Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
176 words
A sealed module comprising: a cold plate having a passage through which a cooling medium flows; bellows structure attached to said cold plate and having a first end which communicates with the passage in said cold plate, said cold plate and said bellows structure forming a thermal conduction type cooling system; a plated printed circuit having a substrate and an integrated circuit element provided on a first surface of the substrate, said integrated circuit element being in contact with a second end of said bellow structure; a metal fitting secured on said cold plate and having a flange disposed beneath a second surface of the substrate to present a junction between the second surface of the substrate and the flange of said metal fitting; a polyimide layer formed on the second surface of the substrate; a conductor layer formed on the polyimide layer, said polyimide layer and said conductor layer being in the peripheral portion of the second surface of said substrate; and solder means fixing the flange of said metal fitting to said conductor layer.
Claim 2
Dependent Claim
176 words
A sealed module comprising: a cold plate having a passage through which a cooling medium flows; bellows structure attached to said cold plate and having a first end which communicates with the passage in said cold plate, said cold plate and said bellows structure forming a thermal conduction type cooling system; a plated printed circuit having a substrate and an integrated circuit element provided on a first surface of the substrate, said integrated circuit element being in contact with a second end of said bellow structure; a metal fitting secured on said cold plate and having a flange disposed beneath a second surface of the substrate to present a junction between the second surface of the substrate and the flange of said metal fitting; a polyimide layer formed on the second surface of the substrate; a conductor layer formed on the polyimide layer, said polyimide layer and said conductor layer being in the peripheral portion of the second surface of said substrate; and solder means fixing the flange of said metal fitting to said conductor layer.
Claim 3
Dependent Claim
39 words
A sealed module as set forth in claim 1 wherein said polyimide layer has at least one groove, said conductor layer projecting into the groove to make direct contact with the second surface of said substrate at the groove.
Claim 4
Dependent Claim
26 words
A sealed module as set forth in claim 1 wherein the space between the cold plate and the substrate is sealed by nitrogen or helium gas.
Claim 5
Dependent Claim
40 words
A sealed module as set forth in claim 1 wherein said substrate has circuit patterns formed on the second surface thereof, said conductor layer being made of a metal that is the same as the metal constituting the circuit patterns.
Claim 6
Dependent Claim
32 words
A sealed module as set forth in claim 4 wherein an insulator layer is formed on said circuit patterns, said insulator layer being constituted of the same material as said polyimide layer.
Claim 7
Dependent Claim
40 words
A sealed module as set forth in claim 5 wherein said insulator layer having holes therein, said substrate further having an input/output pattern formed on said insulator layer and input/output pins which connect to said circuit pattern through said holes.
Claim 8
Dependent Claim
17 words
A sealed module as set forth in claim 1 wherein said substrate is made of a ceramic.
Claim 9
Dependent Claim
17 words
A sealed module as set forth in claim 1 wherein said substrate is a multi-layer ceramic substrate.
Claim 10
Dependent Claim
17 words
A sealed module as set forth in claim 1 wherein said substrate is a glass ceramic substrate.
Claim 11
Dependent Claim
27 words
A sealed module as set forth in claim 1 wherein said metal fitting has a generally rectangular ring shape in correspondence with the shape of said substrate.