US5794330A — Microelectronics unit mounting with multiple lead…

Claim 1

Independent Claim 182 words

A method of making a microelectronic unit subassembly comprising the steps of: (a) providing a connection component having a dielectric structure, having an array of terminals on a top surface of the dielectric structure and having flexible leads connected to said terminals and extending through said dielectric structure to bottom ends at a bottom surface of said dielectric structure; and (b) engaging the bottom surface of said connection component dielectric structure with a front surface of a microelectronic unit having an array of contacts thereon while subjecting said connection component and microelectronic unit to heat and pressure so that the bottom surface of the dielectric layer forms a sealed interface with the front surface of the microelectronic unit and so that the bottom ends of the flexible leads on the connection component bond with the contacts on the unit so as to form electrical connections therebetween, wherein said dielectric structure includes a compliant layer and said leads extend through said compliant layer, and wherein at least some of said flexible leads extending through said compliant layer are bent during said engaging step.

Claim 2

Independent Claim 182 words

A method of making a microelectronic unit subassembly comprising the steps of: (a) providing a connection component having a dielectric structure, having an array of terminals on a top surface of the dielectric structure and having flexible leads connected to said terminals and extending through said dielectric structure to bottom ends at a bottom surface of said dielectric structure; and (b) engaging the bottom surface of said connection component dielectric structure with a front surface of a microelectronic unit having an array of contacts thereon while subjecting said connection component and microelectronic unit to heat and pressure so that the bottom surface of the dielectric layer forms a sealed interface with the front surface of the microelectronic unit and so that the bottom ends of the flexible leads on the connection component bond with the contacts on the unit so as to form electrical connections therebetween, wherein said dielectric structure includes a compliant layer and said leads extend through said compliant layer, and wherein at least some of said flexible leads extending through said compliant layer are bent during said engaging step.

Claim 3

Dependent Claim 34 words

The method as claimed in claim 1 wherein said leads and contacts are metallic, and wherein said heat is sufficient to form a liquid metal phase at the juncture of each lead and contact.

Claim 4

Dependent Claim 53 words

The method as claimed in claim 2 wherein said leads and contacts include one or more structural metals and a bonding metal is provided at the juncture of each said lead and contact, said bonding metal forming a low-melting alloy with at least one said structural metal, said liquid phase including said alloy.

Claim 5

Dependent Claim 25 words

The method as claimed in claim 3 wherein said bonding metal is disposed on said bottom ends of said leads prior to said engaging step.

Claim 6

Dependent Claim 32 words

The method as claimed in claim 1 wherein said dielectric structure includes a sealant on said bottom surface, said sealant forming said sealed interface with the front surface of the microelectronic unit.

Claim 7

Dependent Claim 57 words

The method as claimed in claim 5 wherein said sealant momentarily forms a flowable phase at the interface between the bottom surface of said dielectric structure and the front surface of said microelectronic unit during said engaging step, and wherein said flowable phase is cured to form an adhesive bond between said dielectric structure and said unit.

Claim 8

Dependent Claim 13 words

A method as claimed in claim 1 wherein said compliant layer is elastomeric.

Claim 9

Dependent Claim 15 words

The method as claimed in claim 1 wherein said microelectronic unit is a semiconductor chip.

Claim 10

Dependent Claim 21 words

The method as claimed in claim 1 wherein said microelectronic unit includes a substrate having a plurality of semiconductor chips thereon.

Claim 11

Dependent Claim 42 words

The method as claimed in claim 1 further comprising the step of engaging a multiplicity of said terminals simultaneously with a test fixture after bonding the connection component to the microelectronic unit and electrically testing the microelectronic unit through said test fixture.

Claim 12

Independent Claim 163 words

A method of making connections to a microelectronic unit comprising the steps of: (a) providing a connection component including a flexible dielectric top sheet, a plurality of terminals on said top sheet and a plurality of electrically conductive, elongated flexible leads connected to said terminals and extending side-by-side downwardly from said terminals away from said top sheet to bottom ends remote from the top sheet; and (b) engaging said connection component structure with a front surface of a microelectronic unit having an array of contacts thereon while subjecting said connection component and unit to heat and pressure so that bottom ends of the leads on the connection component remote from the top sheet bond with the contacts on the unit to form electrical connections therewith, said connection component including a support layer which surrounds and supports said leads prior to and during said engaging step, said support layer being compliant and at least some of said leads being bent during said engaging step.

Claim 13

Independent Claim 163 words

A method of making connections to a microelectronic unit comprising the steps of: (a) providing a connection component including a flexible dielectric top sheet, a plurality of terminals on said top sheet and a plurality of electrically conductive, elongated flexible leads connected to said terminals and extending side-by-side downwardly from said terminals away from said top sheet to bottom ends remote from the top sheet; and (b) engaging said connection component structure with a front surface of a microelectronic unit having an array of contacts thereon while subjecting said connection component and unit to heat and pressure so that bottom ends of the leads on the connection component remote from the top sheet bond with the contacts on the unit to form electrical connections therewith, said connection component including a support layer which surrounds and supports said leads prior to and during said engaging step, said support layer being compliant and at least some of said leads being bent during said engaging step.

Claim 14

Dependent Claim 52 words

The method as claimed in claim 11 wherein said engaging step includes the step of supporting a top surface of said top sheet on a platen so that said leads extend away from said platen and urging said microelectronic unit towards said platen into engagement with said bottom ends of said leads.

Claim 15

Dependent Claim 20 words

The method as claimed in claim 11 further comprising the step of removing said support layer after said engaging step.

Claim 16

Dependent Claim 33 words

The method as claimed in claim 13 wherein said removing step includes the step of exposing said assembled microelectronic unit and connection component to a solvent so as to dissolve said support layer.

Claim 17

Dependent Claim 40 words

The method as claimed in claim 14 further comprising the step of forming a compliant layer between the microelectronic unit and the top sheet by injecting a curable liquid therebetween and then curing said liquid to form a compliant material.

Claim 18

Independent Claim 153 words

A method of making a connection component for a microelectronic unit, the method comprising the steps of: (a) providing a top sheet having an array of terminals thereon; (b) attaching a lead to each said terminal so that said leads extend generally side-by-side and downwardly away from said top sheet and so that a bottom end of each lead is remote from the top sheet; and (c) injecting a flowable, curable dielectric matieral so that said flowable material surrounds said leads and then curing said flowable material to form a support layer, the method further comprising the step of engaging a first fixture with the bottom ends of the leads so that the fixture is spaced apart from the top sheet, said step of injecting a flowable material being conducted while said fixture is engaged with said bottom ends so that said flowable material is injected between said fixture and said top sheet.

Claim 19

Independent Claim 153 words

A method of making a connection component for a microelectronic unit, the method comprising the steps of: (a) providing a top sheet having an array of terminals thereon; (b) attaching a lead to each said terminal so that said leads extend generally side-by-side and downwardly away from said top sheet and so that a bottom end of each lead is remote from the top sheet; and (c) injecting a flowable, curable dielectric matieral so that said flowable material surrounds said leads and then curing said flowable material to form a support layer, the method further comprising the step of engaging a first fixture with the bottom ends of the leads so that the fixture is spaced apart from the top sheet, said step of injecting a flowable material being conducted while said fixture is engaged with said bottom ends so that said flowable material is injected between said fixture and said top sheet.

Claim 20

Dependent Claim 67 words

The method as claimed in claim 16 further comprising the step of engaging a second fixture with a top side of said top sheet remote from said first fixture, whereby said top sheet and leads are engaged between said fixtures, and deforming said leads to bring said bottom ends of said leads to a predetermined distance from said top sheet by forcing said fixtures toward one another.

Claim 21

Dependent Claim 59 words

The method as claimed in claim 17 wherein said first fixture has a lead-engaging surface with an array of pockets at preselected locations thereon, the bottom end of each said lead being engaged in one said pocket prior to said deforming step, whereby said bottom ends of said leads will be brought to preselected locations during said deforming step.

Claim 22

Dependent Claim 20 words

The method as claimed in claim 18 wherein said deforming step is performed so as to buckle each said lead.

Claim 23

Dependent Claim 54 words

The method as claimed in claim 19 wherein said step of attaching said leads includes the step of bonding a wire to each said terminal so that said wire extends downwardly from the terminal and then severing the wire so that the severed end of the wire forms the bottom end of the lead.

Claim 24

Dependent Claim 32 words

The method as claimed in claim 20 wherein said severing step is performed by heating the wire to melt the wire and thereby form a bulbous portion at the severed bottom end.

Claim 25

Dependent Claim 23 words

The method as claimed in claim 16 further comprising the step of applying a bonding metal to the bottom ends of the leads.

Claim 26

Dependent Claim 28 words

The method as claimed in claim 16 further comprising the step of applying an sealant to the bottom surface of the support layer, remote from said top sheet.

Claim 27

Dependent Claim 18 words

The method as claimed in claim 16 wherein said flowable material is cured to form a compliant layer.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2001-08-17	2002-02-16	2002-08-18	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2005-08-17	2006-02-16	2006-08-18	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2009-08-17	2010-02-16	2010-08-18	$7700.00	Window Closed / Lapsed

Microelectronics unit mounting with multiple lead bonding

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