Self-adjusting heat sink design for vlsi packages

Abstract

Abstract The present invention is an electronic circuit, such as a Hybrid Integrated Circuit (HIC), having an element mounted on a suitable support base, and a self-adjusting heat sink mounted on the element. A heat spreader is located in spaced relationship with the support base. The heat spreader may be a plate of conductive material provided especially or may form a part of a housing enclosing the HIC. The heat sink has a bottom portion secured to the element and at least one flange for conducting heat energy to the heat spreader. Each flange includes an upright segment projecting from the bottom portion of the heat sink toward the heat spreader, a free end segment bent away from the heat spreader and a knee-bend segment intermediate the upright segment and the free-end segment and adjacent to the heat spreader. Each flange is also provided with a thermally responsive section, hereinafter referred to as "thermostat", which forms a part of the upright segment and in response to the presence or absence of a certain amount of heat energy causes movement of the free end segment of the heat sink, respectively, toward or away from the heat spreader so as to establish a greater or lesser area of contact with the heat spreader. This thermostat is formable in several ways including inlaying into an upright segment of the flange a metal with a coefficient of thermal expansion different from that of the flange or by attaching such a metal to the upright segment.

Inventors

• 👤 D. W. Dahringer

Bibliographic Details