Use of a heat pipe integrated with the IC package for improving thermal performance

Claim 1

A semiconductor device housing comprising: a standard ceramic package for mounting a semiconductor device and making connections thereto, said package having a cavity containing the semiconductor device and a lid which acts as a final closure seal; a heat pipe having one end secured to said lid so as to pass therethrough whereby said heat pipe becomes part of said package when said lid is sealed to said package, said heat pipe including a central bore in fluid communication with said cavity, wick means associated with the interior portion of said central bore and shaped to closely conform to the surface of said semiconductor device and heat extraction means associated with the other end of said heat pipe whereby vapor in said central bore is condensed to liquid state; and a heat exchange fluid contained within said heat pipe and said cavity to provide a liquid contact to said semiconductor device whereby heat generated in said semiconductor device volatizes said liquid which thereby boils and cools said semiconductor device and the vapor thus produced is carried in vapor form along said heat pipe and is condensed at said other end of said heat pipe to be carried by said wick means in capillary liquid flow action back to said cavity and therefore to said semiconductor device.