US5239260A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor probe and alignment system
Assignee: Hewlett Packard Development Co LP
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Filing: 1991-06-28
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Granted: 1993-08-24
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Expires: 2011-06-28
Abstract
Abstract A semiconductor probe and alignment system are disclosed. The semiconductor probe includes a silicon-based substrate and membrane on which a plurality of pyramid shaped contactors are formed. Each of the contactors includes a metalized tip for contacting bonding pads on a semiconductor die. The area of the probe surrounding each contactor is thinned to form a membrane to provide flexibility and thus compliance to assure contact between each contactor and its respective bonding pad. In the alignment system, a guide wall formed from a photo-imageable material is created around at least a portion of each bonding pad to provide alignment for guiding the contactors on the probe onto the bonding pads.
Inventors
- 👤 David C. Widder
- 👤 Diethelm G. Ringleb
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 15:47
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07307; G01R1/0735
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
92 words
A semiconductor probe alignment system comprising: a semiconductor die having bonding pads thereon and a guide wall adjacent said bonding pads; and a probe mounted on a suitable probe card, said probe having a plurality of pyramid shaped contactors extending from a surface thereof, said contactors corresponding to the bonding pads on said die and being small enough and shaped such that said contactors interact with said guide wall on said die to align the contactors with the bonding pads and move past the guide wall into contact with the bonding pads.
Claim 2
Dependent Claim
92 words
A semiconductor probe alignment system comprising: a semiconductor die having bonding pads thereon and a guide wall adjacent said bonding pads; and a probe mounted on a suitable probe card, said probe having a plurality of pyramid shaped contactors extending from a surface thereof, said contactors corresponding to the bonding pads on said die and being small enough and shaped such that said contactors interact with said guide wall on said die to align the contactors with the bonding pads and move past the guide wall into contact with the bonding pads.
Claim 3
Dependent Claim
22 words
A semiconductor probe alignment system according to claim 1 wherein said guide wall surrounds at least a portion of each bonding pad.
Claim 4
Dependent Claim
24 words
A semiconductor probe alignment system according to claim 1 wherein said guide wall is formed only along the inner side of each bonding pad.
Claim 5
Dependent Claim
19 words
A semiconductor probe alignment system according to claim 1 wherein said guide wall is formed from a photo-imageable material.
Claim 6
Dependent Claim
18 words
A semiconductor probe alignment system according to claim 4 wherein said guide wall is formed from a polyimide.
References Cited (Backward Citations)
US3568136A
Cited
US4103228A
Cited
US4426657A
Cited
US4585991A
Cited
US4707655A
Cited
US4622576A
Cited
US4862076A
Cited
US5072116A
Cited
US5020219A
Cited
US4921810A
Cited
US4922192A
Cited
US5091694A
Cited
US4963225A
Cited
US5126662A
Cited
US5015946A
Cited
US5055776A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-08-23 | 1997-02-22 | 1997-08-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-08-23 | 2001-02-22 | 2001-08-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-08-23 | 2005-02-22 | 2005-08-24 | $7700.00 | Window Closed / Lapsed |