Reduced-stress heat sink device

Claim 1

A heat sink device for facilitating a stress-reduced bond between the heat sink and the contacting surface of an integrated circuit package, said device for placement perpendicular to an impinging air flow, said heat sink device comprising: (a) a metallic base plate divided into sectors by mid-position cutouts on each peripheral edge and attachable to an integrated circuit package unit, and supporting a plurality of metallic fin elements wherein said base plate includes: (a1) a central cylindrical opening area at the base plate for the purpose of receiving and dispersing said impinging air flow directed perpendicular to said base plate; (a2) a plurality of metallic fin elements supported perpendicular to said base plate which are situated in a radial orientation from the center of said base plate and which are truncated at the center area of said base plate in order to provide said central opening area; said plurality of metallic fin elements being equally spaced around the said peripheral edges of said base plate such that said fin elements constitute a fixed pattern of different lengths oriented in the radial direction in order to form a repetitive sector pattern, wherein said repetitive sector pattern includes: (a2a) a sequence of said radial fin element lengths which follow the pattern of long - short - intermediate - short, and which pattern repeates throughout each sector of the base plate of said heat sink device such that the width-thickness of each of said plurality of fin elements is of the same dimension and width as each of the air space interstices between adjacent fin elements; (a3) and wherein each peripheral edge of said base plate has a mid-position cutout oriented in the radial direction which establishes a first side and a second side for said cutout; (a4) a plurality of radial fin bridging elements of inverted "U-shaped" form, each of which provides first and second vertical legs for connection to said first side and the said second side of said mid-position cutouts thus effectively diminishing the contact length of each of said peripheral edges.