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US5161087A Expired / Lapsed US ⏱️ 0.0 years remaining

Pivotal heat sink assembly

Assignee: International Business Machines Corp
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Filing: 1991-08-07
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Granted: 1992-11-03
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Expires: 2011-08-07
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Abstract

Abstract This invention provides a heat sink assembly for cooling electrical and electronic circuits. A low cost assembly method is achieved by a pivotal assembly containing a heat sink which snaps into place adjacent to an electrical/electronic circuit which requires cooling. The snap-in heat sink assembly contains a resilient heat transfer material which is exposed to the devices requiring heat removal by windows or other openings in a plate which is disposed between the heat transfer material and the snap-in frame.

Inventors

  • 👤 Jerome A. Frankeny
  • 👤 Richard F. Frankeny
  • 👤 Karl Hermann
  • 👤 Rolf Wustrau

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 13:18
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W40/641

Claims Analysis

Total Claims: 18
Claim 1
Independent Claim 85 words
An apparatus for removing heat from a carrier having a plurality of heat sources attached thereto comprising: a frame having means for releasably interconnecting to a carrier, said frame defining a frame window therethrough; and heat transfer means disposed within said frame window for transferring heat through said frame window, wherein said heat transfer means further comprises: a retainer plate assembly comprising a retainer plate which defines a plurality of retainer windows therethrough; and a resilient heat transfer material attached to said retainer plate assembly.
Claim 2
Independent Claim 85 words
An apparatus for removing heat from a carrier having a plurality of heat sources attached thereto comprising: a frame having means for releasably interconnecting to a carrier, said frame defining a frame window therethrough; and heat transfer means disposed within said frame window for transferring heat through said frame window, wherein said heat transfer means further comprises: a retainer plate assembly comprising a retainer plate which defines a plurality of retainer windows therethrough; and a resilient heat transfer material attached to said retainer plate assembly.
Claim 3
Dependent Claim 20 words
An apparatus as described in claim 1 wherein said retainer windows are disposed in horizontal reference with said frame window.
Claim 4
Dependent Claim 24 words
An apparatus as descried in claim 1 or 2 wherein said resilient heat transfer material is disposed at least partially within said retainer windows.
Claim 5
Dependent Claim 27 words
Ana apparatus as described in claim 1 or 2 wherein said retainer plate assembly includes a plurality of heat sink fins extending away from said retainer plate.
Claim 6
Dependent Claim 28 words
An apparatus as described in claim 1, or 2 wherein said resilient heat transfer material is a fluid reservoir means for removing heat by a fluid circulating therethrough.
Claim 7
Dependent Claim 27 words
An apparatus as described in claim 4 wherein said fins are carried on an outer surface of said retainer plate assembly and extends through said frame window.
Claim 8
Dependent Claim 29 words
An apparatus as described in claim 5 wherein said fluid reservoir means is carried on an outer surface of said retainer plate assembly and extends through said frame window.
Claim 9
Dependent Claim 24 words
An apparatus as described in claim 5 wherein said fluid reservoir means includes a plurality of ports for circulating said fluid through said reservoir.
Claim 10
Dependent Claim 96 words
A combined chip carrier and heat sink assembly comprising: a chip carrier having a plurality of chips attached thereto; a frame releasably interconnected to said chip carrier, said frame defining a frame window therethrough; and heat transfer means disposed at least partially within said frame window and in contact with said chips for transferring heat from said chips through said frame window, said heat transfer means further comprising a retainer plate assembly comprising a retainer plate which defines a plurality of retainer windows therethrough, and a resilient heat transfer material attached to said retainer plate assembly.
Claim 11
Dependent Claim 96 words
A combined chip carrier and heat sink assembly comprising: a chip carrier having a plurality of chips attached thereto; a frame releasably interconnected to said chip carrier, said frame defining a frame window therethrough; and heat transfer means disposed at least partially within said frame window and in contact with said chips for transferring heat from said chips through said frame window, said heat transfer means further comprising a retainer plate assembly comprising a retainer plate which defines a plurality of retainer windows therethrough, and a resilient heat transfer material attached to said retainer plate assembly.
Claim 12
Dependent Claim 24 words
An apparatus as described in claim 9 wherein said retainer windows are each disposed in horizontal reference with a corresponding one of said chips.
Claim 13
Dependent Claim 22 words
An apparatus as described in claim 9 wherein said retainer windows retainedly hold said resilient heat transfer material and said chips therewith.
Claim 14
Dependent Claim 15 words
An apparatus as described in claim 9 wherein said chip carrier comprises a flexible substrate.
Claim 15
Dependent Claim 94 words
A combined chip carrier and heat sink assembly comprising: a chip carrier having a plurality of chips attached thereto; a housing, coupled to said chip carrier, having first means for locating said chip carrier and second means for locating a pivoting heat sink assembly, said pivoting heat sink assembly further comprising a frame releasably interconnected to said chip carrier, said frame defining a frame window therethrough and heat transfer means disposed at least partially within said frame window and in contact with said chips for transferring heat from said chips through said frame window.
Claim 16
Dependent Claim 94 words
A combined chip carrier and heat sink assembly comprising: a chip carrier having a plurality of chips attached thereto; a housing, coupled to said chip carrier, having first means for locating said chip carrier and second means for locating a pivoting heat sink assembly, said pivoting heat sink assembly further comprising a frame releasably interconnected to said chip carrier, said frame defining a frame window therethrough and heat transfer means disposed at least partially within said frame window and in contact with said chips for transferring heat from said chips through said frame window.
Claim 17
Dependent Claim 34 words
A combined chip carrier and heat sink assembly of claim 13 wherein said heat transfer means further comprises a retainer plate assembly and a resilient heat transfer material attached to said retainer plate assembly.
Claim 18
Dependent Claim 27 words
An apparatus as described in claim 13 wherein said housing further comprises at least one buckle beam connector strip having means for electrical interconnection to said carrier.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1995-11-03 1996-05-04 1996-11-03 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1999-11-03 2000-05-04 2000-11-03 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2003-11-03 2004-05-04 2004-11-03 $7700.00 Window Closed / Lapsed

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