Patent US5696405A successfully refreshed from Google Patents.
US5696405A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microelectronic package with device cooling
Assignee: Bell Semiconductor LLC
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Filing: 1995-10-13
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Granted: 1997-12-09
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Expires: 2015-10-13
Abstract
Abstract A microelectronics package has improved device cooling. The package includes a lead frame defining an upper and lower surface. An active electronic device, such as an integrated circuit, is positioned above the upper surface of the lead frame. An encapsulating package is molded around both the lead frame and the active electronic device to form the microelectronic package. A cooling tube is integrally molded within the encapsulating package and typically formed of a thermally conductive material such as copper. A cooling fluid, such as air or a liquid, can be moved through the cooling tube for discharging the heat generated by the active electronic device.
Inventors
- 👤 John David Weld
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 06:44
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/47
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
69 words
A microelectronic package with improved device cooling comprising a lead frame defining an upper and lower surface, an active electronic device positioned above the upper surface of the lead frame, an encapsulating package molded around the lead frame and the active electronic device and forming the microelectronic package, a cooling tube integrally molded within the encapsulating package and including means for delivering a cooling fluid through the cooling tube.
Claim 2
Dependent Claim
69 words
A microelectronic package with improved device cooling comprising a lead frame defining an upper and lower surface, an active electronic device positioned above the upper surface of the lead frame, an encapsulating package molded around the lead frame and the active electronic device and forming the microelectronic package, a cooling tube integrally molded within the encapsulating package and including means for delivering a cooling fluid through the cooling tube.
Claim 3
Dependent Claim
12 words
The package according to claim 1 wherein the cooling fluid is air.
Claim 4
Dependent Claim
13 words
The package according to claim 1 wherein the cooling fluid is a refrigerant.
Claim 5
Dependent Claim
19 words
The package according to claim 1 wherein the cooling tube mounted in spaced relation above the active electronic device.
Claim 6
Dependent Claim
20 words
The package according to claim 1 wherein the cooling tube mounted against the lead frame opposite the active electronic device.
Claim 7
Dependent Claim
17 words
The package according to claim 1 wherein said encapsulating package is formed from an epoxy molding compound.
Claim 8
Dependent Claim
17 words
The package according to claim 1 wherein said active electronic device comprises at least one integrated circuit.
Claim 9
Dependent Claim
20 words
The package according to claim 1 wherein said cooling tube is formed in a serpentine configuration within the encapsulating package.
Claim 10
Dependent Claim
17 words
The package according to claim 1 wherein said cooling tube is formed of a thermally conductive material.
Claim 11
Dependent Claim
26 words
The package according to claim 1 wherein said cooling tube includes an outer diameter of about 0.025 inches and an inner diameter of about 0.015 inches.
Claim 12
Dependent Claim
36 words
The package according to claim 1 wherein said encapsulating package forms a substantially flat, rectangular configured package having at least one edge face wherein said cooling tube has two ends extending outward from an edge face.
Claim 13
Dependent Claim
14 words
The package according to claim 10 wherein said cooling tube is formed of copper.
Claim 14
Dependent Claim
112 words
A microelectronic package with improved device cooling comprising a lead frame defining an upper and lower surface, an active electronic device positioned above the upper surface of the lead frame, an encapsulating package molded around the lead frame and the active dectronic device and forming the microelectronic package, a cooling tube integrally molded within the encapsulating package, wherein said cooling tube is formed of a thermally conductive material and positioned in one of two heat discharge positions selected from a position spaced above the active electronic device and a position mounted against the lead frame opposite the active electronic device and including means for delivering a cooling fluid through the cooling tube.
Claim 15
Dependent Claim
112 words
A microelectronic package with improved device cooling comprising a lead frame defining an upper and lower surface, an active electronic device positioned above the upper surface of the lead frame, an encapsulating package molded around the lead frame and the active dectronic device and forming the microelectronic package, a cooling tube integrally molded within the encapsulating package, wherein said cooling tube is formed of a thermally conductive material and positioned in one of two heat discharge positions selected from a position spaced above the active electronic device and a position mounted against the lead frame opposite the active electronic device and including means for delivering a cooling fluid through the cooling tube.
Claim 16
Dependent Claim
12 words
The package according to claim 13 wherein the cooling fluid is air.
Claim 17
Dependent Claim
13 words
The package according to claim 13 wherein the cooling fluid is a refrigerant.
Claim 18
Dependent Claim
17 words
The package according to claim 13 wherein said encapsulating package is formed from an epoxy molding compound.
Claim 19
Dependent Claim
17 words
The package according to claim 13 wherein said active electronic device comprises at least one integrated circuit.
Claim 20
Dependent Claim
20 words
The package according to claim 13 wherein said cooling tube is formed in a serpentine configuration within the encapsulating package.
Claim 21
Dependent Claim
14 words
The package according to claim 13 wherein said cooling tube is formed of copper.
Claim 22
Dependent Claim
26 words
The package according to claim 13 wherein said cooling tube includes an outer diameter of about 0.025 inches and an inner diameter of about 0.015 inches.
Claim 23
Dependent Claim
36 words
The package according to claim 13 wherein said encapsulating package forms a substantially flat, rectangular configured package having at least one edge face, wherein said cooling tube has two ends extending outward from an edge face.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-12-08 | 2001-06-09 | 2001-12-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-12-08 | 2005-06-09 | 2005-12-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-12-08 | 2009-06-09 | 2009-12-09 | $7700.00 | Window Closed / Lapsed |