US5796746A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Device and method for testing integrated circuit dice in an integrated circuit module
Assignee: Micron Technology Inc
•
Filing: 1996-09-19
•
Granted: 1998-08-18
•
Expires: 2016-09-19
Abstract
Abstract An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable pads to one of the MCM's reference voltage pins. By applying a supply voltage to the test mode enable pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a reference voltage applied to the test mode enable pads through the reference voltage pins and the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging. A method for performing such testing once the test mode has been initiated and for repairing any failing elements found during testing, includes providing test signals to the dice, receiving response signals from the dice, evaluating the response signals to identify any failing elements in the dice, programming the failing elements addresses into anti-fuses in the dice with a programming voltage, confirming that the addresses are programmed by determining the resistance of the anti-fuses, re-testing the dice, receiving response signals from the re-tested dice, and evaluating the response signals to confirm all repairs.
Inventors
- 👤 Warren M. Farnworth
- 👤 James M. Wark
- 👤 Eric S. Nelson
- 👤 Kevin G. Duesman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 15:50
CPC Classifications
G; G11; G11C; G11C29/00; H; H10; H10P; H10P74/00; H10P74/23; H10P74/232; G11C29/04; G11C29/08; G11C29/12; G11C29/46; G11C29/70; G11C29/78; G11C29/785; G11C29/80; G11C29/808; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2884; H04; H04J; H04J2203/00; H04J2203/0001; H04J2203/0062
Claims Analysis
Total Claims: 127
Claim 1
Independent Claim
127 words
An apparatus for switching first and second voltages to a function circuit in an integrated circuit die having a bond pad, the die being provided in an integrated circuit module having a module terminal for receiving the first voltage from circuitry external to the module, the apparatus comprising: a switching circuit connected with the bond pad between the module terminal and the function circuit for selectively isolating the function circuit from the module terminal and for otherwise conducting the first voltage to the function circuit; and an impedance circuit for conducting the second voltage to the function circuit when the function circuit is isolated from the module terminal and for otherwise supporting a voltage differential between the first voltage at the function circuit and the second voltage.
Claim 2
Independent Claim
127 words
An apparatus for switching first and second voltages to a function circuit in an integrated circuit die having a bond pad, the die being provided in an integrated circuit module having a module terminal for receiving the first voltage from circuitry external to the module, the apparatus comprising: a switching circuit connected with the bond pad between the module terminal and the function circuit for selectively isolating the function circuit from the module terminal and for otherwise conducting the first voltage to the function circuit; and an impedance circuit for conducting the second voltage to the function circuit when the function circuit is isolated from the module terminal and for otherwise supporting a voltage differential between the first voltage at the function circuit and the second voltage.
Claim 3
Dependent Claim
21 words
The apparatus of claim 1 wherein the first voltage is a supply voltage and the second voltage is a reference voltage.
Claim 4
Dependent Claim
19 words
The apparatus of claim 1 wherein the switching circuit comprises a programmable circuit for programmably isolating the function circuit.
Claim 5
Dependent Claim
25 words
The apparatus of claim 3 wherein the programmable circuit comprises a programmable element selected from a group comprising a metal fuse and a polysilicon fuse.
Claim 6
Dependent Claim
25 words
The apparatus of claim 4 wherein the programmable element is interposed between the bond pad and one of the function circuit and the module terminal.
Claim 7
Dependent Claim
25 words
The apparatus of claim 1 wherein the switching circuit comprises a switchable element selected from a group comprising an NMOS transistor and a PMOS transistor.
Claim 8
Dependent Claim
25 words
The apparatus of claim 1 wherein the switching circuit is disposed in the die and is connected between the bond pad and the function circuit.
Claim 9
Dependent Claim
37 words
The apparatus of claim 1 wherein the module includes a substrate to which the die is attached, wherein the switching circuit is disposed in the substrate and is connected between the module terminal and the bond pad.
Claim 10
Dependent Claim
26 words
The apparatus of claim 1 wherein the impedance circuit comprises a resistance circuit selected from a group comprising a resistor, a MOS transistor, and an anti-fuse.
Claim 11
Dependent Claim
25 words
The apparatus of claim 1 wherein the impedance circuit is disposed in the die and is connected to the bond pad and the function circuit.
Claim 12
Dependent Claim
33 words
The apparatus of claim 1 wherein the module includes a substrate to which the die is attached, wherein the impedance circuit is disposed in the substrate and is connected to the bond pad.
Claim 13
Dependent Claim
38 words
The apparatus of claim 1 wherein the module also has a voltage terminal for receiving the second voltage from circuitry external to the module, wherein the impedance circuit is connected between the voltage terminal and the bond pad.
Claim 14
Dependent Claim
31 words
The apparatus of claim 1 wherein the die includes a supply circuit for providing the second voltage, wherein the impedance circuit is coupled between the supply circuit and the function circuit.
Claim 15
Dependent Claim
131 words
An integrated circuit die comprising: a die bond pad for receiving a test initiating signal from circuitry external to the die; a function circuit responsive to the test initiating signal by entering a test mode and responsive to an operational signal by entering an operational mode; a switching circuit connected between the die bond pad and the function circuit for selectively isolating the function circuit from the die bond pad and for otherwise conducting the test initiating signal to the function circuit; and an impedance circuit connected to the function circuit for conducting the operational signal to the function circuit when the function circuit is isolated from the die bond pad and for otherwise supporting a voltage differential between the test initiating signal at the function circuit and the operational signal.
Claim 16
Dependent Claim
131 words
An integrated circuit die comprising: a die bond pad for receiving a test initiating signal from circuitry external to the die; a function circuit responsive to the test initiating signal by entering a test mode and responsive to an operational signal by entering an operational mode; a switching circuit connected between the die bond pad and the function circuit for selectively isolating the function circuit from the die bond pad and for otherwise conducting the test initiating signal to the function circuit; and an impedance circuit connected to the function circuit for conducting the operational signal to the function circuit when the function circuit is isolated from the die bond pad and for otherwise supporting a voltage differential between the test initiating signal at the function circuit and the operational signal.
Claim 17
Dependent Claim
19 words
The integrated circuit die of claim 14 wherein the die bond pad comprises an output enable die bond pad.
Claim 18
Dependent Claim
16 words
The integrated circuit die of claim 14 wherein the test initiating signal comprises a supply voltage.
Claim 19
Dependent Claim
15 words
The integrated circuit die of claim 14 wherein the function circuit includes an input buffer.
Claim 20
Dependent Claim
15 words
The integrated circuit die of claim 14 wherein the operational signal comprises a reference voltage.
Claim 21
Dependent Claim
22 words
The integrated circuit die of claim 14, further comprising a supply circuit coupled to the impedance circuit for providing the operational signal.
Claim 22
Dependent Claim
40 words
The integrated circuit die of claim 14, further comprising a signal bond pad for receiving the operational signal from circuitry external to the die, the signal bond pad being coupled to the impedance circuit for providing the operational signal thereto.
Claim 23
Dependent Claim
168 words
An integrated circuit module comprising: first and second terminals for receiving respective first and second voltages from circuitry external to the module; a plurality of integrated circuit dice each including: a bond pad; and a function circuit coupled to the bond pad and adapted to be responsive to the first voltage by entering a first mode and to be responsive to the second voltage by entering a second mode, the second mode being different than the first mode; a switching apparatus connected between the first terminal and each die bond pad for selectively isolating each function circuit from the first terminal and for otherwise conducting the first voltage to each function circuit; and an impedance apparatus connected between the second terminal and each die bond pad for conducting the second voltage to each function circuit when each function circuit is isolated from the first terminal and for otherwise supporting a voltage differential between the first voltage at each function circuit and the second voltage at the second terminal.
Claim 24
Dependent Claim
168 words
An integrated circuit module comprising: first and second terminals for receiving respective first and second voltages from circuitry external to the module; a plurality of integrated circuit dice each including: a bond pad; and a function circuit coupled to the bond pad and adapted to be responsive to the first voltage by entering a first mode and to be responsive to the second voltage by entering a second mode, the second mode being different than the first mode; a switching apparatus connected between the first terminal and each die bond pad for selectively isolating each function circuit from the first terminal and for otherwise conducting the first voltage to each function circuit; and an impedance apparatus connected between the second terminal and each die bond pad for conducting the second voltage to each function circuit when each function circuit is isolated from the first terminal and for otherwise supporting a voltage differential between the first voltage at each function circuit and the second voltage at the second terminal.
Claim 25
Dependent Claim
20 words
The integrated circuit module of claim 21 wherein the first and second terminals each comprise a Multi-Chip Module (MCM) pin.
Claim 26
Dependent Claim
16 words
The integrated circuit module of claim 21 wherein the first terminal comprises a no-connection (N/C) pin.
Claim 27
Dependent Claim
60 words
The integrated circuit module of claim 21 wherein each of the integrated circuit dice is selected from a group comprising a Dynamic Random Access Memory (DRAM) die, a Static Random Access Memory (SRAM) die, a Synchronous Graphics Random Access Memory (SGRAM) die, Read-Only-Memory (ROM) die, a flash memory die, a Rambus RAM die, a processor die, and a logic die.
Claim 28
Dependent Claim
23 words
The integrated circuit module of claim 21 wherein the first mode comprises a test mode, wherein the second mode comprises an operational mode.
Claim 29
Dependent Claim
30 words
The integrated circuit module of claim 21 wherein the switching apparatus comprises a plurality of switching circuits each coupled between the first terminal and one of the die bond pads.
Claim 30
Dependent Claim
27 words
The integrated circuit module of claim 21 wherein the switching apparatus comprises at least one switching circuit selected from a group comprising a fuse and a transistor.
Claim 31
Dependent Claim
30 words
The integrated circuit module of claim 21 wherein the impedance apparatus comprises a plurality of impedance circuits each coupled between the second terminal and one of the die bond pads.
Claim 32
Dependent Claim
28 words
The integrated circuit module of claim 21 wherein the impedance apparatus comprises an impedance circuit selected from a group comprising an anti-fuse, a MOS transistor, and a resistor.
Claim 33
Dependent Claim
190 words
An integrated circuit module substrate for attachment to an integrated circuit die having a test bond pad, the die being of the type to enter a test mode responsive to receiving a test operation signal through its test bond pad and to enter an operational mode responsive to receiving a regular operation signal through its test bond pad, the substrate comprising: a test terminal for receiving the test operation signal from circuitry external to the substrate; an operational terminal for receiving the regular operation signal from circuitry external to the substrate; a switching circuit connectable between the test terminal and the test bond pad for selectively isolating the test bond pad from the test terminal and for otherwise conducting the test operation signal to the test bond pad; and an impedance circuit connectable between the operational terminal and the test bond pad for conducting the regular operation signal to the test bond pad when the test bond pad is isolated from the test terminal and for otherwise supporting a voltage differential between the test operation signal at the test bond pad and the regular operation signal at the operational terminal.
Claim 34
Dependent Claim
190 words
An integrated circuit module substrate for attachment to an integrated circuit die having a test bond pad, the die being of the type to enter a test mode responsive to receiving a test operation signal through its test bond pad and to enter an operational mode responsive to receiving a regular operation signal through its test bond pad, the substrate comprising: a test terminal for receiving the test operation signal from circuitry external to the substrate; an operational terminal for receiving the regular operation signal from circuitry external to the substrate; a switching circuit connectable between the test terminal and the test bond pad for selectively isolating the test bond pad from the test terminal and for otherwise conducting the test operation signal to the test bond pad; and an impedance circuit connectable between the operational terminal and the test bond pad for conducting the regular operation signal to the test bond pad when the test bond pad is isolated from the test terminal and for otherwise supporting a voltage differential between the test operation signal at the test bond pad and the regular operation signal at the operational terminal.
Claim 35
Dependent Claim
21 words
The integrated circuit module substrate of claim 30 wherein the test and operational terminals each comprise a Multi-Chip Module (MCM) pin.
Claim 36
Dependent Claim
17 words
The integrated circuit module substrate of claim 30 wherein the test terminal comprises a no-connection (N/C) pin.
Claim 37
Dependent Claim
181 words
An electronic system comprising an input device, an output device, a memory device, and a processor device coupled to the input, output, and memory devices, at least a portion of one or more of the input, output, memory, and processor devices being provided in an integrated circuit module comprising: a module terminal for receiving a first voltage from circuitry external to the module; a function circuit adapted to be responsive to the first voltage by entering a first mode and to be responsive to a second voltage by entering a second mode different than the first mode; a die bond pad; a switching circuit connected with the die bond pad between the module terminal and the function circuit for selectively isolating the function circuit from the module terminal and for otherwise conducting the first voltage to the function circuit; and an impedance circuit for conducting the second voltage to the function circuit when the function circuit is isolated from the module terminal and for otherwise supporting a voltage differential between the first voltage at the function circuit and the second voltage.
Claim 38
Dependent Claim
181 words
An electronic system comprising an input device, an output device, a memory device, and a processor device coupled to the input, output, and memory devices, at least a portion of one or more of the input, output, memory, and processor devices being provided in an integrated circuit module comprising: a module terminal for receiving a first voltage from circuitry external to the module; a function circuit adapted to be responsive to the first voltage by entering a first mode and to be responsive to a second voltage by entering a second mode different than the first mode; a die bond pad; a switching circuit connected with the die bond pad between the module terminal and the function circuit for selectively isolating the function circuit from the module terminal and for otherwise conducting the first voltage to the function circuit; and an impedance circuit for conducting the second voltage to the function circuit when the function circuit is isolated from the module terminal and for otherwise supporting a voltage differential between the first voltage at the function circuit and the second voltage.
Claim 39
Dependent Claim
19 words
The electronic system of claim 33 wherein the input, output, memory, and processor devices together comprise a computer system.
Claim 40
Dependent Claim
48 words
The electronic system of claim 33 wherein the memory device is selected from a group comprising a Dynamic Random Access Memory (DRAM) device, a Static Random Access Memory (SRAM) device, a Synchronous Graphics Random Access Memory (SGRAM) device, a flash Read-Only-Memory (ROM) device, and a Rambus RAM device.
Claim 41
Dependent Claim
22 words
The electronic system of claim 33, further comprising a supply circuit coupled to the impedance circuit for providing the second voltage thereto.
Claim 42
Dependent Claim
37 words
The electronic system of claim 33, further comprising a voltage terminal for receiving the second voltage from circuitry external to the module, the voltage terminal being coupled to the impedance circuit for providing the second voltage thereto.
Claim 43
Dependent Claim
45 words
The electronic system of claim 33, further comprising: a voltage terminal for receiving the second voltage from circuitry external to the module; and a voltage bond pad coupled to the voltage terminal and the impedance circuit for conducting the second voltage to the impedance circuit.
Claim 44
Dependent Claim
14 words
The electronic system of claim 33 wherein the module comprises a Multi-Chip Module (MCM).
Claim 45
Dependent Claim
37 words
The electronic system of claim 39 wherein the MCM is selected from a group comprising an In-line Memory Module (SIMM), a Random Access Memory (RAM) card, a RAM module, a Read-Only-Memory (ROM) card, and a ROM module.
Claim 46
Dependent Claim
157 words
An integrated circuit module comprising: one or more terminals for receiving first and second voltages from circuitry external to the module; one or more integrated circuit dice each including: one or more function circuits each responsive to the first voltage by entering a first mode and responsive to the second voltage by entering a second mode, the first and second modes being different; and a plurality of bond pads, a first subset of which are coupled to the one or more function circuits and a second subset of which are for receiving the second voltage when the one or more function circuits are in the first mode; and a dedicated conduction circuit coupled between the one or more terminals and each die's first subset bond pads and isolated from each die's second subset bond pads for conducting the first and second voltages to each die's one or more function circuits in the respective first and second modes.
Claim 47
Dependent Claim
157 words
An integrated circuit module comprising: one or more terminals for receiving first and second voltages from circuitry external to the module; one or more integrated circuit dice each including: one or more function circuits each responsive to the first voltage by entering a first mode and responsive to the second voltage by entering a second mode, the first and second modes being different; and a plurality of bond pads, a first subset of which are coupled to the one or more function circuits and a second subset of which are for receiving the second voltage when the one or more function circuits are in the first mode; and a dedicated conduction circuit coupled between the one or more terminals and each die's first subset bond pads and isolated from each die's second subset bond pads for conducting the first and second voltages to each die's one or more function circuits in the respective first and second modes.
Claim 48
Dependent Claim
31 words
The integrated circuit module of claim 41 wherein the one or more terminals comprise a first terminal for receiving the first voltage and a second terminal for receiving the second voltage.
Claim 49
Dependent Claim
16 words
The integrated circuit module of claim 42 wherein the first terminal comprises a no-connection (N/C) terminal.
Claim 50
Dependent Claim
17 words
The integrated circuit module of claim 41 wherein the terminals each comprise a Multi-Chip Module (MCM) pin.
Claim 51
Dependent Claim
67 words
The integrated circuit module of claim 41 wherein the one or more terminals comprise a dedicated terminal for receiving the first and second voltages, the dedicated terminal being isolated from any other terminals on the module, wherein the dedicated conduction circuit comprises a conductor coupling the dedicated terminal to each die's first subset bond pads and isolating the dedicated terminal from each die's second subset bond pads.
Claim 52
Dependent Claim
121 words
The integrated circuit module of claim 41 wherein the one or more terminals comprise a first terminal for receiving the first voltage in the first mode and a second terminal for receiving the second voltage in the first and second modes, wherein the dedicated conduction circuit comprises: a conductor coupling the first terminal to each die's first subset bond pads and isolating the first terminal from each die's second subset bond pads; and an impedance circuit coupling the first and second terminals for supporting a voltage differential in the first mode between the first and second voltages at the respective first and second terminals and for conducting the second voltage to each die's first subset bond pads in the second mode.
Claim 53
Dependent Claim
47 words
The integrated circuit module of claim 46 wherein the first and second terminals are positioned on opposing sides of the module, wherein the first and second terminals are coupled to one another through the impedance circuit and through a via between the opposing sides of the module.
Claim 54
Dependent Claim
98 words
The integrated circuit module of claim 41 wherein the one or more terminals comprise a first terminal for receiving the first voltage in the first mode and a second terminal for receiving the second voltage in the first and second modes, wherein the dedicated conduction circuit comprises: a conductor coupling the first terminal to each die's first subset bond pads and isolating the first terminal from each die's second subset bond pads; and a link coupleable between the first and second terminals for conducting the second voltage to each die's first subset bond pads in the second mode.
Claim 55
Dependent Claim
46 words
The integrated circuit module of claim 48 wherein the first and second terminals are positioned on opposing sides of the module, wherein the first and second terminals are coupleable to one another through the link and through a via between the opposing sides of the module.
Claim 56
Dependent Claim
23 words
The integrated circuit module of claim 48 wherein the link is selected from a group comprising a surface mount resistor and a jumper.
Claim 57
Dependent Claim
73 words
An integrated circuit module substrate for attachment to one or more integrated circuit dice each having a plurality of test bond pads, the substrate comprising: one or more terminals for receiving first and second voltages from circuitry external to the substrate; and a dedicated conduction circuit connectable exclusively between the one or more terminals and each die's test bond pads for conducting the first and second voltages to each die's test bond pads.
Claim 58
Dependent Claim
73 words
An integrated circuit module substrate for attachment to one or more integrated circuit dice each having a plurality of test bond pads, the substrate comprising: one or more terminals for receiving first and second voltages from circuitry external to the substrate; and a dedicated conduction circuit connectable exclusively between the one or more terminals and each die's test bond pads for conducting the first and second voltages to each die's test bond pads.
Claim 59
Dependent Claim
18 words
The integrated circuit module substrate of claim 51 wherein one of the terminals comprises a no-connection (N/C) terminal.
Claim 60
Dependent Claim
57 words
The integrated circuit module substrate of claim 51 wherein the one or more terminals comprise a dedicated terminal for receiving the first and second voltages, the dedicated terminal being isolated from any other terminals on the module substrate, wherein the dedicated conduction circuit comprises a conductor for coupling the dedicated terminal to each die's test bond pads.
Claim 61
Dependent Claim
60 words
The integrated circuit module substrate of claim 51 wherein the one or more terminals comprise a first terminal for receiving the first voltage and a second terminal for receiving the second voltage, wherein the dedicated conduction circuit comprises: a conductor coupling the first terminal to each die's test bond pads; and an impedance circuit coupling the first and second terminals.
Claim 62
Dependent Claim
50 words
The integrated circuit module substrate of claim 54 wherein the first and second terminals are positioned on opposing sides of the module substrate, wherein the first and second terminals are coupled to one another through the impedance circuit and through a via between the opposing sides of the module substrate.
Claim 63
Dependent Claim
71 words
The integrated circuit module substrate of claim 51 wherein the one or more terminals comprise a first terminal for receiving the first voltage and a second terminal for receiving the second voltage, wherein the dedicated conduction circuit comprises: a conductor coupling the first terminal to each die's test bond pads; and a link coupleable between the first and second terminals for conducting the second voltage to each die's test bond pads.
Claim 64
Dependent Claim
49 words
The integrated circuit module substrate of claim 56 wherein the first and second terminals are positioned on opposing sides of the module substrate, wherein the first and second terminals are coupleable to one another through the link and through a via between the opposing sides of the module substrate.
Claim 65
Dependent Claim
24 words
The integrated circuit module substrate of claim 56 wherein the link is selected from a group comprising a surface mount resistor and a jumper.
Claim 66
Dependent Claim
192 words
An electronic system comprising an input device, an output device, a memory device, and a processor device coupled to the input, output, and memory devices, at least a portion of one or more of the input, output, memory, and processor devices being provided in an integrated circuit module comprising: one or more terminals for receiving first and second voltages from circuitry external to the module; one or more function circuits each responsive to the first voltage by entering a first mode and responsive to the second voltage by entering a second mode, the first and second modes being different; a plurality of die bond pads, a first subset of which are coupled to the one or more function circuits and a second subset of which are for receiving the second voltage when the one or more function circuits are in the first mode; and a dedicated conduction circuit coupled between the one or more terminals and the first subset die bond pads and isolated from the second subset die bond pads for conducting the first and second voltages to the one or more function circuits in the respective first and second modes.
Claim 67
Dependent Claim
192 words
An electronic system comprising an input device, an output device, a memory device, and a processor device coupled to the input, output, and memory devices, at least a portion of one or more of the input, output, memory, and processor devices being provided in an integrated circuit module comprising: one or more terminals for receiving first and second voltages from circuitry external to the module; one or more function circuits each responsive to the first voltage by entering a first mode and responsive to the second voltage by entering a second mode, the first and second modes being different; a plurality of die bond pads, a first subset of which are coupled to the one or more function circuits and a second subset of which are for receiving the second voltage when the one or more function circuits are in the first mode; and a dedicated conduction circuit coupled between the one or more terminals and the first subset die bond pads and isolated from the second subset die bond pads for conducting the first and second voltages to the one or more function circuits in the respective first and second modes.
Claim 68
Dependent Claim
16 words
The electronic system of claim 59 wherein one of the terminals comprises a no-connection (N/C) terminal.
Claim 69
Dependent Claim
66 words
The electronic system of claim 59 wherein the one or more terminals comprise a dedicated terminal for receiving the first and second voltages, the dedicated terminal being isolated from any other terminals on the module, wherein the dedicated conduction circuit comprises a conductor coupling the dedicated terminal to the first subset die bond pads and isolating the dedicated terminal from the second subset die bond pads.
Claim 70
Dependent Claim
120 words
The electronic system of claim 59 wherein the one or more terminals comprise a first terminal for receiving the first voltage in the first mode and a second terminal for receiving the second voltage in the first and second modes, wherein the dedicated conduction circuit comprises: a conductor coupling the first terminal to the first subset die bond pads and isolating the first terminal from the second subset die bond pads; and an impedance circuit coupling the first and second terminals for supporting a voltage differential in the first mode between the first and second voltages at the respective first and second terminals and for conducting the second voltage to the first subset die bond pads in the second mode.
Claim 71
Dependent Claim
46 words
The electronic system of claim 62 wherein the first and second terminals are positioned on opposing sides of the module, wherein the first and second terminals are coupled to one another through the impedance circuit and through a via between the opposing sides of the module.
Claim 72
Dependent Claim
97 words
The electronic system of claim 59 wherein the one or more terminals comprise a first terminal for receiving the first voltage in the first mode and a second terminal for receiving the second voltage in the first and second modes, wherein the dedicated conduction circuit comprises: a conductor coupling the first terminal to the first subset die bond pads and isolating the first terminal from the second subset die bond pads; and a link coupleable between the first and second terminals for conducting the second voltage to the first subset die bond pads in the second mode.
Claim 73
Dependent Claim
45 words
The electronic system of claim 64 wherein the first and second terminals are positioned on opposing sides of the module, wherein the first and second terminals are coupleable to one another through the link and through a via between the opposing sides of the module.
Claim 74
Dependent Claim
22 words
The electronic system of claim 64 wherein the link is selected from a group comprising a surface mount resistor and a jumper.
Claim 75
Dependent Claim
14 words
The electronic system of claim 59 wherein the module comprises a Multi-Chip Module (MCM).
Claim 76
Dependent Claim
43 words
The electronic system of claim 67 wherein the MCM is selected from a group comprising a Single-In-line Memory Module (SIMM), a Dual In-line Memory Module (DIMM), a Random Access Memory (RAM) card, a RAM module, a Read-Only-Memory (ROM) card, and a ROM module.
Claim 77
Dependent Claim
169 words
An integrated circuit die comprising: a function circuit responsive to a test mode voltage by entering a test mode and responsive to an operational mode voltage by entering an operational mode; a test mode voltage circuit for providing the test mode voltage in response to a test mode enable signal received from circuitry external to the die; a switching circuit connected between the function circuit and the test mode voltage circuit for selectively isolating the function circuit from the test mode voltage circuit and for otherwise conducting the test mode voltage to the function circuit; an operational mode voltage circuit for providing the operational mode voltage; and an impedance circuit connected between the function circuit and the operational mode voltage circuit for conducting the operational mode voltage to the function circuit when the function circuit is isolated from the test mode voltage and for otherwise supporting a voltage differential between the test mode voltage at the function circuit and the operational mode voltage at the operational mode voltage circuit.
Claim 78
Dependent Claim
169 words
An integrated circuit die comprising: a function circuit responsive to a test mode voltage by entering a test mode and responsive to an operational mode voltage by entering an operational mode; a test mode voltage circuit for providing the test mode voltage in response to a test mode enable signal received from circuitry external to the die; a switching circuit connected between the function circuit and the test mode voltage circuit for selectively isolating the function circuit from the test mode voltage circuit and for otherwise conducting the test mode voltage to the function circuit; an operational mode voltage circuit for providing the operational mode voltage; and an impedance circuit connected between the function circuit and the operational mode voltage circuit for conducting the operational mode voltage to the function circuit when the function circuit is isolated from the test mode voltage and for otherwise supporting a voltage differential between the test mode voltage at the function circuit and the operational mode voltage at the operational mode voltage circuit.
Claim 79
Dependent Claim
174 words
An integrated circuit module comprising an integrated circuit die comprising: a function circuit responsive to a test mode voltage by entering a test mode and responsive to an operational mode voltage by entering an operational mode; a test mode voltage circuit for providing the test mode voltage in response to a test mode enable signal received from circuitry external to the die; a switching circuit connected between the function circuit and the test mode voltage circuit for selectively isolating the function circuit from the test mode voltage circuit and for otherwise conducting the test mode voltage to the function circuit; an operational mode voltage circuit for providing the operational mode voltage; and an impedance circuit connected between the function circuit and the operational mode voltage circuit for conducting the operational mode voltage to the function circuit when the function circuit is isolated from the test mode voltage and for otherwise supporting a voltage differential between the test mode voltage at the function circuit and the operational mode voltage at the operational mode voltage circuit.
Claim 80
Dependent Claim
174 words
An integrated circuit module comprising an integrated circuit die comprising: a function circuit responsive to a test mode voltage by entering a test mode and responsive to an operational mode voltage by entering an operational mode; a test mode voltage circuit for providing the test mode voltage in response to a test mode enable signal received from circuitry external to the die; a switching circuit connected between the function circuit and the test mode voltage circuit for selectively isolating the function circuit from the test mode voltage circuit and for otherwise conducting the test mode voltage to the function circuit; an operational mode voltage circuit for providing the operational mode voltage; and an impedance circuit connected between the function circuit and the operational mode voltage circuit for conducting the operational mode voltage to the function circuit when the function circuit is isolated from the test mode voltage and for otherwise supporting a voltage differential between the test mode voltage at the function circuit and the operational mode voltage at the operational mode voltage circuit.
Claim 81
Dependent Claim
218 words
An electronic system comprising an input device, an output device, a memory device, and a processor device coupled to the input, output, and memory devices, at least a portion of one or more of the input, output, memory, and processor devices being provided in an integrated circuit module comprising an integrated circuit die comprising: a function circuit responsive to a test mode voltage by entering a test mode and responsive to an operational mode voltage by entering an operational mode; a test mode voltage circuit for providing the test mode voltage in response to a test mode enable signal received from circuitry external to the die; a switching circuit connected between the function circuit and the test mode voltage circuit for selectively isolating the function circuit from the test mode voltage circuit and for otherwise conducting the test mode voltage to the function circuit; an operational mode voltage circuit for providing the operational mode voltage; and an impedance circuit connected between the function circuit and the operational mode voltage circuit for conducting the operational mode voltage to the function circuit when the function circuit is isolated from the test mode voltage and for otherwise supporting a voltage differential between the test mode voltage at the function circuit and the operational mode voltage at the operational mode voltage circuit.
Claim 82
Dependent Claim
218 words
An electronic system comprising an input device, an output device, a memory device, and a processor device coupled to the input, output, and memory devices, at least a portion of one or more of the input, output, memory, and processor devices being provided in an integrated circuit module comprising an integrated circuit die comprising: a function circuit responsive to a test mode voltage by entering a test mode and responsive to an operational mode voltage by entering an operational mode; a test mode voltage circuit for providing the test mode voltage in response to a test mode enable signal received from circuitry external to the die; a switching circuit connected between the function circuit and the test mode voltage circuit for selectively isolating the function circuit from the test mode voltage circuit and for otherwise conducting the test mode voltage to the function circuit; an operational mode voltage circuit for providing the operational mode voltage; and an impedance circuit connected between the function circuit and the operational mode voltage circuit for conducting the operational mode voltage to the function circuit when the function circuit is isolated from the test mode voltage and for otherwise supporting a voltage differential between the test mode voltage at the function circuit and the operational mode voltage at the operational mode voltage circuit.
Claim 83
Dependent Claim
14 words
The electronic system of claim 71 wherein the module comprises a Multi-Chip Module (MCM).
Claim 84
Dependent Claim
43 words
The electronic system of claim 72 wherein the MCM is selected from a group comprising a Single-In-line Memory Module (SIMM), a Dual In-line Memory Module (DIMM), a Random Access Memory (RAM) card, a RAM module, a Read-Only-Memory (ROM) card, and a ROM module.
Claim 85
Dependent Claim
220 words
A test apparatus for testing one or more integrated circuit dice provided in an integrated circuit module, each die having one or more bond pads adapted to receive a test mode initiate signal and being of the type to respond to the signal by entering a test mode, the module including a plurality of externally accessible terminals and being adapted to conduct the test mode initiate signal received through one of the externally accessible terminals exclusively to the bond pads adapted to receive the signal, the test apparatus comprising: a test-apparatus-to-module interface including a plurality of interface terminals each coupleable to one of the module's externally accessible terminals; a test mode enable circuit coupled to the interface for initiating the test mode in each die by providing the test mode initiate signal to the die bond pads adapted to receive the signal; a test signal circuit coupled to the interface for testing each die in the test mode by providing one or more test signals to each die; a response signal circuit coupled to the interface for receiving one or more response signals from each die in the test mode in response to the test signals; and an evaluator circuit coupled to the response signal circuit for evaluating the response signals from each die to identify any failing elements therein.
Claim 86
Dependent Claim
220 words
A test apparatus for testing one or more integrated circuit dice provided in an integrated circuit module, each die having one or more bond pads adapted to receive a test mode initiate signal and being of the type to respond to the signal by entering a test mode, the module including a plurality of externally accessible terminals and being adapted to conduct the test mode initiate signal received through one of the externally accessible terminals exclusively to the bond pads adapted to receive the signal, the test apparatus comprising: a test-apparatus-to-module interface including a plurality of interface terminals each coupleable to one of the module's externally accessible terminals; a test mode enable circuit coupled to the interface for initiating the test mode in each die by providing the test mode initiate signal to the die bond pads adapted to receive the signal; a test signal circuit coupled to the interface for testing each die in the test mode by providing one or more test signals to each die; a response signal circuit coupled to the interface for receiving one or more response signals from each die in the test mode in response to the test signals; and an evaluator circuit coupled to the response signal circuit for evaluating the response signals from each die to identify any failing elements therein.
Claim 87
Dependent Claim
83 words
The test apparatus of claim 74 wherein each die includes a redundancy circuit coupled to the module's externally accessible terminals and responsive to repair control signals received therethrough by replacing a failing element identified by the repair control signals with a redundant element, wherein the test apparatus further comprises a repair enablement device coupled to the evaluator circuit and the interface for providing repair control signals to each die's redundancy circuit directing each die to replace any identified failing elements with redundant elements.
Claim 88
Dependent Claim
222 words
A test apparatus for testing one or more integrated circuit dice provided in an integrated circuit module, each die having one or more bond pads adapted to receive a test mode initiate signal and being of the type to respond to the signal by entering a test mode, the module including a plurality of externally accessible terminals and being adapted to conduct the test mode initiate signal received through one of the externally accessible terminals exclusively to the bond pads adapted to receive the signal, the test apparatus comprising: a test-apparatus-to-module interface including a plurality of interface terminals each coupleable to one of the module's externally accessible terminals; an input/output device coupled to the interface for receiving signals from and outputting signals to the dice; and a state machine coupled to the input/output device for: initiating the test mode in each die by directing the input/output device to provide the test mode initiate signal to the die bond pads adapted to receive the signal; testing each die in the test mode by directing the input/output device to provide one or more test signals to each die; receiving one or more response signals from each die in the test mode in response to the test signals; and evaluating the response signals from each die to identify the location of any failing elements therein.
Claim 89
Dependent Claim
222 words
A test apparatus for testing one or more integrated circuit dice provided in an integrated circuit module, each die having one or more bond pads adapted to receive a test mode initiate signal and being of the type to respond to the signal by entering a test mode, the module including a plurality of externally accessible terminals and being adapted to conduct the test mode initiate signal received through one of the externally accessible terminals exclusively to the bond pads adapted to receive the signal, the test apparatus comprising: a test-apparatus-to-module interface including a plurality of interface terminals each coupleable to one of the module's externally accessible terminals; an input/output device coupled to the interface for receiving signals from and outputting signals to the dice; and a state machine coupled to the input/output device for: initiating the test mode in each die by directing the input/output device to provide the test mode initiate signal to the die bond pads adapted to receive the signal; testing each die in the test mode by directing the input/output device to provide one or more test signals to each die; receiving one or more response signals from each die in the test mode in response to the test signals; and evaluating the response signals from each die to identify the location of any failing elements therein.
Claim 90
Dependent Claim
240 words
A computer test device for testing one or more integrated circuit dice provided in an integrated circuit module, each die having one or more bond pads adapted to receive a test mode initiate signal and being of the type to respond to the signal by entering a test mode, the module including a plurality of externally accessible terminals and being adapted to conduct the test mode initiate signal received through one of the externally accessible terminals exclusively to the bond pads adapted to receive the signal, the computer test device comprising: a test-device-to-module interface including a plurality of interface terminals each coupleable to one of the module's externally accessible terminals; an input/output device coupled to the interface for receiving signals from and outputting signals to the dice; a memory device; and a processor coupled to the input/output device and the memory device for: initiating the test mode in each die by directing the input/output device to provide the test mode initiate signal to the die bond pads adapted to receive the signal; testing each die in the test mode by directing the input/output device to provide one or more test signals to each die; receiving one or more response signals from each die in the test mode in response to the test signals; evaluating the response signals from each die to identify the location of any failing elements therein; and storing the locations of failing elements in the memory device.
Claim 91
Dependent Claim
240 words
A computer test device for testing one or more integrated circuit dice provided in an integrated circuit module, each die having one or more bond pads adapted to receive a test mode initiate signal and being of the type to respond to the signal by entering a test mode, the module including a plurality of externally accessible terminals and being adapted to conduct the test mode initiate signal received through one of the externally accessible terminals exclusively to the bond pads adapted to receive the signal, the computer test device comprising: a test-device-to-module interface including a plurality of interface terminals each coupleable to one of the module's externally accessible terminals; an input/output device coupled to the interface for receiving signals from and outputting signals to the dice; a memory device; and a processor coupled to the input/output device and the memory device for: initiating the test mode in each die by directing the input/output device to provide the test mode initiate signal to the die bond pads adapted to receive the signal; testing each die in the test mode by directing the input/output device to provide one or more test signals to each die; receiving one or more response signals from each die in the test mode in response to the test signals; evaluating the response signals from each die to identify the location of any failing elements therein; and storing the locations of failing elements in the memory device.
Claim 92
Dependent Claim
80 words
The computer test device of claim 77 wherein each die includes a redundancy circuit coupled to the module's externally accessible terminals and responsive to repair control signals received therethrough by replacing a failing element identified by the repair control signals with a redundant element, wherein the processor is further coupled to the input/output device and the memory device for providing repair control signals to each die's redundancy circuit directing each die to replace any identified failing elements with redundant elements.
Claim 93
Dependent Claim
180 words
An electronic storage medium upon which is stored a program for controlling a computer to perform in accordance with a method for testing one or more integrated circuit dice provided in an integrated circuit module, each die having one or more bond pads adapted to receive a test mode initiate signal and being of the type to respond to the signal by entering a test mode, the module including a plurality of externally accessible terminals and being adapted to conduct the test mode initiate signal from the terminals exclusively to the bond pads adapted to receive the signal, the method comprising: providing the test mode initiate signal to one of the externally accessible terminals to initiate the test mode in the dice; testing each die in the test mode by providing one or more test signals to each die through the externally accessible terminals; receiving one or more response signals from each die through the terminals in the test mode in response to the test signals; and evaluating the response signals from each die to identify any failing elements therein.
Claim 94
Dependent Claim
180 words
An electronic storage medium upon which is stored a program for controlling a computer to perform in accordance with a method for testing one or more integrated circuit dice provided in an integrated circuit module, each die having one or more bond pads adapted to receive a test mode initiate signal and being of the type to respond to the signal by entering a test mode, the module including a plurality of externally accessible terminals and being adapted to conduct the test mode initiate signal from the terminals exclusively to the bond pads adapted to receive the signal, the method comprising: providing the test mode initiate signal to one of the externally accessible terminals to initiate the test mode in the dice; testing each die in the test mode by providing one or more test signals to each die through the externally accessible terminals; receiving one or more response signals from each die through the terminals in the test mode in response to the test signals; and evaluating the response signals from each die to identify any failing elements therein.
Claim 95
Dependent Claim
74 words
The electronic storage medium of claim 79 wherein each die includes a redundancy circuit coupled to the module's externally accessible terminals and responsive to repair control signals received therethrough by replacing a failing element identified by the repair control signals with a redundant element, wherein the method further comprises providing repair control signals to each die's redundancy circuit through the terminals to direct each die to replace any identified failing elements with redundant elements.
Claim 96
Dependent Claim
65 words
The electronic storage medium of claim 80 wherein the method further comprises: re-testing each die by providing one or more re-test signals to each die through the externally accessible terminals; receiving one or more response signals from each die through the terminals in response to the re-test signals; and evaluating the response signals from each die to confirm the repair of any failing elements therein.
Claim 97
Dependent Claim
127 words
The electronic storage medium of claim 80 wherein the step of providing repair control signals to each die's redundancy circuit to direct each die to replace any identified failing elements with redundant elements comprises: for each failing element; determining an address associated with the failing element; latching the failing element's address into the dice to identify the location of the failing element; providing a programming mode enable signal to the dice to enable a programming mode therein; enabling a redundant element in one of the dice to replace the failing element; and programming the redundancy circuit associated with the enabled redundant element to store the failing element's address so that the stored address directs the redundancy circuit to replace the failing element with the enabled redundant element.
Claim 98
Dependent Claim
28 words
The electronic storage medium of claim 82 wherein the method further comprises limiting the redundant elements capable of being enabled to an automatically selected type of redundant element.
Claim 99
Dependent Claim
27 words
The electronic storage medium of claim 82 wherein the step of providing a programming mode enable signal comprises providing a super voltage Column Address Strobe (CAS) signal.
Claim 100
Dependent Claim
69 words
The electronic storage medium of claim 82 wherein the step of enabling a redundant element comprises: applying a fuse address of a fusebank enable anti-fuse associated with the redundant element to the terminals to identify the location of the anti-fuse; coupling to the anti-fuse; determining the anti-fuse's resistance; applying a programming voltage to the anti-fuse to blow the anti-fuse; and re-determining the anti-fuse's resistance to confirm it is blown.
Claim 101
Dependent Claim
30 words
The electronic storage medium of claim 85 wherein the step of applying the programming voltage comprises applying the programming voltage substantially in a range between 8 Volts and 10 Volts.
Claim 102
Dependent Claim
98 words
The electronic storage medium of claim 82 wherein the step of programming the redundancy circuit associated with the enabled redundant element to store the failing element's address comprises: for each asserted address bit in the failing element's address; applying a fuse address of an address bit anti-fuse associated with the redundant element and corresponding to the asserted address bit to the terminals to identify the location of the anti-fuse; coupling to the anti-fuse; determining the anti-fuse's resistance; applying a programming voltage to the anti-fuse to blow the anti-fuse; and re-determining the anti-fuse's resistance to confirm it is blown.
Claim 103
Independent Claim
152 words
A method for initiating a test mode and an operational mode in a function circuit in each of one or more integrated circuit dice in an integrated circuit module having a module terminal, each function circuit being of the type to enter the test and operational modes in response to receiving respective test mode initiate and operational mode initiate signals, each die including one or more bond pads adapted to receive the test mode initiate signal, the method comprising: receiving the test mode initiate signal at the module terminal; conducting the test mode initiate signal only to those bond pads adapted to receive the test mode initiate signal and from those bond pads to each function circuit to initiate the test mode therein; discontinuing conduction of the test mode initiate signal to each function circuit; and conducting the operational mode initiate signal to each function circuit to initiate the operational mode therein.
Claim 104
Independent Claim
152 words
A method for initiating a test mode and an operational mode in a function circuit in each of one or more integrated circuit dice in an integrated circuit module having a module terminal, each function circuit being of the type to enter the test and operational modes in response to receiving respective test mode initiate and operational mode initiate signals, each die including one or more bond pads adapted to receive the test mode initiate signal, the method comprising: receiving the test mode initiate signal at the module terminal; conducting the test mode initiate signal only to those bond pads adapted to receive the test mode initiate signal and from those bond pads to each function circuit to initiate the test mode therein; discontinuing conduction of the test mode initiate signal to each function circuit; and conducting the operational mode initiate signal to each function circuit to initiate the operational mode therein.
Claim 105
Dependent Claim
61 words
The method of claim 88 wherein the step of conducting the test mode initiate signal comprises: disconnectably connecting the module terminal to each function circuit through one of the bond pads adapted to receive the test mode initiate signal; and supporting a difference in voltages between the test mode initiate signal at each function circuit and the operational mode initiate signal.
Claim 106
Dependent Claim
30 words
The method of claim 89 wherein the step of discontinuing conduction of the test mode initiate signal to each function circuit comprises disconnecting each function circuit from the module terminal.
Claim 107
Dependent Claim
32 words
The method of claim 90 wherein the step of disconnecting each function circuit from the module terminal comprises programming a programmable element selected from a group comprising a fuse and an anti-fuse.
Claim 108
Dependent Claim
46 words
The method of claim 89 wherein the step of supporting a difference in voltages between the test mode initiate signal at each function circuit and the operational mode initiate signal comprises providing an impedance circuit coupled between each function circuit and the operational mode initiate signal.
Claim 109
Dependent Claim
60 words
The method of claim 88 wherein the step of conducting the operational mode initiate signal to each function circuit comprises: providing an operational terminal in the module; receiving the operational mode initiate signal at the operational terminal; and coupling the operational terminal to each function circuit through an element selected from a group comprising an impedance circuit and a link.
Claim 110
Dependent Claim
45 words
The method of claim 88 wherein the step of conducting the operational mode initiate signal to each function circuit comprises: generating the operational mode initiate signal on each die; and conducting the generated operational mode initiate signal to each function circuit through an impedance circuit.
Claim 111
Independent Claim
155 words
A method for initiating a test mode and an operational mode in a function circuit in an integrated circuit die provided in an integrated circuit module having a plurality of externally accessible terminals, the function circuit being of the type to enter the test and operational modes in response to receiving respective test mode initiate and operational mode initiate signals, the method comprising: receiving test mode control signals on the module's terminals from circuitry external to the module; conducting the test mode control signals to the die; generating the test mode initiate signal on the die responsive to the test mode control signals; disconnectably conducting the test mode initiate signal to the function circuit to initiate the test mode therein; disconnecting the test mode initiate signal from the function circuit; providing the operational mode initiate signal on the die; conducting the operational mode initiate signal to the function circuit to initiate the operational mode therein.
Claim 112
Independent Claim
155 words
A method for initiating a test mode and an operational mode in a function circuit in an integrated circuit die provided in an integrated circuit module having a plurality of externally accessible terminals, the function circuit being of the type to enter the test and operational modes in response to receiving respective test mode initiate and operational mode initiate signals, the method comprising: receiving test mode control signals on the module's terminals from circuitry external to the module; conducting the test mode control signals to the die; generating the test mode initiate signal on the die responsive to the test mode control signals; disconnectably conducting the test mode initiate signal to the function circuit to initiate the test mode therein; disconnecting the test mode initiate signal from the function circuit; providing the operational mode initiate signal on the die; conducting the operational mode initiate signal to the function circuit to initiate the operational mode therein.
Claim 113
Dependent Claim
42 words
The method of claim 95 wherein the step of disconnectably conducting the test mode initiate signal to the function circuit includes supporting a difference in voltages between the test mode initiate signal at the function circuit and the operational mode initiate signal.
Claim 114
Dependent Claim
47 words
The method of claim 95 wherein the step of disconnectably conducting the test mode initiate signal to the function circuit comprises coupling the test mode initiate signal to the function circuit through a switching circuit selected from a group comprising a fuse, an anti-fuse, and a transistor.
Claim 115
Dependent Claim
34 words
The method of claim 95 wherein the step of disconnecting the test mode initiate signal from the function circuit comprises programming a programmable element selected from a group comprising a fuse and an anti-fuse.
Claim 116
Independent Claim
154 words
A method of testing one or more integrated circuit dice provided in an integrated circuit module, each die having one or more bond pads adapted to receive a test mode initiate signal and being of the type to respond to the signal by entering a test mode, the module including a plurality of externally accessible terminals, the method comprising: providing the test mode initiate signal to one of the externally accessible terminals; conducting the test mode initiate signal exclusively to the bond pads adapted to receive the signal to initiate the test mode in the dice; testing each die in the test mode by providing one or more test signals to each die through the externally accessible terminals; receiving one or more response signals from each die through the terminals in the test mode in response to the test signals; and evaluating the response signals from each die to identify any failing elements therein.
Claim 117
Independent Claim
154 words
A method of testing one or more integrated circuit dice provided in an integrated circuit module, each die having one or more bond pads adapted to receive a test mode initiate signal and being of the type to respond to the signal by entering a test mode, the module including a plurality of externally accessible terminals, the method comprising: providing the test mode initiate signal to one of the externally accessible terminals; conducting the test mode initiate signal exclusively to the bond pads adapted to receive the signal to initiate the test mode in the dice; testing each die in the test mode by providing one or more test signals to each die through the externally accessible terminals; receiving one or more response signals from each die through the terminals in the test mode in response to the test signals; and evaluating the response signals from each die to identify any failing elements therein.
Claim 118
Dependent Claim
72 words
The method of claim 99 wherein each die includes a redundancy circuit coupled to the module's externally accessible terminals and responsive to repair control signals received therethrough by replacing a failing element identified by the repair control signals with a redundant element, wherein the method further comprises providing repair control signals to each die's redundancy circuit through the terminals to direct each die to replace any identified failing elements with redundant elements.
Claim 119
Dependent Claim
60 words
The method of claim 100, further comprising: re-testing each die by providing one or more re-test signals to each die through the externally accessible terminals; receiving one or more response signals from each die through the terminals in response to the re-test signals; and evaluating the response signals from each die to confirm the repair of any failing elements therein.
Claim 120
Dependent Claim
125 words
The method of claim 100 wherein the step of providing repair control signals to each die's redundancy circuit to direct each die to replace any identified failing elements with redundant elements comprises: for each failing element; determining an address associated with the failing element; latching the failing element's address into the dice to identify the location of the failing element; providing a programming mode enable signal to the dice to enable a programming mode therein; enabling a redundant element in one of the dice to replace the failing element; and programming the redundancy circuit associated with the enabled redundant element to store the failing element's address so that the stored address directs the redundancy circuit to replace the failing element with the enabled redundant element.
Claim 121
Dependent Claim
23 words
The method of claim 102, further comprising limiting the redundant elements capable of being enabled to an automatically selected type of redundant element.
Claim 122
Dependent Claim
25 words
The method of claim 102 wherein the step of providing a programming mode enable signal comprises providing a super voltage Column Address Strobe (CAS) signal.
Claim 123
Dependent Claim
67 words
The method of claim 102 wherein the step of enabling a redundant element comprises: applying a fuse address of a fusebank enable anti-fuse associated with the redundant element to the terminals to identify the location of the anti-fuse; coupling to the anti-fuse; determining the anti-fuse's resistance; applying a programming voltage to the anti-fuse to blow the anti-fuse; and re-determining the anti-fuse's resistance to confirm it is blown.
Claim 124
Dependent Claim
28 words
The method of claim 105 wherein the step of applying the programming voltage comprises applying the programming voltage substantially in a range between 8 Volts and 10 Volts.
Claim 125
Dependent Claim
32 words
The method of claim 105 wherein the steps of applying a fuse address, coupling to the anti-fuse, determining the anti-fuse's resistance, applying a programming voltage, and re-determining the anti-fuse's resistance are automated.
Claim 126
Dependent Claim
96 words
The method of claim 102 wherein the step of programming the redundancy circuit associated with the enabled redundant element to store the failing element's address comprises: for each asserted address bit in the failing element's address; applying a fuse address of an address bit anti-fuse associated with the redundant element and corresponding to the asserted address bit to the terminals to identify the location of the anti-fuse; coupling to the anti-fuse; determining the anti-fuse's resistance; applying a programming voltage to the anti-fuse to blow the anti-fuse; and re-determining the anti-fuse's resistance to confirm it is blown.
Claim 127
Dependent Claim
32 words
The method of claim 108 wherein the steps of applying a fuse address, coupling to the anti-fuse, determining the anti-fuse's resistance, applying a programming voltage, and re-determining the anti-fuse's resistance are automated.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-08-17 | 2002-02-16 | 2002-08-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-08-17 | 2006-02-16 | 2006-08-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-08-17 | 2010-02-16 | 2010-08-18 | $7700.00 | Window Closed / Lapsed |