Staggered radial-fin heat sink device for integrated circuit package

Claim 1

A heat sink device for attachment to an integrated circuit package and placed perpendicular to an impinging air flow, said device comprising: (a) a circular metallic base plate attachable to an integrated circuit package unit, and supporting a plurality of metallic fin elements wherein the said base plate includes: (a1) a hemispheric dome at the center of said base plate for the purpose of receiving and dispersing said impinging air flow directed perpendicular to said base plate; (b) said plurality of metallic fin elements equally spaced with air space interstices around the periphery of said base plate wherein said fin elements constitute a pattern of long, intermediate and short lengths oriented in the radial direction to form a repetitive sector pattern wherein said repetitive sector pattern includes: (b1) a sequence of said radial fin element lengths which follow the pattern of long-short-intermediate-short, which pattern repeats through each sector of the circumference of said heat sink device; and wherein (b2) the width of each of said plurality of fin elements is of the same dimension, and (b3) the width of each of the said air space interstices between adjacent fin elements is substantially the same as the width of each of said fin elements; (c) a central cylindrical open space situated at the central area of said base plate to permit the perpendicular impingement of said air flow onto said base plate.