Patent US5691041A successfully refreshed from Google Patents.
US5691041A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer
Assignee: International Business Machines Corp
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Filing: 1995-09-29
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Granted: 1997-11-25
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Expires: 2015-09-29
Abstract
Abstract A socket for attaching a flip chip die or ball grid array devices to a printed circuit board substrate having a pattern of solder covered lands, with resources for removing the flip chip die or ball grid array device, resources for directly aligning the solder balls of the flip chip die or ball grid array device to the printed circuit board, resources for using an interposer of dendrite coated vias or pads to electrically and physically connect the solder balls of the flip chip die or ball grid array devices to the solder deposits of the printed circuit board, resources for having the interposer reconfigure the wiring for testing or replacement purposes, resources for utilizing the flexibility and resilience of the interposer to improve dendrite connections, and resources for heat sinking the flip chip die or ball grid array device by direct thermal contact. The socket applies an evenly distributed force to connect the aligned flip chip die or ball grid array device solder ball pattern to the underlying printed circuit board solder deposit pattern through dendrite penetration of the solder using an interposer situated between and aligned to each such solder pattern.
Inventors
- 👤 Richard Francis Frankeny
- 👤 Jerome Albert Frankeny
- 👤 Danny Edward Massey
- 👤 Keith Allan Vanderlee
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 12:19
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1053; H05K7/1061; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/52; H05K3/00; H05K3/30; H05K3/32; H05K3/325; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
138 words
A socket apparatus, comprising: a planar interposer of flexible dielectric material having a multiplicity of vias or pads covered with dendrites, which vias or pads are distributed in an array pattern substantially conforming to an array pattern of balls on a surface of an electronic ball grid array device; a rigid cap with a planar surface alignable to be substantially coplanar with the surface of the ball grid array device; means for aligning the array pattern of balls on the ball grid array device with the planar interposer and with an array pattern of contact regions on a board; and means for translating the cap to compress the ball grid array device, the interposer, and the contact regions of the board adequately to cause dendrite penetration into ball grid array device balls and contact regions on the board.
Claim 2
Dependent Claim
138 words
A socket apparatus, comprising: a planar interposer of flexible dielectric material having a multiplicity of vias or pads covered with dendrites, which vias or pads are distributed in an array pattern substantially conforming to an array pattern of balls on a surface of an electronic ball grid array device; a rigid cap with a planar surface alignable to be substantially coplanar with the surface of the ball grid array device; means for aligning the array pattern of balls on the ball grid array device with the planar interposer and with an array pattern of contact regions on a board; and means for translating the cap to compress the ball grid array device, the interposer, and the contact regions of the board adequately to cause dendrite penetration into ball grid array device balls and contact regions on the board.
Claim 3
Dependent Claim
31 words
The apparatus recited in claim 1, further comprising: a stiffener with a planar surface; and means for positioning the cap planar surface and the stiffener planar surfaces to be substantially coplanar.
Claim 4
Dependent Claim
27 words
The apparatus recited in claim 1, wherein the means for aligning is a set of alignment pins located with reference to the contact regions on the board.
Claim 5
Dependent Claim
27 words
The apparatus recited in claim 2, wherein the means for aligning is a set of alignment pins located with reference to the contact regions on the board.
Claim 6
Dependent Claim
24 words
The apparatus recited in claim 3, wherein the planar interposer is comprised of multiple layers with patterned electrical paths connecting selected vias or pads.
Claim 7
Dependent Claim
24 words
The apparatus recited in claim 4, wherein the planar interposer is comprised of multiple layers with patterned electrical paths connecting selected vias or pads.
Claim 8
Dependent Claim
20 words
The apparatus recited in claim 5, wherein the pattern of contact regions on the board is comprised of solder lands.
Claim 9
Dependent Claim
20 words
The apparatus recited in claim 6, wherein the pattern of contact regions on the board is comprised of solder lands.
Claim 10
Dependent Claim
24 words
The apparatus recited in claim 1, wherein the means for translating is selectively adjustable as to compression and applies force central to the cap.
Claim 11
Dependent Claim
24 words
The apparatus recited in claim 2, wherein the means for translating is selectively adjustable as to compression and applies force central to the cap.
Claim 12
Dependent Claim
34 words
The apparatus recited in claim 9, wherein the means for aligning the pattern of balls on the surface of the ball grid array device mates with the balls of the ball grid array device.
Claim 13
Dependent Claim
35 words
The apparatus recited in claim 10, wherein the means for aligning the pattern of the balls on the surface of the ball grid array device mates with the balls of the ball grid array device.
Claim 14
Dependent Claim
24 words
The apparatus recited in claim 3, wherein the means for translating is selectively adjustable as to compression and applies force central to the cap.
Claim 15
Dependent Claim
24 words
The apparatus recited in claim 4, wherein the means for translating is selectively adjustable as to compression and applies force central to the cap.
Claim 16
Dependent Claim
32 words
The apparatus recited in claim 14, wherein the alignment pins are connected to the stiffener for extension through and alignment with the board, and the cap is a thermally conductive heat sink.
Claim 17
Dependent Claim
24 words
The apparatus recited in claim 15, wherein the planar interposer is composed of multiple layers of patterned electrical paths connecting selected vias or pads.
References Cited (Backward Citations)
US4381131A
Cited
US4679118A
Cited
US4748495A
Cited
US4652973A
Cited
US4759491A
Cited
JPS6465860A
Cited
US4932883A
Cited
US5137461A
Cited
US4927369A
Cited
US4933808A
Cited
US4954878A
Cited
US4923404A
Cited
US5280191A
Cited
US5123850A
Cited
US5207585A
Cited
US5161983A
Cited
US5163837A
Cited
US5258648A
Cited
US5215472A
Cited
US5221209A
Cited
US5171290A
Cited
US5199889A
Cited
US5232372A
Cited
US5237743A
Cited
US5248262A
Cited
US5313097A
Cited
US5302853A
Cited
US5363275A
Cited
US5397919A
Cited
US5313099A
Cited
US5413489A
Cited
US5477161A
Cited
US5397245A
Cited
US5468157A
Cited
US5468158A
Cited
US5468996A
Cited
US5419710A
Cited
US5451165A
Cited
US5493475A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-11-24 | 2001-05-26 | 2001-11-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-11-24 | 2005-05-26 | 2005-11-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-11-24 | 2009-05-26 | 2009-11-25 | $7700.00 | Window Closed / Lapsed |