Socket for semiconductor package

Abstract

Abstract PURPOSE:To improve an EB tester in resolusion and enable a failure analysis of a semiconductor package by a method wherein an opening is provided to a part of a cover which corresponds to the position of a semiconductor chip built inside a semiconductor package and a clamper is made to clamp the cover at the position lower than the semiconductor package. CONSTITUTION:A recessed part 4 where a semiconductor package 10 is fitted is provided to the upper face of a base 1 and a upper end 5a of a contact pin 5 is extracted and protrudes from the rear of the recessed part 4. Both ends of the base 1 are made to be steps 6 lower than the part where the recessed part 4 is provided. A cover 2 is formed into such a shape that its both ends are made to be steps 7 lower than its center part as well as the base 1 and it is hat-shaped in a side view, and the steps 6 are made to be jointed with the steps 7 when the package 10 is pressed down by clamping through the clamper 3. The center part of the cover 2 is bored to provide a window 8, so that the inside of the package 10 can be observed through the window 8. By these processes, an objective lens 20 of a EB tester can be improved in resolution by making it approach the cover and a failure analysis can be easily performed as well.

Inventors

• 👤 Yutaka Kadoya

Bibliographic Details