US3780356A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Cooling device for semiconductor components
Assignee: Individual
•
Filing: 1972-05-10
•
Granted: 1973-12-18
•
Expires: 1992-05-10
Abstract
Abstract A device for cooling a semiconductor component comprising a chamber enclosing a non-metallic crystal forming material which experiences a phase change at a temperature which corresponds to the desired operating temperature of the semiconductor component and wherein the material is in thermal communication with the semiconductor component.
Inventors
- 👤 N Laing
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 21:58
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/73; H10W40/735; Y; Y10; Y10S; Y10S165/00; Y10S165/902
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
109 words
Apparatus for controlling the temperature of a semiconductor component during start up and operating conditions, said apparatus comprising a hermetically sealed chamber in thermal communication with a portion of said semiconductor component and a solid crystalline non-metallic material in said chamber where said material has a melting temperature within the desired operating temperature of said semiconductor component during start up and operating conditions and has a thermal conductivity less than that of a metal whereby said material during operation of said semiconductor may undergo a phase change from a solid to a liquid such that heat produced by said semiconductor is absorbed by said material during said phase change.
Claim 2
Dependent Claim
109 words
Apparatus for controlling the temperature of a semiconductor component during start up and operating conditions, said apparatus comprising a hermetically sealed chamber in thermal communication with a portion of said semiconductor component and a solid crystalline non-metallic material in said chamber where said material has a melting temperature within the desired operating temperature of said semiconductor component during start up and operating conditions and has a thermal conductivity less than that of a metal whereby said material during operation of said semiconductor may undergo a phase change from a solid to a liquid such that heat produced by said semiconductor is absorbed by said material during said phase change.
Claim 3
Dependent Claim
29 words
A cooling device according to claim 1 wherein the phase change enthalpy of said material is greater than 40 cal/g at the desired operating temperature of said semiconductor component.
Claim 4
Dependent Claim
15 words
Apparatus according to claim 2 wherein said material comprises a hydrate of a metal hydroxide.
Claim 5
Dependent Claim
31 words
Apparatus according to claim 1 having in addition a thickener mixed with said material whereby said material will remain in a gelled state at temperatures in excess of said melting temperature.
Claim 6
Dependent Claim
57 words
Apparatus according to claim 1 wherein said material comprises two substances each having different melting temperatures wherein one said substance has a melting temperature at the desired operating temperature of said semiconductor and the other said substance has a melting temperature which is below the maximum temperature to which the semiconductor component may be subjected without damage.
Claim 7
Dependent Claim
49 words
Apparatus according to claim 1 wherein said material is one that is capable of a polymorphous phase change at the desired operating temperature of said semiconductOr component and which has a melting temperature slightly below that which is the maximum temperature the semiconductor component may be subjected without destruction.
Claim 8
Dependent Claim
59 words
Apparatus according to claim 1 wherein said semiconductor is in the form of a Peltier element having a heat emitting electrode and a heat absorbing electrode wherein said heat emitting electrode is in thermal conductive communication with said material and wherein said heat absorbing electrode is in thermal conductive communication with said portion of said component to be cooled.
Claim 9
Dependent Claim
66 words
Apparatus according to claim 1 having in addition a hollow body filled with said material with one end of said body communicating with the interior of said chamber whereby the material in the end of the hollow body furtherest away from said chamber remains in the solid phase during operation of said semiconductor component to act as a seeding material to said material in said chamber.
Claim 10
Dependent Claim
24 words
Apparatus according to claim 1 having in addition a plate containing hermetically sealed thin tubes therein wherein said tubes form said hermetically sealed chamber.
References Cited (Backward Citations)
DE958140C
Cited
GB785461A
Cited
DE1041600B
Cited
US2903629A
Cited
GB914034A
Cited
US3271638A
Cited
US3328642A
Cited
US3400543A
Cited
US3476175A
Cited
US3673306A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-12-17 | 1977-06-18 | 1977-12-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-12-17 | 1981-06-18 | 1981-12-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-12-17 | 1985-06-18 | 1985-12-18 | $7700.00 | Window Closed / Lapsed |