Cooling apparatus for flat semiconductors using one or more heat pipes

Claim 1

Apparatus for cooling a flat semiconductor device comprising: a. a pair of base members made of a material with high thermal conductivity, each having a surface which is held in close mechanical contact with the flat surfaces of the semiconductor on opposite sides thereof, and each of said base members having at least one hole therein; and b. a plurality of heat pipes, one being provided for each hole in said base members, each comprising an elongated closed chamber lined on the inside with a wick material saturated with a working fluid, said closed chamber being made up of three sections, a first, inner section of highly conductive material a second, middle section of a material of low conductivity and a third outer section of highly conductive material, each having said first section inserted in and in close thermal contact with a hole in said base members and each of said closed chambers having mounted on said third outer sections, transverse to the heat pipe axis and in a manner such as to maintain good thermal contact, a plurality of cooling fins.