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US5299090A Expired / Lapsed US ⏱️ 0.0 years remaining

Pin-fin heat sink

Assignee: Nokia Bell Labs
•
Filing: 1993-06-29
•
Granted: 1994-03-29
•
Expires: 2013-06-29
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Abstract

Abstract A housed integrated circuit unit package is provided with a heat sink for removal and dissipation of heat from electronic circuits housed in packages. The heat sink, mounted on an outer surface of the package, includes a plurality of pins secured at one end with a retainer and flared out at the other end into a starburst or bouquet configuration, the pins being in the form of rods selected from solid cylinders and tubes. The bottom of the retainer-bound end is coated with a securing substance, such as solder or a heat-conducting adhesive, which is planarized to facilitate positioning of the heat sink on the package. The heat sink is secured to the package by means of solder or a heat-conducting adhesive. The heat sink is produced by securing a plurality of elongated rods by retainers placed at intervals corresponding to a height of the heat sink, cutting off said rods adjacent to one side of the retainer, and flaring the rods at the other free end of the cut-off rods into a starburst-like configuration. The retained ends of the rods are dipped into a solder or heat-conducting adhesive and planarized to provide a planar surface for mounting the heat sink on the surface of the package.

Inventors

  • 👤 Kevin J. Brady
  • 👤 Charles Cohn

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 19:22
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/228; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/4935; Y10T29/49393; Y10T29/49789

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 102 words
An encapsulated device with a heat sink, which comprises; a housing enclosing an integrated circuit unit, and said heat sink secured on an outside planar surface of the housing, in which said heat sink comprises a plurality of elongated pins held at one end within a retainer and having a flared-out star-burst configuration at the opposite end, said pins being of a material having high thermal conductive characteristics, said pins at said one end having a surface planarized by a means of a substance selected from solder or plastic adhesives for mounting said heat sink on said planar surface of the housing.
Claim 2
Dependent Claim 102 words
An encapsulated device with a heat sink, which comprises; a housing enclosing an integrated circuit unit, and said heat sink secured on an outside planar surface of the housing, in which said heat sink comprises a plurality of elongated pins held at one end within a retainer and having a flared-out star-burst configuration at the opposite end, said pins being of a material having high thermal conductive characteristics, said pins at said one end having a surface planarized by a means of a substance selected from solder or plastic adhesives for mounting said heat sink on said planar surface of the housing.
Claim 3
Dependent Claim 21 words
The device of claim 1 in which said pins are in the form of rods selected from solid cylinders and tubes.
Claim 4
Dependent Claim 12 words
The device of claim 1 in which said retainer is a ring.
Claim 5
Dependent Claim 28 words
The device of claim 1 in which the pins at said one end are further secured within the retainer by securing means selected from solder or plastic adhesive.
Claim 6
Independent Claim 112 words
A method of producing a heat sink comprising a plurality of elongated cylinders held at one end by a retainer and having a flared-out star-burst configuration at the opposite end, which comprises: placing retainers along a length of a plurality of elongated cylinders, said retainers keeping the cylinders bunched at intervals of predetermined length and said rods being of a material having high thermal characteristics. cutting the rods into sections, each section including rods of said predetermined length and a retainer, coating an end surface of each cylinder and an end surface of the retainer with a substance selected from solder or thermally conductive adhesive, and planarizing coated end surfaces, if needed.
Claim 7
Independent Claim 112 words
A method of producing a heat sink comprising a plurality of elongated cylinders held at one end by a retainer and having a flared-out star-burst configuration at the opposite end, which comprises: placing retainers along a length of a plurality of elongated cylinders, said retainers keeping the cylinders bunched at intervals of predetermined length and said rods being of a material having high thermal characteristics. cutting the rods into sections, each section including rods of said predetermined length and a retainer, coating an end surface of each cylinder and an end surface of the retainer with a substance selected from solder or thermally conductive adhesive, and planarizing coated end surfaces, if needed.
Claim 8
Dependent Claim 17 words
The method of claim 5 in which said cylinders are selected from solid rods, pins or tubes.
Claim 9
Dependent Claim 12 words
The method of claim 5 in which said retainer is a ring.

References Cited (Backward Citations)

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US4479140A Cited
US4508163A Cited
SU1163126A1 Cited
US4712159A Cited
US4849856A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-03-28 1997-09-27 1998-03-29 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-03-28 2001-09-27 2002-03-29 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-03-28 2005-09-27 2006-03-29 $7700.00 Window Closed / Lapsed

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