Interconnect structure with programmable IC for interconnecting electronic components, including circuitry for controlling programmable IC

Claim 1

Structure comprising: an interconnect substrate; a plurality of component contacts formed on said interconnect substrate for receipt of electronic components; a plurality of electrically conductive traces formed on said interconnect substrate, each trace being electrically connected to a corresponding one of said component contacts; at least one programmable integrated circuit connected to said interconnect substrate, said at least one integrated circuit comprising a plurality of separate conductive leads, each of at least two of said conductive leads being electrically connected to a corresponding one of said electrically conductive traces formed on said interconnect substrate, said at least one integrated circuit also containing a plurality of electrically programmable elements for forming electrically conductive paths between selected ones of said conductive leads on said at least one programmable integrated circuit, said at least one programmable integrated circuit thereby being configurable by a user to interconnect selected electrically conductive traces on said interconnect substrate to achieve a desired electrical function from the electronic components to be connected to said interconnect substrate; and means for transmitting control signals to said at least one programmable integrated circuit to control the configuration of said at least one programmable integrated circuit so as to control the interconnection of the conductive traces formed on said interconnect substrate.