Heat sinking apparatus for surface mountable power devices

Claim 1

A heat sinking apparatus for use with a surface mountable power device, wherein the surface mountable power device is thermally coupled to a thermal plane of a substrate and wherein the surface mountable power device has a predetermined package size, the heat sinking apparatus comprises: a first planar surface having a predetermined surface area; at least a first gull-wing mounting tab and second gull-wing mounting tab, wherein the at least a first gull-wing mounting tab and second gull-wing mounting tab are substantially parallel to the first planar surface and are on a different plane than the first planar surface; at least a first connective leg and second connective leg, each having a predetermined length and each having a slot of predetermined dimensions, the first connective leg and the second connective leg are thermally and physically coupled to the first planar surface and the at least a first gull-wing mounting tab and second gull-wing mounting tab; wherein the first planar surface, the at least a first gull-wing mounting tab and second gull-wing mounting tab, and the first connective leg and second connective leg are comprised of a thermally conductive material such that the heat sinking apparatus is auto pick and placeable on the substrate with the first planar surface being substantially parallel to the substrate, wherein inner dimensions of the heat sinking apparatus are in the range of at least as great as the predetermined packaged size of the surface mountable power device and less than three times the predetermined package size such that the surface mountable power device is at least partially encased by the heat sinking apparatus, and such that a substantial portion of heat generated by the surface mountable power device is thermally transferred through the thermal plane of the substrate to the heat sinking apparatus, and a clip-on heat sink extension having a predetermined geometric shape that mates with the slots of the at least a first connective leg and second connective leg such that the heat sinking apparatus provides further heat dissipation for the surface mountable power device.

Claim 3

A method for heat sinking a surface mountable power device that is thermally coupled to a thermal plane of a substrate, the method comprises the steps of: a) fabricating a heat sinking apparatus that has a first planar surface, first and second gull-wing mounting tabs and first and second connective legs, wherein the first and second connective legs are thermally and physically coupled to the first and second gull-wing mounting tabs and the first planar surface; b) auto picking and placing the heat sinking apparatus onto the substrate such that the heat sinking apparatus at least partially encases the surface mountable power device; c) securing the heat sinking apparatus into position such that a substantial portion of heat generated by the surface mountable power device is thermally transferred through the thermal plane of the substrate to the heat sinking apparatus d) fabricating a slot having predetermined dimensions in each of the first and second connective legs; and e) clipping on a heat sink extension having a predetermined geometric shape to the slots of the first and second connective legs such that the heat sinking apparatus provides further heat dissipation for the surface mountable power device.

Claim 4

A method for heat sinking a surface mountable power device that is thermally coupled to a thermal plane of a substrate, the method comprises the steps of: a) fabricating a heat sinking apparatus that has a first planar surface, first and second gull-wing mounting tabs and first and second connective legs, wherein the first and second connective legs are thermally and physically coupled to the first and second gull-wing mounting tabs and the first planar surface; b) auto picking and placing the heat sinking apparatus onto the substrate such that the heat sinking apparatus at least partially encases the surface mountable power device; c) securing the heat sinking apparatus into position such that a substantial portion of heat generated by the surface mountable power device is thermally transferred through the thermal plane of the substrate to the heat sinking apparatus d) fabricating a slot having predetermined dimensions in each of the first and second connective legs; and e) clipping on a heat sink extension having a predetermined geometric shape to the slots of the first and second connective legs such that the heat sinking apparatus provides further heat dissipation for the surface mountable power device.