US5349237A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit package including a heat pipe
Assignee: Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Filing: 1992-03-20
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Granted: 1994-09-20
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Expires: 2012-03-20
Abstract
Abstract A plastic-encapsulated integrated circuit includes a package formed of plastic, an integrated circuit embedded in the package, and heat-dissipating means for conducting heat from the integrated circuit, which means include a hermetically sealed container formed of a heat conductive material embedded in the package and extending from the integrated circuit to at least an outer surface of the package, and a volatile fluid disposed in the container. In operation, the volatile fluid absorbs heat from the integrated circuit when it changes from the liquid state to the vapor state, and dissipates heat when it changes from the vapor state to the liquid state.
Inventors
- 👤 Anthony Sayka
- 👤 Mohammad A. Siddiqui
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 23:36
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/73; H10W40/77; H10W40/778; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W74/00; H10W74/10; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
151 words
A plastic-encapsulated integrated circuit comprising: a package formed of plastic, an integrated circuit embedded in the package, and heat-dissipating means for conducting heat from the integrated circuit, including: a hermetically sealed container formed of a heat conductive material embedded in the package and extending from the integrated circuit to at least an outer surface of the package, the container having first and second portions disposed adjacent the integrated circuit and the outer surface of the package, respectively, and an intermediate portion interconnecting the first and second portions, the intermediate portion being of smaller cross-sectional area than the first and second portions; and a volatile fluid disposed in the container, for absorbing heat from the integrated circuit by converting the fluid from a liquid state to a vapor state without directly contacting the integrated circuit, and for evaporatively dissipating heat by converting the fluid from a vapor state to a liquid state.
Claim 2
Dependent Claim
151 words
A plastic-encapsulated integrated circuit comprising: a package formed of plastic, an integrated circuit embedded in the package, and heat-dissipating means for conducting heat from the integrated circuit, including: a hermetically sealed container formed of a heat conductive material embedded in the package and extending from the integrated circuit to at least an outer surface of the package, the container having first and second portions disposed adjacent the integrated circuit and the outer surface of the package, respectively, and an intermediate portion interconnecting the first and second portions, the intermediate portion being of smaller cross-sectional area than the first and second portions; and a volatile fluid disposed in the container, for absorbing heat from the integrated circuit by converting the fluid from a liquid state to a vapor state without directly contacting the integrated circuit, and for evaporatively dissipating heat by converting the fluid from a vapor state to a liquid state.
Claim 3
Dependent Claim
19 words
A plastic-encapsulated integrated circuit according to claim 1 wherein the first and second portions are of generally frusto-conical shape.
Claim 4
Dependent Claim
17 words
A plastic-encapsulated integrated circuit according to claim 2, wherein the intermediate portion is of generally cylindrical shape.
Claim 5
Dependent Claim
15 words
A plastic-encapsulated integrated circuit according to claim 1, wherein the container is formed of metal.
Claim 6
Dependent Claim
21 words
A plastic-encapsulated integrated circuit according to claim 4, wherein a lower end of the container is bonded to the integrated circuit.
Claim 7
Dependent Claim
144 words
A plastic-encapsulated integrated circuit comprising: a package formed of plastic, an integrated circuit embedded in the package, and heat-dissipating means for conducting heat from the integrated circuit, including: a hermetically sealed container formed of a heat conductive metal material bonded to the integrated circuit and extending therefrom to at least an outer surface of the package, and a volatile fluid disposed in the container for absorbing heat from the integrated circuit, without directly contacting the integrated circuit, while converting from a liquid state to a solid state, and evaporatively dissipating heat while converting from a vapor state to a liquid state, the container including first and second portions disposed adjacent the integrated circuit and the outer surface of the package, respectively, and an intermediate portion interconnecting the first and second portions, the intermediate portion being of smaller cross-section than the first and second portions.
Claim 8
Dependent Claim
144 words
A plastic-encapsulated integrated circuit comprising: a package formed of plastic, an integrated circuit embedded in the package, and heat-dissipating means for conducting heat from the integrated circuit, including: a hermetically sealed container formed of a heat conductive metal material bonded to the integrated circuit and extending therefrom to at least an outer surface of the package, and a volatile fluid disposed in the container for absorbing heat from the integrated circuit, without directly contacting the integrated circuit, while converting from a liquid state to a solid state, and evaporatively dissipating heat while converting from a vapor state to a liquid state, the container including first and second portions disposed adjacent the integrated circuit and the outer surface of the package, respectively, and an intermediate portion interconnecting the first and second portions, the intermediate portion being of smaller cross-section than the first and second portions.
Claim 9
Dependent Claim
22 words
A plastic-encapsulated integrated circuit according to claim 6, wherein the first and second portions of the container are of generally frusto-conical shape.
Claim 10
Dependent Claim
17 words
A plastic-encapsulated integrated circuit according to claim 7, wherein the intermediate portion is of generally cylindrical shape.
Claim 11
Dependent Claim
124 words
A plastic-encapsulated integrated circuit comprising: a package formed of plastic; an integrated circuit embedded in the package, and heat-dissipating means for conducting heat from the integrated circuit, including: a hermetically sealed container formed of a heat conductive material embedded in the package and extending from the integrated circuit to at least an outer surface of the package with a lower end of the container being bonded to the integrated circuit by a heat-conductive adhesive; and a volatile fluid disposed in the container, for absorbing heat from the integrated circuit by converting the fluid from a liquid state to a vapor state without directly contacting the integrated circuit, and for evaporatively dissipating heat by converting the fluid from a vapor state to a liquid state.
Claim 12
Dependent Claim
124 words
A plastic-encapsulated integrated circuit comprising: a package formed of plastic; an integrated circuit embedded in the package, and heat-dissipating means for conducting heat from the integrated circuit, including: a hermetically sealed container formed of a heat conductive material embedded in the package and extending from the integrated circuit to at least an outer surface of the package with a lower end of the container being bonded to the integrated circuit by a heat-conductive adhesive; and a volatile fluid disposed in the container, for absorbing heat from the integrated circuit by converting the fluid from a liquid state to a vapor state without directly contacting the integrated circuit, and for evaporatively dissipating heat by converting the fluid from a vapor state to a liquid state.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-09-19 | 1998-03-21 | 1998-09-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-09-19 | 2002-03-21 | 2002-09-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-09-19 | 2006-03-21 | 2006-09-20 | $7700.00 | Window Closed / Lapsed |