US5477160A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Module test card
Assignee: Fujitsu Ltd
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Filing: 1993-08-06
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Granted: 1995-12-19
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Expires: 2013-08-06
Abstract
Abstract Manufacturing of semiconductor devices is facilitated when the device chip carriers of the devices are tested, prior to population of chips thereon, by a module test card. The module test card is formed by a test substrate and a plurality of test chips mounted on the test substrate. Connections are provided on the test substrate for connecting to a tester. Through the module test card, the device chip carriers are tested under simulation of their operating conditions.
Inventors
- 👤 David G. Love
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 10:26
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07307; G01R1/07314; G01R1/0735; G01R31/00; G01R31/28; G01R31/282; G01R31/2831; H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
100 words
In manufacturing semiconductor devices formed respectively by a plurality of chips and a carrier of the chips, a method for increasing production yield through refined testing methods, comprising the steps of: electrically coupling, prior to population of the chips thereon, the carrier to a module test card, said module test card having a test substrate and a plurality of test chips on the test substrate, electrically coupling said module test card to a tester, testing said carrier utilizing said module test card to generate test results, and comparing the test results with expected results to accept or reject the carrier.
Claim 2
Dependent Claim
100 words
In manufacturing semiconductor devices formed respectively by a plurality of chips and a carrier of the chips, a method for increasing production yield through refined testing methods, comprising the steps of: electrically coupling, prior to population of the chips thereon, the carrier to a module test card, said module test card having a test substrate and a plurality of test chips on the test substrate, electrically coupling said module test card to a tester, testing said carrier utilizing said module test card to generate test results, and comparing the test results with expected results to accept or reject the carrier.
Claim 3
Dependent Claim
24 words
A method as claimed in claim 1, wherein said testing step comprises a step of simulating one or more operations of the semiconductor devices.
Claim 4
Dependent Claim
29 words
A method as in claim 1, wherein said electrically coupling step comprises a step of electrically connecting said carrier to said module test card using reusable electrically conductive material.
Claim 5
Dependent Claim
30 words
A method as in claim 3, wherein said electrically coupling step comprises a step of electrically connecting said carrier to said module test card using a layer of z-axis elastomer.
Claim 6
Dependent Claim
30 words
A method as in claim 3, wherein said electrically coupling step comprises a step of electrically connecting said carrier to said module test card using a set of contact bumps.
Claim 7
Dependent Claim
14 words
A method as in claim 5, wherein said contact bumps are formed with gold.
Claim 8
Dependent Claim
12 words
A method as in claim 5, wherein said contact bumps are solder.
Claim 9
Dependent Claim
30 words
A method as in claim 3, wherein said electrically coupling step comprises a step of electrically connecting said carrier to said module test card using a tape automated bonding process.
Claim 10
Dependent Claim
58 words
A method as in claim 1, wherein the test chips have a memory, the step of testing said carrier further comprising the steps of: storing test results in the memory, electrically decoupling the carrier from the module test card, electrically coupling a memory read-back probe to the module test card, and reading the test results from the memory.
Claim 11
Independent Claim
56 words
An apparatus for testing a carrier of semiconductor chips prior to population of chips thereon to form a semiconductor device, comprising: a test substrate, a plurality of test chips coupled to the test substrate, means for temporarily electrically connecting a test substrate to said carrier, and means for electrically coupling the test substrate to a tester.
Claim 12
Independent Claim
56 words
An apparatus for testing a carrier of semiconductor chips prior to population of chips thereon to form a semiconductor device, comprising: a test substrate, a plurality of test chips coupled to the test substrate, means for temporarily electrically connecting a test substrate to said carrier, and means for electrically coupling the test substrate to a tester.
Claim 13
Dependent Claim
19 words
An apparatus as in claim 10, wherein said test chips comprise at least one chip having a gate array.
Claim 14
Dependent Claim
18 words
An apparatus as in claim 10, wherein said test chips comprise at least one chip forming a memory.
Claim 15
Dependent Claim
26 words
An apparatus as in claim 10, wherein said test chips comprise at least one chip forming logic circuits for performing functions of a data processing unit.
Claim 16
Dependent Claim
19 words
An apparatus as in claim 13, wherein said test chips further comprise at least one chip forming a memory.
Claim 17
Dependent Claim
25 words
An apparatus as in claim 10, wherein said means for electrically connecting said test substrate to said carrier comprises a layer of electrically conductive material.
Claim 18
Dependent Claim
15 words
An apparatus as in claim 15, wherein said layer of electrically conductive material is reusable.
Claim 19
Dependent Claim
23 words
An apparatus as in claim 15, wherein means for electrically connecting said test substrate to said carrier comprises a layer of z-axis elastomer.
Claim 20
Dependent Claim
24 words
An apparatus as in claim 10, wherein said means for electrically connecting said test substrate to said carrier comprises at least one contact bump.
Claim 21
Dependent Claim
14 words
An apparatus as in claim 18, wherein said contact bumps are formed with gold.
Claim 22
Dependent Claim
14 words
An apparatus as in claim 18, wherein said contact bumps are formed with solder.
Claim 23
Dependent Claim
35 words
An apparatus as in claim 10, wherein said means for electrically connecting said test substrate to said carrier comprises means for electrically connecting said test substrate and said carrier by a tape automated bonding process.
Claim 24
Independent Claim
129 words
A method for testing a multi-chip module carrier on which a plurality integrated circuit chips are to be mounted, comprising the steps of: mounting a plurality of integrated circuit chips on a substrate, the integrated circuit chips on the substrate emulating the chips or a subset of the chips to be mounted on a carrier; establishing temporary electrical contact between the integrated circuit chips on the substrate and a carrier under test; establishing electrical contact between the integrated circuit chips on the substrate and a testing apparatus; applying input signals to the chips on the substrate from the testing apparatus; analyzing output signals from the chips on the substrate with the testing apparatus; and disconnecting the electrical contact between the integrated circuit chips on the substrate and the carrier.
Claim 25
Independent Claim
129 words
A method for testing a multi-chip module carrier on which a plurality integrated circuit chips are to be mounted, comprising the steps of: mounting a plurality of integrated circuit chips on a substrate, the integrated circuit chips on the substrate emulating the chips or a subset of the chips to be mounted on a carrier; establishing temporary electrical contact between the integrated circuit chips on the substrate and a carrier under test; establishing electrical contact between the integrated circuit chips on the substrate and a testing apparatus; applying input signals to the chips on the substrate from the testing apparatus; analyzing output signals from the chips on the substrate with the testing apparatus; and disconnecting the electrical contact between the integrated circuit chips on the substrate and the carrier.
Claim 26
Dependent Claim
69 words
A method as recited in claim 22 comprising the steps of: mounting the integrated circuit chips on one face of the substrate; establishing electrical contact between signal leads on the chips and electrical leads on the substrate; establishing electrical contacts between signal leads on the substrate and the testing apparatus; and bringing bond pads on the chips into direct electrical connection with bond pads on a carrier under test.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-12-18 | 1999-06-19 | 1999-12-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-12-18 | 2003-06-19 | 2003-12-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-12-18 | 2007-06-19 | 2007-12-19 | $7700.00 | Window Closed / Lapsed |