Patent US2258859A successfully refreshed from Google Patents.
US5014161A
Expired / Lapsed
US
⏱️ 0.0 years remaining
System for detachably mounting semiconductors on conductor substrate
Assignee: Hewlett Packard Development Co LP
•
Filing: 1990-02-07
•
Granted: 1991-05-07
•
Expires: 2010-02-07
Abstract
Abstract A semiconductor mounting system is provided for the detachable surface mounting of one or more semiconductor dies on a conductor substrate, such as a ceramic substrate or printed circuit board. The system employs a resilient, anisotropic conductor pad which is interposed between the semiconductor die and the conductor substrate. The conductor pad is capable of conducting electric signals in one direction only, and insulates in the other two orthogonal directions. Thus, by compressing the semiconductor die and resilient conductor pad against the conductor substrate, electrical contact is established between contacts on the semiconductor die and corresponding contacts on the conductor substrate. In the preferred embodiment, additional conductor pads are placed over the semiconductor dies, and a heat sink placed over the second conductor pads. In this way, the semiconductor dies are mounted in a resilient structure for protection, while heat dissipation is enhanced by the metallic elements in the second conductor pad.
Inventors
- 👤 James C. K. Lee
- 👤 Gene M. Amdahl
- 👤 Richard Beck
- 👤 Chune Lee
- 👤 Edward Hu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 04:26
CPC Classifications
H; H01; H01R; H01R13/00; H01R13/02; H01R13/22; H01R13/24; H01R13/2407; H01R13/2414; H01R43/00; H01R43/007; H01R43/16
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
171 words
A semiconductor die mounting system comprising: a) a conductor substrate having an array of substrate contacts on a substrate face thereof; b) at least one semiconductor die having first and second opposed die faces and a plurality of die contacts on the first die face thereof disposed in alignment with corresponding substrate contacts on the conductor substrate; c) a conductor pad disposed between the substrate and the die having first and second opposed pad surfaces in contact with the substrate and first die faces, respectively, the conductor pad including a plurality of mutually electrically isolated electrically conductive elements extending between the first and second surfaces thereof in the direction of alignment between the substrate and die contacts so as to provide electrical conduction between the pad surfaces, adjacent conductive elements being spaced apart by less than the minimum width of the contacts; and d) means for holding the semiconductor die and the conductor substrate in contact with the conductor pad so that the corresponding die and substrate contacts are in alignment.
Claim 2
Dependent Claim
171 words
A semiconductor die mounting system comprising: a) a conductor substrate having an array of substrate contacts on a substrate face thereof; b) at least one semiconductor die having first and second opposed die faces and a plurality of die contacts on the first die face thereof disposed in alignment with corresponding substrate contacts on the conductor substrate; c) a conductor pad disposed between the substrate and the die having first and second opposed pad surfaces in contact with the substrate and first die faces, respectively, the conductor pad including a plurality of mutually electrically isolated electrically conductive elements extending between the first and second surfaces thereof in the direction of alignment between the substrate and die contacts so as to provide electrical conduction between the pad surfaces, adjacent conductive elements being spaced apart by less than the minimum width of the contacts; and d) means for holding the semiconductor die and the conductor substrate in contact with the conductor pad so that the corresponding die and substrate contacts are in alignment.
Claim 3
Dependent Claim
53 words
A semiconductor die mounting system as in claim 1 wherein the means for holding the semiconductor die and the conductor pad includes a nest plate mounted over the conductor substrate for aligning the contacts on the conductor substrate with the contacts on the semiconductor die and a cover mounted on the nest plate.
Claim 4
Dependent Claim
86 words
A semiconductor die mounting system as in claim 2 wherein: a) the cover includes a cover face; and b) the semiconductor mounting system further includes a second conductor pad disposed between the semiconductor die and the cover, the second conductor pad having first and second opposed surfaces in contact with a cover face and the second die face, respectively, and including a plurality of thermally conductive elements extending between the first and second surfaces so as to provide thermal conduction between the die and the cover.
Claim 5
Dependent Claim
41 words
A semiconductor die mounting system as in claim 3 further comprising means for sealing the periphery of the cover to the periphery of the conductor substrate so that the semiconductor die and the conductor pads are compressed against the conductor substrate.
Claim 6
Dependent Claim
18 words
A semiconductor die mounting system as in claim 3 wherein the first-mentioned and second conductor pads are resilient.
Claim 7
Dependent Claim
16 words
A semiconductor die mounting system as in claim 2 wherein the cover is a heat sink.
Claim 8
Dependent Claim
15 words
A semiconductor die mounting system as in claim 1 wherein the conductor pad is resilient.
Claim 9
Dependent Claim
17 words
A semiconductor die mounting system as in claim 1 wherein the conductor substrate is a ceramic substrate.
Claim 10
Dependent Claim
24 words
A semiconductor die mounting system as in claim 1 wherein the substrate includes a pin grid on a face opposite the array of contacts.
Claim 11
Dependent Claim
19 words
A semiconductor die mounting system as in claim 1 wherein the substrate includes edge connectors formed about its periphery.
Claim 12
Dependent Claim
37 words
A semiconductor die mounting system as in claim 1 wherein the substrate includes a plurality of arrays of contacts formed on the substrate face and wherein a separate conductor pad is mounted on each array of contacts.
Claim 13
Dependent Claim
257 words
A semiconductor die mounting system comprising: a) a conductor substrate having an array of substrate contacts on a substrate face thereof; b) at least one semiconductor die having first and second opposed die faces and a plurality of die contacts on the first die face thereof disposed in alignment with corresponding substrate contacts on the conductor substrate; c) a first conductor pad disposed between the substrate and the die having first and second opposed pad surfaces in contact with the substrate and first die faces, respectively, the conductor pad including a plurality of mutually electrically isolated electrically conductive elements extending between the first and second surfaces thereof in the direction of alignment between the substrate and die contacts so as to provide electrical conduction between the pad surfaces, adjacent conductive elements being spaced apart by less than the minimum width of the contacts; d) means for holding the semiconductor die and the conductor substrate in contact with the first conductor pad so that the corresponding die and substrate contacts are in alignment; e) a cover mounted on the means for holding the semiconductor die and the conductor substrate, the cover including a cover face; and f) a second conductor pad disposed between the semiconductor die and the cover, the second conductor pad having first and second opposed surfaces in contact with a cover face and the second die face, respectively, and including a plurality of thermally conductive elements extending between the first and second surfaces so as to provide thermal conduction between the die and the cover.
Claim 14
Dependent Claim
257 words
A semiconductor die mounting system comprising: a) a conductor substrate having an array of substrate contacts on a substrate face thereof; b) at least one semiconductor die having first and second opposed die faces and a plurality of die contacts on the first die face thereof disposed in alignment with corresponding substrate contacts on the conductor substrate; c) a first conductor pad disposed between the substrate and the die having first and second opposed pad surfaces in contact with the substrate and first die faces, respectively, the conductor pad including a plurality of mutually electrically isolated electrically conductive elements extending between the first and second surfaces thereof in the direction of alignment between the substrate and die contacts so as to provide electrical conduction between the pad surfaces, adjacent conductive elements being spaced apart by less than the minimum width of the contacts; d) means for holding the semiconductor die and the conductor substrate in contact with the first conductor pad so that the corresponding die and substrate contacts are in alignment; e) a cover mounted on the means for holding the semiconductor die and the conductor substrate, the cover including a cover face; and f) a second conductor pad disposed between the semiconductor die and the cover, the second conductor pad having first and second opposed surfaces in contact with a cover face and the second die face, respectively, and including a plurality of thermally conductive elements extending between the first and second surfaces so as to provide thermal conduction between the die and the cover.
Claim 15
Dependent Claim
45 words
A semiconductor die mounting system as in claim 12 wherein the means for holding the semiconductor die and the conductor pad includes a nest plate mounted over the conductor substrate for aligning the contacts on the conductor substrate with the contacts on the semiconductor die.
Claim 16
Dependent Claim
41 words
A semiconductor die mounting system as in claim 12 further comprising means for sealing the periphery of the cover to the periphery of the conductor substrate so that the semiconductor die and the conductor pads are compressed against the conductor substrate.
Claim 17
Dependent Claim
18 words
A semiconductor die mounting system as in claim 12 wherein the first and second conductor pads are resilient.
Claim 18
Dependent Claim
16 words
A semiconductor die mounting system as in claim 12 wherein the cover is a heat sink.
Claim 19
Dependent Claim
242 words
A semiconductor die mounting system comprising: a) a conductor substrate having an array of substrate contacts on a substrate face thereof; b) at least one semiconductor die having first and second opposed die faces and a plurality of die contacts on the first die face thereof disposed in alignment with corresponding substrate contacts on the conductor substrate; c) a first conductor pad disposed between the substrate and the die having first and second opposed pad surfaces in contact with the substrate and first die faces, respectively, the conductor pad including a plurality of mutually electrically isolated electrically conductive elements extending between the first and second surfaces thereof in the direction of alignment between the substrate and die contacts so as to provide electrical conduction between the pad surfaces, adjacent conductive elements being spaced apart by less than the minimum width of the contacts; d) a nest plate mounted over the conductor substrate for aligning the contacts on the conductor substrate with the contacts on the semiconductor die; e) a cover having a cover face mounted on the nest plate; and f) a second conductor pad disposed between the semiconductor die and the cover, the second conductor pad having first and second opposed surfaces in contact with a cover face and the second die face, respectively, and including a plurality of thermally conductive elements extending between the first and second surfaces so as to provide thermal conduction between the die and the cover.
Claim 20
Dependent Claim
242 words
A semiconductor die mounting system comprising: a) a conductor substrate having an array of substrate contacts on a substrate face thereof; b) at least one semiconductor die having first and second opposed die faces and a plurality of die contacts on the first die face thereof disposed in alignment with corresponding substrate contacts on the conductor substrate; c) a first conductor pad disposed between the substrate and the die having first and second opposed pad surfaces in contact with the substrate and first die faces, respectively, the conductor pad including a plurality of mutually electrically isolated electrically conductive elements extending between the first and second surfaces thereof in the direction of alignment between the substrate and die contacts so as to provide electrical conduction between the pad surfaces, adjacent conductive elements being spaced apart by less than the minimum width of the contacts; d) a nest plate mounted over the conductor substrate for aligning the contacts on the conductor substrate with the contacts on the semiconductor die; e) a cover having a cover face mounted on the nest plate; and f) a second conductor pad disposed between the semiconductor die and the cover, the second conductor pad having first and second opposed surfaces in contact with a cover face and the second die face, respectively, and including a plurality of thermally conductive elements extending between the first and second surfaces so as to provide thermal conduction between the die and the cover.
Claim 21
Dependent Claim
41 words
A semiconductor die mounting system as in claim 17 further comprising means for sealing the periphery of the cover to the periphery of the conductor substrate so that the semiconductor die and the conductor pads are compressed against the conductor substrate.
Claim 22
Dependent Claim
18 words
A semiconductor die mounting system as in claim 17 wherein the first and second conductor pads are resilient.
Claim 23
Dependent Claim
16 words
A semiconductor die mounting system as in claim 17 wherein the cover is a heat sink.
References Cited (Backward Citations)
US3605062A
Cited
US3862790A
Cited
US3982320A
Cited
US4003621A
Cited
US4295700A
Cited
US4330165A
Cited
US4520562A
Cited
US4441119A
Cited
US4449774A
Cited
JPS57166051A
Cited
US4506938A
Cited
WO1985000467A1
Cited
US4597617A
Cited
US4667219A
Cited
JPS60263447A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-05-06 | 1994-11-05 | 1995-05-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-05-06 | 1998-11-05 | 1999-05-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-05-06 | 2002-11-05 | 2003-05-07 | $7700.00 | Window Closed / Lapsed |