: a pillar generally projecting away from the substrate, the pillar having an outer surface, the outer surface having a first portion proximate the substrate and a second portion relatively removed from the substrate; a layer of a first conductive material over the second portion of the pillar but not over the first portion of the pillar; and an electrical interconnect of a second conductive material provided between the first conductive material layer and a second location, wherein the electrical interconnect does not overlie the pillar top surface; and wherein the pillar comprises semiconductive material coated with an insulating dielectric material, and the second conductive material is different from the first conductive material.
Claim 33
Dependent Claim
120 words
An assembly formed on a semi-conductor substrate, comprising: a pillar generally projecting away from the substrate, the pillar having an outer surface, the outer surface having a first portion proximate the substrate and a second portion relatively removed from the substrate; a layer of a first conductive material over the second portion of the pillar but not over the first portion of the pillar; and an electrical interconnect of a second conductive material provided between the first conductive material layer and a second location, wherein the electrical interconnect does not overlie the pillar top surface; and wherein the pillar comprises semiconductive material coated with an insulating dielectric material, and the second conductive material is different from the first conductive material.
Claim 34
Dependent Claim
113 words
An assembly formed on a semiconductor substrate, comprising: a base surface over the substrate and an adjacent elevated surface over the substrate, the elevated surface being spaced from the base surface by a first distance thereby defining a step having a step wall; a layer of a first electrically conductive material over the elevated surface, the first conductive material layer being over the elevated surface and a portion of the step wall and not extending to the base surface proximate the step wall; a conductive member formed of a second electrically conductive material electrically coupling the first conductive material to a second location, wherein the conductive member does not overlie the elevated surface.
Claim 35
Dependent Claim
113 words
An assembly formed on a semiconductor substrate, comprising: a base surface over the substrate and an adjacent elevated surface over the substrate, the elevated surface being spaced from the base surface by a first distance thereby defining a step having a step wall; a layer of a first electrically conductive material over the elevated surface, the first conductive material layer being over the elevated surface and a portion of the step wall and not extending to the base surface proximate the step wall; a conductive member formed of a second electrically conductive material electrically coupling the first conductive material to a second location, wherein the conductive member does not overlie the elevated surface.
Claim 36
Dependent Claim
17 words
The assembly of claim 24 wherein the second conductive material is different from the first conductive material.
Claim 37
Dependent Claim
123 words
An assembly formed on a semiconductor substrate, comprising: a base surface over the substrate and an adjacent elevated surface over the substrate, the elevated surface being spaced from the base surface by a first distance thereby defining a step having a step wall, the step wall having a first portion proximate the base surface and a second portion relatively removed from the base surface; a layer of a first conductive material over the elevated surface and the second portion of the step wall but not over the first portion of the step wall; and an electrical interconnect of a second conductive material provided between the first conductive material layer and a second location, wherein the electrical interconnect does not overlie the elevated surface.
Claim 38
Dependent Claim
123 words
An assembly formed on a semiconductor substrate, comprising: a base surface over the substrate and an adjacent elevated surface over the substrate, the elevated surface being spaced from the base surface by a first distance thereby defining a step having a step wall, the step wall having a first portion proximate the base surface and a second portion relatively removed from the base surface; a layer of a first conductive material over the elevated surface and the second portion of the step wall but not over the first portion of the step wall; and an electrical interconnect of a second conductive material provided between the first conductive material layer and a second location, wherein the electrical interconnect does not overlie the elevated surface.
Claim 39
Dependent Claim
17 words
The assembly of claim 26 wherein the second conductive material is different from the first conductive material.
Claim 40
Dependent Claim
99 words
An assembly formed on a semiconductor substrate, comprising: a base surface over the substrate and an adjacent step wall, the step wall having a first portion proximate the base surface and a second portion relatively removed from the base surface; a layer of a first conductive material over the second portion of the step wall but not over the first portion of the step wall; and an electrical interconnect of a second conductive material provided between the first conductive material layer and a second location, wherein the electrical interconnect does not overlie the second portion of the step wall.
Claim 41
Dependent Claim
99 words
An assembly formed on a semiconductor substrate, comprising: a base surface over the substrate and an adjacent step wall, the step wall having a first portion proximate the base surface and a second portion relatively removed from the base surface; a layer of a first conductive material over the second portion of the step wall but not over the first portion of the step wall; and an electrical interconnect of a second conductive material provided between the first conductive material layer and a second location, wherein the electrical interconnect does not overlie the second portion of the step wall.
Claim 42
Dependent Claim
17 words
The assembly of claim 28 wherein the second conductive material is different from the first conductive material.
Claim 43
Dependent Claim
101 words
An assembly formed on a semiconductor substrate, comprising: a semiconductive material pillar generally projecting away from the substrate, the pillar having a top surface and having at least one side surface extending to the substrate; a layer of a first electrically conductive material over and against the top surface, the first conductive material layer over and against the top surface not extending to the substrate proximate the pillar; and a conductive member formed of a second electrically conductive material electrically coupling the first conductive material to a second location, the second electrically conductive material physically contacting the first electrically conductive material.
Claim 44
Dependent Claim
101 words
An assembly formed on a semiconductor substrate, comprising: a semiconductive material pillar generally projecting away from the substrate, the pillar having a top surface and having at least one side surface extending to the substrate; a layer of a first electrically conductive material over and against the top surface, the first conductive material layer over and against the top surface not extending to the substrate proximate the pillar; and a conductive member formed of a second electrically conductive material electrically coupling the first conductive material to a second location, the second electrically conductive material physically contacting the first electrically conductive material.
Claim 45
Dependent Claim
98 words
An assembly formed on a semiconductor substrate, comprising: a semiconductive material pillar generally projecting away from the substrate, the pillar having an outer surface, the outer surface having a first portion proximate the substrate and a second portion relatively removed from the substrate; a layer of a first conductive material over and against the second portion of the pillar but not over the first portion of the pillar; and an electrical interconnect of a second conductive material provided between the first conductive material layer and a second location, the second conductive material physically contacting the first conductive material.
Claim 46
Dependent Claim
98 words
An assembly formed on a semiconductor substrate, comprising: a semiconductive material pillar generally projecting away from the substrate, the pillar having an outer surface, the outer surface having a first portion proximate the substrate and a second portion relatively removed from the substrate; a layer of a first conductive material over and against the second portion of the pillar but not over the first portion of the pillar; and an electrical interconnect of a second conductive material provided between the first conductive material layer and a second location, the second conductive material physically contacting the first conductive material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-02-08 | 2002-08-10 | 2003-02-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-02-08 | 2006-08-10 | 2007-02-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-02-08 | 2010-08-10 | 2011-02-09 | $7700.00 | Window Closed / Lapsed |