US5406807A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for cooling semiconductor device and computer having the same
Assignee: Hitachi Ltd
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Filing: 1993-06-16
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Granted: 1995-04-18
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Expires: 2013-06-16
Abstract
Abstract An apparatus for cooling semiconductor devices includes a module for cooling semiconductor devices; a refrigerant cooling device for receiving via an outlet pipe the refrigerant discharged through an outlet port of the module to cool the refrigerant; a refrigerant circulation pump for receiving, via a suction pipe, the refrigerant cooled by the refrigerant cooling device and sending the refrigerant to the module via an inlet pipe; and a refrigerant-flow stabilizing mechanism for stabilizing a refrigerant circulation flow discharged from the refrigerant circulation pump to be returned to the refrigerant circulation pump via the module and the refrigerant cooling device. Since the refrigerant-flow stabilizing mechanism stabilize the refrigerant flow, the refrigerant flow can be stably circulated so that the semiconductor devices in the module are stably cooled.
Inventors
- 👤 Noriyuki Ashiwake
- 👤 Tadakatsu Nakajima
- 👤 Shigeyuki Sasaki
- 👤 Yasuo Ohsone
- 👤 Toshio Hatada
- 👤 Toshiki Iino
- 👤 Kenichi Kasai
- 👤 Akio Idei
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 20:20
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/73; Y; Y10; Y10S; Y10S165/00; Y10S165/908
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
312 words
An apparatus for cooling semiconductor devices comprising at least one semiconductor devices cooling module for cooling semiconductor devices, said module including a container having an inlet port for a refrigerant and an outlet port for said refrigerant, a board on which a plurality of semiconductor devices are so mounted in said container as to be dipped in said refrigerant flowing from said inlet port to said outlet port in said container and to be cooled by said flow of said refrigerant which is partially boiled upon cooling the semiconductor devices and flows out from said outlet port in the form of gas-liquid two-phase flow, said board constituting a part of a wall of said container, and a cooling system for cooling said module, wherein said cooling system comprises a pump for sending said refrigerant, a refrigerant cooling device for cooling said refrigerant and thereby condense a gaseous part of said refrigerant, and a system of pipes for connecting said pump, said module and said refrigerant cooling device to circulate said refrigerant from a discharge port of said pump to said inlet port of said module, from said outlet port of said module to an inflow port for said refrigerant of said refrigerant cooling device, and from an outflow port for said refrigerant of said refrigerant cooling device to an intake port of said pump and thereby forming a closed loop, and said inflow port of in said refrigerant cooling device is disposed at a level higher than said outlet port of said module such that said refrigerant cooling device is located at a position higher than said module, and a pipe of the system of pipes connecting said outlet port of said module to said inflow port for said refrigerant of said refrigerant cooling device is arranged and configured with respect to a flow direction so as to preclude refrigerant downflow therein.
Claim 2
Independent Claim
312 words
An apparatus for cooling semiconductor devices comprising at least one semiconductor devices cooling module for cooling semiconductor devices, said module including a container having an inlet port for a refrigerant and an outlet port for said refrigerant, a board on which a plurality of semiconductor devices are so mounted in said container as to be dipped in said refrigerant flowing from said inlet port to said outlet port in said container and to be cooled by said flow of said refrigerant which is partially boiled upon cooling the semiconductor devices and flows out from said outlet port in the form of gas-liquid two-phase flow, said board constituting a part of a wall of said container, and a cooling system for cooling said module, wherein said cooling system comprises a pump for sending said refrigerant, a refrigerant cooling device for cooling said refrigerant and thereby condense a gaseous part of said refrigerant, and a system of pipes for connecting said pump, said module and said refrigerant cooling device to circulate said refrigerant from a discharge port of said pump to said inlet port of said module, from said outlet port of said module to an inflow port for said refrigerant of said refrigerant cooling device, and from an outflow port for said refrigerant of said refrigerant cooling device to an intake port of said pump and thereby forming a closed loop, and said inflow port of in said refrigerant cooling device is disposed at a level higher than said outlet port of said module such that said refrigerant cooling device is located at a position higher than said module, and a pipe of the system of pipes connecting said outlet port of said module to said inflow port for said refrigerant of said refrigerant cooling device is arranged and configured with respect to a flow direction so as to preclude refrigerant downflow therein.
Claim 3
Dependent Claim
26 words
An apparatus for cooling semiconductor devices according to claim 1, wherein said outlet port of said module is opened at a highest position of said module.
Claim 4
Dependent Claim
87 words
An apparatus for cooling semiconductor devices according to claim 1, wherein said module has said inlet port at a lower portion thereof and said outlet port at an upper portion thereof higher than the lower portion, and said module and said refrigerant cooling device are so disposed at relative positions as to make a refrigerant flow in an outlet pipe connecting said outlet port of said module and said inflow port of said refrigerant cooling device to be composed at least one of horizontal flow and upflow.
Claim 5
Dependent Claim
24 words
An apparatus for cooling semiconductor devices according to claim 1, wherein said pump is disposed at a level lower than said refrigerant cooling device.
Claim 6
Dependent Claim
38 words
An apparatus for cooling semiconductor devices according to claim 1, further comprising a volume-variable container, an inside of which is communicated with a refrigerant passage within said refrigerant cooling device, at a top of said refrigerant cooling device.
Claim 7
Dependent Claim
11 words
An apparatus according to claim 1, wherein said refrigerant is fluorocarbon.
Claim 8
Independent Claim
258 words
An apparatus for cooling semiconductor devices comprising: a semiconductor devices cooling module for cooling semiconductor devices, including a container having an inlet port for a refrigerant and an outlet port for said refrigerant, and a board on which at least one semiconductor devices is so mounted in said container as to be dipped in said refrigerant flowing from said inlet port to said outlet port in said container as to be cooled by said flow of said refrigerant which is partially boiled upon cooling the semiconductor devices and flows out from said outlet port in the form of gas-liquid two-phase flow, a refrigerant cooling device adapted to receive via an outlet pipe said refrigerant discharged from said outlet port of said module so as to cool said refrigerant and thereby condense a gaseous part of said refrigerant; a refrigerant circulation pump for receiving, via a suction pipe, said refrigerant cooled by said refrigerant cooling device and for sending said refrigerant to said module via an inlet pipe; and refrigerant-flow stabilizing means for stabilizing a refrigerant circulation flow discharged from said refrigerant circulation pump to be returned to said refrigerant circulation pump via said module and said refrigerant cooling device in which said refrigerant cooling device is located at a position higher than said module, and a pipe of the system of pipes connecting said outlet port of said module to said inflow port for said refrigerant of said refrigerant cooling device is arranged and configured with respect to a flow direction so as to preclude refrigerant downflow therein.
Claim 9
Independent Claim
258 words
An apparatus for cooling semiconductor devices comprising: a semiconductor devices cooling module for cooling semiconductor devices, including a container having an inlet port for a refrigerant and an outlet port for said refrigerant, and a board on which at least one semiconductor devices is so mounted in said container as to be dipped in said refrigerant flowing from said inlet port to said outlet port in said container as to be cooled by said flow of said refrigerant which is partially boiled upon cooling the semiconductor devices and flows out from said outlet port in the form of gas-liquid two-phase flow, a refrigerant cooling device adapted to receive via an outlet pipe said refrigerant discharged from said outlet port of said module so as to cool said refrigerant and thereby condense a gaseous part of said refrigerant; a refrigerant circulation pump for receiving, via a suction pipe, said refrigerant cooled by said refrigerant cooling device and for sending said refrigerant to said module via an inlet pipe; and refrigerant-flow stabilizing means for stabilizing a refrigerant circulation flow discharged from said refrigerant circulation pump to be returned to said refrigerant circulation pump via said module and said refrigerant cooling device in which said refrigerant cooling device is located at a position higher than said module, and a pipe of the system of pipes connecting said outlet port of said module to said inflow port for said refrigerant of said refrigerant cooling device is arranged and configured with respect to a flow direction so as to preclude refrigerant downflow therein.
Claim 10
Dependent Claim
22 words
An apparatus according to claim 7, wherein said outlet port of said module is opened at a highest position of said module.
Claim 11
Dependent Claim
11 words
An apparatus according to claim 7, wherein said refrigerant is fluorocarbon.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-04-17 | 1998-10-17 | 1999-04-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-04-17 | 2002-10-17 | 2003-04-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-04-17 | 2006-10-17 | 2007-04-18 | $7700.00 | Window Closed / Lapsed |