Leadless grid array socket

Claim 2

A leadless grid array interconnection device for connecting an integrated circuit and a printed circuit board, wherein said integrated circuit comprises an integrated circuit leadless grid array, wherein said integrated circuit leadless grid array comprises a plurality of integrated circuit contact pads and said printed circuit board comprises a plurality of printed circuit board contact pads, and wherein the pattern of said printed circuit board contact pads corresponds to the pattern of said integrated circuit leadless grid array, said leadless grid array interconnection device comprising: a. conductive element array comprising a plurality of conductive elements connectable to said integrated circuit contact pads and said printed circuit board contact pads; and b. a removable insulative component comprising a plurality of socket cavities, each of said socket cavities formed for fully surrounding one of said conductive elements, wherein said insulative component is designed to be removably affixed to said printed circuit board, and wherein the pattern of said socket cavities corresponds to the pattern of said plurality of printed circuit board contact pads, said insulative component being removable from said printed circuit board while leaving said conductive element array connected to said printed circuit board contact pads to enable inspection of said conductive elements.

Claim 3

The device as claimed in claim 1 wherein said insulative component also comprises a plurality of retention legs, wherein said retention legs are designed to be removably retained within retention cavities of said printed circuit board.

Claim 4

The device as claimed in claim 1 further comprising a compression lid, wherein said compression lid is designed to be placed on said integrated circuit and then detachably affixed to said printed circuit board such that said compression lid forces said plurality of integrated circuit contact pads onto said plurality of conductive elements so as to provide electrical contact between said integrated circuit contact pads and said conductive elements.

Claim 5

The device as claimed in claim 3 wherein a lid stiffener is affixed to said compression lid, wherein said lid stiffener is designed to provide equal distribution of compression force on said conductive elements.

Claim 6

The device as claimed in claim 1 wherein said conductive elements are S-shaped spring members.

Claim 7

The device as claimed in claim 1 wherein said conductive elements are C-shaped spring members.

Claim 8

The device as claimed in claim 1 wherein said insulative component is made of a liquid-crystal polymer.

Claim 9

The device as claimed in claim 1 wherein said socket cavities comprise chamfered lead-in walls.

Claim 10

The leadless grid array interconnection device as claimed in claim 1 further comprising means for distributing said conductive elements among said socket cavities so as to avoid contacting said conductive elements with interior walls of said socket cavities.

Claim 11

The device as claimed in claim 9 wherein said means for distributing said conductive elements into said socket cavities is a flexible carrier, wherein said flexible carrier is detachably affixable to said plurality of conductive elements, and wherein said flexible carrier comprises means for temporarily retaining said conductive elements on said flexible carrier such that said conductive elements are spatially distributed with respect to one another in a manner corresponding to the design of said integrated circuit leadless grid array.

Claim 12

The device as claimed in claim 10 wherein said flexible carrier is a high-temperature plastic and said means for retaining said elements is an adhesive.

Claim 13

The device as claimed in claim 10 wherein said flexible carrier is a metal film and said conductive elements are mechanically affixed to said metal film.

Claim 14

A leadless grid array interconnection device for connecting a plurality of integrated circuits with a printed circuit board, wherein each of said plurality of integrated circuits comprises an integrated circuit leadless grid array, and wherein each of said integrated circuit leadless grid arrays comprises a plurality of integrated circuit contact pads and said printed circuit board comprises a plurality of printed circuit board contact pads, said leadless grid array interconnection device comprising: a. a plurality of conductive element arrays corresponding in number to the number of said integrated circuits, wherein each of said plurality of conductive element arrays comprises a plurality of conductive elements connectable to said integrated circuit contact pads and said printed circuit board contact pads; and b. a plurality of removable insulative components corresponding in number to the number of said conductive element arrays, wherein each of said insulative components comprises a plurality of socket cavities, each of said socket cavities formed for fully surrounding one of said conductive elements, wherein at least one of said plurality of removable insulative components comprises a plurality of retention legs, wherein said plurality of retention legs removably affixes said plurality of removable insulative components to said printed circuit board in a manner such that a variable number of said integrated circuits, and said printed circuit board, may be stacked one on top of another and electrically connected, and wherein the pattern of said socket cavities corresponds to the pattern of said integrated circuit contact pads and said printed circuit board contact pads, each of said insulative components being removable from said printed circuit board while leaving said plurality of conductive element arrays connected to said printed circuit board contact pads or to said integrated circuit contact pads to enable inspection of said conductive elements.

Claim 15

A leadless grid array interconnection device for connecting a plurality of integrated circuits with a printed circuit board, wherein each of said plurality of integrated circuits comprises an integrated circuit leadless grid array, and wherein each of said integrated circuit leadless grid arrays comprises a plurality of integrated circuit contact pads and said printed circuit board comprises a plurality of printed circuit board contact pads, said leadless grid array interconnection device comprising: a. a plurality of conductive element arrays corresponding in number to the number of said integrated circuits, wherein each of said plurality of conductive element arrays comprises a plurality of conductive elements connectable to said integrated circuit contact pads and said printed circuit board contact pads; and b. a plurality of removable insulative components corresponding in number to the number of said conductive element arrays, wherein each of said insulative components comprises a plurality of socket cavities, each of said socket cavities formed for fully surrounding one of said conductive elements, wherein at least one of said plurality of removable insulative components comprises a plurality of retention legs, wherein said plurality of retention legs removably affixes said plurality of removable insulative components to said printed circuit board in a manner such that a variable number of said integrated circuits, and said printed circuit board, may be stacked one on top of another and electrically connected, and wherein the pattern of said socket cavities corresponds to the pattern of said integrated circuit contact pads and said printed circuit board contact pads, each of said insulative components being removable from said printed circuit board while leaving said plurality of conductive element arrays connected to said printed circuit board contact pads or to said integrated circuit contact pads to enable inspection of said conductive elements.

Claim 16

The leadless grid array interconnection device as claimed in claim 13 furthering comprising means for distributing said plurality of conductive elements among said socket cavities so as to avoid contacting said conductive elements with interior walls of said socket cavities.

Claim 17

A leadless grid array interconnection device for connecting an integrated circuit and a printed circuit board, wherein said integrated circuit comprises an integrated circuit leadless grid array, wherein said integrated circuit leadless grid array comprises a plurality of integrated circuit contact pads and said printed circuit board comprises a plurality of printed circuit board contact pads, and wherein the pattern of said printed circuit board contact pads corresponds to the pattern of said integrated circuit leadless grid array, said leadless grid array interconnection device comprising: a. a plurality of S-shaped conductive elements, each comprising a top conductor surface and a bottom conductor surface, wherein any one of said conductive elements is: i. connectable by said top conductor surface to any one of said plurality of integrated circuit contact pads; and ii. connectable by said bottom conductor surface to any one of said plurality of printed circuit board contact pads; b. a removable insulative component formed of a liquid-crystal polymer, said insulative component comprising a plurality of socket cavities, wherein said insulative component comprises a plurality of retention legs which removably affix said insulative component to said printed circuit board, and wherein the pattern of said socket cavities corresponds to the pattern of said printed circuit board contact pads; c. a flexible carrier for distributing said conductive elements among said socket cavities such that said conductive elements do not contact interior walls of said socket cavities, wherein said flexible carrier is detachably affixed to said top conductor surfaces of said plurality of conductive elements, wherein said flexible carrier is made of a high-temperature plastic, wherein said flexible carrier comprises an adhesive for retaining said conductive elements on said flexible carrier such that said conductive elements are spatially distributed with respect to one another in a manner corresponding to the pattern of said printed circuit board contact pads; and d. a compression lid placeable on said integrated circuit and detachably affixable to said printed circuit board, wherein said compression lid is designed to force said integrated circuit contact pads onto said plurality of conductive elements so as to provide electrical contact between said integrated circuit contact pads and said conductive elements.

Claim 18

A leadless grid array interconnection device for connecting an integrated circuit and a printed circuit board, wherein said integrated circuit comprises an integrated circuit leadless grid array, wherein said integrated circuit leadless grid array comprises a plurality of integrated circuit contact pads and said printed circuit board comprises a plurality of printed circuit board contact pads, and wherein the pattern of said printed circuit board contact pads corresponds to the pattern of said integrated circuit leadless grid array, said leadless grid array interconnection device comprising: a. a plurality of S-shaped conductive elements, each comprising a top conductor surface and a bottom conductor surface, wherein any one of said conductive elements is: i. connectable by said top conductor surface to any one of said plurality of integrated circuit contact pads; and ii. connectable by said bottom conductor surface to any one of said plurality of printed circuit board contact pads; b. a removable insulative component formed of a liquid-crystal polymer, said insulative component comprising a plurality of socket cavities, wherein said insulative component comprises a plurality of retention legs which removably affix said insulative component to said printed circuit board, and wherein the pattern of said socket cavities corresponds to the pattern of said printed circuit board contact pads; c. a flexible carrier for distributing said conductive elements among said socket cavities such that said conductive elements do not contact interior walls of said socket cavities, wherein said flexible carrier is detachably affixed to said top conductor surfaces of said plurality of conductive elements, wherein said flexible carrier is made of a high-temperature plastic, wherein said flexible carrier comprises an adhesive for retaining said conductive elements on said flexible carrier such that said conductive elements are spatially distributed with respect to one another in a manner corresponding to the pattern of said printed circuit board contact pads; and d. a compression lid placeable on said integrated circuit and detachably affixable to said printed circuit board, wherein said compression lid is designed to force said integrated circuit contact pads onto said plurality of conductive elements so as to provide electrical contact between said integrated circuit contact pads and said conductive elements.

Claim 19

An improved method of connecting an integrated circuit to a printed circuit board, wherein said integrated circuit comprises an integrated circuit leadless grid array, wherein said integrated circuit leadless grid array comprises a plurality of integrated circuit contact pads and said printed circuit board comprises a plurality of printed circuit board contact pads, and wherein the pattern of said printed circuit board contact pads corresponds to the pattern of said integrated circuit leadless grid array, comprising the steps of: a. affixing a removable insulative component to said printed circuit board, wherein said removable insulative component comprises a plurality of socket cavities, and wherein the pattern of said socket cavities corresponds to the pattern of said printed circuit board contact pads; b. distributing a plurality of conductive elements among said socket cavities of said affixed removable insulative component such that said conductive elements do not contact interior walls of said socket cavities, wherein each of said socket cavities is formed for fully surrounding one of said conductive element; c. affixing said conductive elements to said printed circuit board contact pads; and d. connecting said conductive elements to said integrated circuit contact pads, said insulative component being removable from said printed circuit board while leaving said conductive elements connected to said printed circuit board contact pads to enable inspection of said conductive elements.

Claim 20

An improved method of connecting an integrated circuit to a printed circuit board, wherein said integrated circuit comprises an integrated circuit leadless grid array, wherein said integrated circuit leadless grid array comprises a plurality of integrated circuit contact pads and said printed circuit board comprises a plurality of printed circuit board contact pads, and wherein the pattern of said printed circuit board contact pads corresponds to the pattern of said integrated circuit leadless grid array, comprising the steps of: a. affixing a removable insulative component to said printed circuit board, wherein said removable insulative component comprises a plurality of socket cavities, and wherein the pattern of said socket cavities corresponds to the pattern of said printed circuit board contact pads; b. distributing a plurality of conductive elements among said socket cavities of said affixed removable insulative component such that said conductive elements do not contact interior walls of said socket cavities, wherein each of said socket cavities is formed for fully surrounding one of said conductive element; c. affixing said conductive elements to said printed circuit board contact pads; and d. connecting said conductive elements to said integrated circuit contact pads, said insulative component being removable from said printed circuit board while leaving said conductive elements connected to said printed circuit board contact pads to enable inspection of said conductive elements.

Claim 21

The method as claimed in claim 16 further comprising the step of securing said integrated circuit to said top conductor surfaces with a compression lid, wherein said compression lid is detachably affixable to said printed circuit board.

Claim 22

The method as claimed in claim 16 wherein the step of affixing said conductive elements to said printed circuit board contact pads is achieved by reflow soldering said conductive elements to said printed circuit board contact pads.

Claim 23

The method as claimed in claim 16 further comprising the step of retaining said conductive elements on a flexible carrier, wherein said flexible carrier is used to distribute said conductive elements among said socket cavities, wherein said flexible carrier is made of a high-temperature plastic.

Claim 24

The method as claimed in claim 16 further comprising the intermediate step of temporarily removing said insulative component and inspecting the contact between said conductive elements and said printed circuit board contact pads.