Low profile integrated heat sink and fan assembly

Claim 2

A low profile integrated assembly for dissipating heat from an electronic component, said assembly comprising: (a) a heat sink for dissipating heat from an electronic component, said heat sink having a bottom base plate and means attached on said base plate and extending upwardly therefrom for defining a peripheral envelope and a cavity within said envelope; and (b) a self-contained motorized fan unit disposed substantially within said cavity and said envelope of said heat sink, said fan unit being operable for generating a flow of air into said heat sink to effect impingement cooling of a portion of said heat sink located adjacent to the electronic component; (c) said envelope and cavity defining means of said heat sink including a plurality of elements stationarily attached on said bottom base plate and extending upwardly therefrom for supporting said fan unit in spaced relation above said bottom base plate so as to define a passageway between said bottom base plate and said fan unit for passing the flow of air over said bottom base plate.

Claim 3

The assembly of claim 1 wherein said means for defining said envelope and said cavity includes at least a pair of outer fins attached on said bottom base plate and extending upwardly therefrom, each of said outer fins being spaced from the other and disposed along one of a pair of opposite sides of said bottom base plate so as to define a pair of opposite sides of said cavity and retain said fan unit therebetween.

Claim 4

The assembly of claim 1 wherein said cavity has a volume being substantially matched with a volume of said fan unit, in terms of the width and height dimensions of said cavity and fan unit, such that said fan unit is substantially contained within said cavity.

Claim 5

The assembly of claim 1 further comprising: means for retaining said heat sink on the electronic component, said retaining means being a pair of endless members of elastic stretchible material capable of stretching around portions of the heat sink and electronic component.

Claim 6

A low profile integrated assembly for dissipating heat from an electronic component, said assembly comprising: (a) a heat sink for dissipating heat from an electronic component, said heat sink having a bottom base plate and means attached on said base plate and extending upwardly therefrom for defining a peripheral envelope and a cavity within said envelope; and (b) a self-contained motorized fan unit disposed substantially within said cavity and said envelope of said heat sink, said fan unit being operable for generating a flow of air into said heat sink to effect impingement cooling of a portion of said heat sink located adjacent to the electronic component, said envelope and cavity defining means including a plurality of elements forming a bottom of said cavity and supporting said fan unit in spaced relation above said bottom base plate so as to define passageways between said bottom base plate and said fan unit for passing the flow of air over said bottom base plate; (c) said means for defining said envelope and said cavity including at least a pair of outer fins attached on said bottom base plate and extending upwardly therefrom, each of said outer fins being spaced from the other and disposed along one of a pair of opposite sides of said bottom base plate so as to define a pair of opposite sides of said cavity and retain said fan unit therebetween; (d) said plurality of elements defining said bottom of said cavity including a plurality of inner fins attached on said bottom base plate and extending upwardly therefrom, said inner fins being disposed between said pair of spaced outer fins so as to define said bottom of said cavity in a spaced relation above said bottom base plate, said fan unit being disposed in said cavity and spaced above said bottom base plate by being seated upon said inner fins and retained between said outer fins in a tight-fitting engaged relation with said outer fins.

Claim 7

A low profile integrated assembly for dissipating heat from an electronic component, said assembly comprising: (a) a heat sink for dissipating heat from an electronic component, said heat sink having a bottom base plate and means attached on said base plate and extending upwardly therefrom for defining a peripheral envelope and a cavity within said envelope; and (b) a self-contained motorized fan unit disposed substantially within said cavity and said envelope of said heat sink, said fan unit being operable for generating a flow of air into said heat sink to effect impingement cooling of a portion of said heat sink located adjacent to the electronic component, said envelope and cavity defining means including a plurality of elements forming a bottom of said cavity and supporting said fan unit in spaced relation above said bottom base plate so as to define passageways between said bottom base plate and said fan unit for passing the flow of air over said bottom base plate; (c) said means for defining said envelope and said cavity including at least a pair of outer fins attached on said bottom base plate and extending upwardly therefrom, each of said outer fins being spaced from the other and disposed along one of a pair of opposite sides of said bottom base plate so as to define a pair of opposite sides of said cavity and retain said fan unit therebetween; (d) said plurality of elements defining said bottom of said cavity including a plurality of inner fins attached on said bottom base plate and extending upwardly therefrom, said inner fins being disposed between said pair of spaced outer fins so as to define said bottom of said cavity in a spaced relation above said bottom base plate, said fan unit being disposed in said cavity and spaced above said bottom base plate by being seated upon said inner fins and retained between said outer fins in a tight-fitting engaged relation with said outer fins.

Claim 8

The assembly of claim 5 wherein the lengths of said fins are substantially greater than the heights thereof.

Claim 9

The assembly of claim 5 wherein portions of said inner fins below said fan unit are shorter in height than said outer fins.

Claim 10

The assembly of claim 5 wherein said inner fins are substantially uniform in height throughout their lengths and are shorter in height than said outer fins.

Claim 11

The assembly of claim 5 wherein said inner fins have central portions disposed below said fan unit that are shorter in height than said outer fins and have opposite end portions disposed adjacent to opposite ends of said fan unit that are of substantially the same height as said outer fins.

Claim 12

A low profile integrated assembly for dissipating heat from an electronic component, said assembly comprising: (a) a heat sink having a bottom base plate for placement in a heat transferring relation with an electronic component for dissipating heat therefrom, said heat sink also having a multiplicity of elements attached on said base plate and projecting upwardly therefrom for providing a heat dissipating function and defining a peripheral envelope and a cavity within said envelope; and (b) a self-contained motorized fan unit at least partially embedded within said cavity and contained within said envelope defined by said heat sink elements and being operable for generating a flow of air into said heat sink to effect impingement cooling of a portion of said heat sink located adjacent to the electronic component; (c) said multiplicity of elements of said heat sink including a plurality of said elements being stationarily attached on said bottom base plate and extending upwardly therefrom for supporting said fan unit in spaced relation above said bottom base plate so as to define a passageway between said bottom base plate and said fan unit for passing the flow of air over said bottom base plate.

Claim 13

A low profile integrated assembly for dissipating heat from an electronic component, said assembly comprising: (a) a heat sink having a bottom base plate for placement in a heat transferring relation with an electronic component for dissipating heat therefrom, said heat sink also having a multiplicity of elements attached on said base plate and projecting upwardly therefrom for providing a heat dissipating function and defining a peripheral envelope and a cavity within said envelope; and (b) a self-contained motorized fan unit at least partially embedded within said cavity and contained within said envelope defined by said heat sink elements and being operable for generating a flow of air into said heat sink to effect impingement cooling of a portion of said heat sink located adjacent to the electronic component; (c) said multiplicity of elements of said heat sink including a plurality of said elements being stationarily attached on said bottom base plate and extending upwardly therefrom for supporting said fan unit in spaced relation above said bottom base plate so as to define a passageway between said bottom base plate and said fan unit for passing the flow of air over said bottom base plate.

Claim 14

The assembly of claim 10 wherein said multiplicity of elements defining said envelope and said cavity includes at least a pair of outer fins attached on said bottom base plate and extending upwardly therefrom, each of said outer fins being spaced from the other and disposed along one of a pair of opposite sides of said bottom base plate so as to define a pair of opposite sides of said cavity and retain said fan unit therebetween.

Claim 15

The assembly of claim 10 further comprising: means for retaining said heat sink on the electronic component, said retaining means being a pair of endless members of elastic stretchible material capable of stretching around portions of the heat sink and electronic component.

Claim 16

A low profile integrated assembly for dissipating heat from an electronic component, said assembly comprising: (a) a heat sink having a bottom base plate for placement in a heat transferring relation with an electronic component for dissipating heat therefrom, said heat sink also having a multiplicity of elements attached on said base plate and projecting upwardly therefrom for providing a heat dissipating function and defining a peripheral envelope and a cavity within said envelope; and (b) a self-contained motorized fan unit at least partially embedded within said cavity and contained within said envelope defined by said heat sink elements and being operable for generating a flow of air into said heat sink to effect impingement cooling of a portion of said heat sink located adjacent to the electronic component, said plurality of elements forming a bottom of said cavity and supporting said fan unit in spaced relation above said bottom base plate so as to define passageways between said bottom base plate and said fan unit for passing the flow of air over said bottom base plate; (c) said multiplicity of elements defining said envelope and said cavity including at least a pair of outer fins attache on said bottom base plate and extending upwardly therefrom, each of said outer fins being spaced from the other and disposed along one of sa pair of opposite sides of said bottom base plate so as to define a pair of opposite sides of said cavity and retain said fan unit therebetween; (d) said multiplicity of elements defining said envelope and said cavity including a plurality of inner fins attached on said bottom base plate and extending upwardly therefrom, said inner fins being spaced apart from one another disposed between said par of spaced outer fins so as to define said bottom of said cavity in a spaced relation above said bottom base plate, said fan unit being disposed in said cavity and spaced above said bottom base plate by being seated upon said inner fins and retained between said outer fins in a tight-fitting engaged relation with said outer fins.

Claim 17

A low profile integrated assembly for dissipating heat from an electronic component, said assembly comprising: (a) a heat sink having a bottom base plate for placement in a heat transferring relation with an electronic component for dissipating heat therefrom, said heat sink also having a multiplicity of elements attached on said base plate and projecting upwardly therefrom for providing a heat dissipating function and defining a peripheral envelope and a cavity within said envelope; and (b) a self-contained motorized fan unit at least partially embedded within said cavity and contained within said envelope defined by said heat sink elements and being operable for generating a flow of air into said heat sink to effect impingement cooling of a portion of said heat sink located adjacent to the electronic component, said plurality of elements forming a bottom of said cavity and supporting said fan unit in spaced relation above said bottom base plate so as to define passageways between said bottom base plate and said fan unit for passing the flow of air over said bottom base plate; (c) said multiplicity of elements defining said envelope and said cavity including at least a pair of outer fins attache on said bottom base plate and extending upwardly therefrom, each of said outer fins being spaced from the other and disposed along one of sa pair of opposite sides of said bottom base plate so as to define a pair of opposite sides of said cavity and retain said fan unit therebetween; (d) said multiplicity of elements defining said envelope and said cavity including a plurality of inner fins attached on said bottom base plate and extending upwardly therefrom, said inner fins being spaced apart from one another disposed between said par of spaced outer fins so as to define said bottom of said cavity in a spaced relation above said bottom base plate, said fan unit being disposed in said cavity and spaced above said bottom base plate by being seated upon said inner fins and retained between said outer fins in a tight-fitting engaged relation with said outer fins.

Claim 18

The assembly of claim 13 wherein the lengths of said fins are substantially greater than the the heights thereof.

Claim 19

The assembly of claim 13 wherein portions of said inner fins below said fan unit are shorter in height than said outer fins.

Claim 20

The assembly of claim 13 wherein said inner fins are substantially uniform in height throughout their lengths and are shorter in height than said outer fins.

Claim 21

The assembly of claim 13 wherein said inner fins have central portions disposed below said fan unit that are shorter in height than said outer fins and have opposite end portions disposed adjacent to opposite end of said fan unit that are of substantially the same height as said outer fins.

Claim 22

A heat sink for use in holding for a self-contained motorized fan unit in a heat transferring relation to an electronic component, said heat sink comprising: (a) a bottom base plate adapted for placement upon the electronic component; and (b) a multiplicity of elements defining a peripheral envelope and a cavity within said envelope adapted for seating the self-contained motorized fan unit; (c) said multiplicity of elements including at least a pair of outer elements attached on said bottom base plate and extending upwardly therefrom, each of said outer elements being spaced from the other and disposed along one of a pair of opposite sides of said bottom base plate so as to define a pair of opposite sides of said cavity adapted to retain the fan unit therebetween; (d) said multiplicity of elements also including a plurality of inner elements attached on said bottom base plate and extending upwardly therefrom, said inner elements being spaced apart from one another disposed between said par of spaced outer elements so as to define said bottom of said cavity in a spaced relation above said bottom base plate, said inner elements also including stationary portions shorter in height than said outer elements relative to said bottom base plate so as to adapt said portions of said inner elements to seat the fan unit thereupon within said cavity.

Claim 23

A heat sink for use in holding for a self-contained motorized fan unit in a heat transferring relation to an electronic component, said heat sink comprising: (a) a bottom base plate adapted for placement upon the electronic component; and (b) a multiplicity of elements defining a peripheral envelope and a cavity within said envelope adapted for seating the self-contained motorized fan unit; (c) said multiplicity of elements including at least a pair of outer elements attached on said bottom base plate and extending upwardly therefrom, each of said outer elements being spaced from the other and disposed along one of a pair of opposite sides of said bottom base plate so as to define a pair of opposite sides of said cavity adapted to retain the fan unit therebetween; (d) said multiplicity of elements also including a plurality of inner elements attached on said bottom base plate and extending upwardly therefrom, said inner elements being spaced apart from one another disposed between said par of spaced outer elements so as to define said bottom of said cavity in a spaced relation above said bottom base plate, said inner elements also including stationary portions shorter in height than said outer elements relative to said bottom base plate so as to adapt said portions of said inner elements to seat the fan unit thereupon within said cavity.

Claim 24

The heat sink of claim 18 wherein said outer and inner elements are greater in length than in height.

Claim 25

The heat sink of claim 18 wherein portions of said inner elements disposed below said cavity are shorter in height than said outer elements.

Claim 26

The heat sink of claim 18 wherein said inner elements are substantially uniform in height throughout their lengths and are shorter in height than said outer elements.

Claim 27

The heat sink of claim 18 wherein said inner elements have central portions disposed below said cavity that are shorter in height than said outer elements and have opposite end portions disposed adjacent to opposite ends of said cavity that are of substantially the same height as said outer elements.

Claim 28

A heat sink for use in holding for a self-contained motorized fan unit in a heat transferring relation to an electronic component, said heat sink comprising: (a) a bottom base plate adapted for placement upon the electronic component; and (b) a multiplicity of elongated fins attached on said bottom base plate and extending upwardly therefrom, said multiplicity of elongated fins also extending substantially parallel with one another and being laterally spaced spaced from one another, said multiplicity of elongated fins defining a peripheral envelope and a cavity within said envelope adapted for seating the self-contained motorized fan unit; (c) said multiplicity of elongated fins including at least a pair of outer elongated fins attached on said bottom base plate and extending upwardly therefrom, each of said outer elongated fins being spaced from the other and disposed along one of a pair of opposite sides of said bottom base plate so as to define a pair of opposite sides of said cavity adapted to retain the fan unit therebetween; (d) said multiplicity of elongated fins also including a plurality of inner elongated fins attache on said bottom base plate and extending upwardly therefrom, said inner elongated fins being spaced apart from one another disposed between said pair of spaced outer elongated fins so as to define said bottom of said cavity in a spaced relation above said bottom base plate, said inner elongated fins also including stationary portions shorter in height than said outer elongated fins relative to said bottom base pale so as to adapt said portions of said inner elongated fins to seat the fan unit thereupon within said cavity.

Claim 29

A heat sink for use in holding for a self-contained motorized fan unit in a heat transferring relation to an electronic component, said heat sink comprising: (a) a bottom base plate adapted for placement upon the electronic component; and (b) a multiplicity of elongated fins attached on said bottom base plate and extending upwardly therefrom, said multiplicity of elongated fins also extending substantially parallel with one another and being laterally spaced spaced from one another, said multiplicity of elongated fins defining a peripheral envelope and a cavity within said envelope adapted for seating the self-contained motorized fan unit; (c) said multiplicity of elongated fins including at least a pair of outer elongated fins attached on said bottom base plate and extending upwardly therefrom, each of said outer elongated fins being spaced from the other and disposed along one of a pair of opposite sides of said bottom base plate so as to define a pair of opposite sides of said cavity adapted to retain the fan unit therebetween; (d) said multiplicity of elongated fins also including a plurality of inner elongated fins attache on said bottom base plate and extending upwardly therefrom, said inner elongated fins being spaced apart from one another disposed between said pair of spaced outer elongated fins so as to define said bottom of said cavity in a spaced relation above said bottom base plate, said inner elongated fins also including stationary portions shorter in height than said outer elongated fins relative to said bottom base pale so as to adapt said portions of said inner elongated fins to seat the fan unit thereupon within said cavity.

Claim 30

The heat sink of claim 23 wherein said outer and inner elongated fins are greater in length than in height.

Claim 31

The heat sink of claim 23 wherein portions of said inner elongated fins disposed below said cavity are shorter in height than said outer elongated fins.

Claim 32

The heat sink of claim 23 wherein said inner elongated fins are substantially uniform in height throughout their lengths and are shorter in height than said outer elongated fins.

Claim 33

The heat sink of claim 23 wherein said inner elongated fins have central portions disposed below said cavity that are shorter in height than said outer elongated fins and have opposite end portions disposed adjacent to opposite ends of said cavity that are of substantially the same height as said outer elongated fins.