US3716764A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for encapsulating electronic components in plastic
Assignee: Texas Instruments Inc
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Filing: 1968-10-17
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Granted: 1973-02-13
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Expires: 1988-10-17
Abstract
Abstract A METHOD OF MAKING CONTACTS TO A SEMICONDUCTOR DEVICE AND ENCAPSULATING THE DEVICE, AND THE RESULTING DEVICE. A FRAME HAVING INWARDLY-EXTENDING CONDUCTOR STRIPS IS USED TO SUPPORT THE ASSEMBLY DURING THE STEPS OF MOUNTING A SEMICONDUCTOR WAFER ON ONE OF THE STRIPS, CONNECTING CONDUCTIVE WIRES FROM ELECTRODES ON THE WAFER TO OTHER STRIPS AND MOLDING A PLASTIC PACKAGE AROUND THE DEVICE. THE FRAME IS THEN SEVERED.
Inventors
- 👤 R Birchler
- 👤 E Williams
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 11:18
CPC Classifications
B; B29; B29C; B29C45/00; B29C45/14; B29C45/14639; B29C45/14655; H; H10; H10W; H10W70/00; H10W70/40; H10W70/481; H10W74/00; H10W74/01; H10W74/016; H10W72/00; H10W72/01; H10W72/0198; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169; Y10T29/49171
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-02-13 | 1976-08-14 | 1977-02-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-02-13 | 1980-08-14 | 1981-02-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-02-13 | 1984-08-14 | 1985-02-13 | $7700.00 | Window Closed / Lapsed |