EP0310357A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Customizable circuitry
Assignee: Microelectronics and Computer Technology Corp
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Filing: 1988-09-28
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Granted: —
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Expires: 2008-09-28
Abstract
Abstract A customizable circuit using a programmable interconnect and a compatible TAB chip bonding design. The programmable interconnect comprises layers of wire segments forming programmable junctions rather than continuous wires. This segmentation is performed with an offset from line to line in each layer such that the ends of the segments in each layer form along diagonal lines having a pitch determined by the basic wire segment length. The terminal ends of each of these segments are positioned in a plane such that the segments may be connected by short lengths to form the desired interconnect. The links which join the line segments represent the customization of the otherwise undedicated interconnect. The TAB chip bonding design uses a carrier tape to bond the integrated circuit chips to the programmable interconnect. Also disclosed are methods for forming the interconnect and the TAB chip bonding design.
Inventors
- 👤 David H. Carey
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-29 11:23
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H05; H05K; H05K1/00; H05K1/02; H05K1/0286; H05K1/0287; H05K1/0289; H10W70/62; H10W70/641; H10W70/67; H10W70/68; H10W70/685; H10W70/688; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
137 words
A customizable circuit, comprising: an interconnect for connecting electrical components, comprising: a first set of essentially parallel wire segments; a second set of essentially parallel wire segments non-planar and non-parallel to said first set of wire segments; and a plurality of accessible programmable junctions formed from the terminal ends of intersecting wire segments, said plurality of programmable junctions forming a plurality of diagonally extending programming tracks wherein said wire segments are adaptable for selective linkage at said programmable junctions; a carrier film bonded to said interconnect; and an integrated circuit chip bonded to said carrier film by a plurality of leads extending from said carrier film to said interconnect, wherein the bondsite areas of adjacent leads are staggered with respect to one another along a generally extending axis joining the center points of each of said bondsites.
Claim 2
Dependent Claim
137 words
A customizable circuit, comprising: an interconnect for connecting electrical components, comprising: a first set of essentially parallel wire segments; a second set of essentially parallel wire segments non-planar and non-parallel to said first set of wire segments; and a plurality of accessible programmable junctions formed from the terminal ends of intersecting wire segments, said plurality of programmable junctions forming a plurality of diagonally extending programming tracks wherein said wire segments are adaptable for selective linkage at said programmable junctions; a carrier film bonded to said interconnect; and an integrated circuit chip bonded to said carrier film by a plurality of leads extending from said carrier film to said interconnect, wherein the bondsite areas of adjacent leads are staggered with respect to one another along a generally extending axis joining the center points of each of said bondsites.
Claim 3
Dependent Claim
75 words
An interconnect for connecting electrical components, comprising: a first set of essentially parallel wire segments; a second set of essentially parallel wire segments non-planar and non-parallel to said first set of wire segments; and a plurality of accessible programmable junctions formed from the terminal ends of intersecting wire segments, said plurality of programmable junctions forming a plurality of diagonally extending programming tracks, wherein said wire segments are adaptable for selective linkage at said programmable junctions.
Claim 4
Dependent Claim
75 words
An interconnect for connecting electrical components, comprising: a first set of essentially parallel wire segments; a second set of essentially parallel wire segments non-planar and non-parallel to said first set of wire segments; and a plurality of accessible programmable junctions formed from the terminal ends of intersecting wire segments, said plurality of programmable junctions forming a plurality of diagonally extending programming tracks, wherein said wire segments are adaptable for selective linkage at said programmable junctions.
Claim 5
Dependent Claim
31 words
An interconnect as claimed in Claim 2, further comprising a customization layer above said first and second sets of wire segments, said customization layer comprising regions for accessing said programmable junctions.
Claim 6
Dependent Claim
17 words
An interconnect as claimed in Claim 3, wherein said access regions are continuous across said customization layer.
Claim 7
Dependent Claim
20 words
An interconnect as claimed in Claim 3, wherein said access regions comprise a plurality of apertures in said customization layer.
Claim 8
Dependent Claim
17 words
An interconnect as claimed in Claim 3, wherein said programmable junctions are coplanar with said customization layer.
Claim 9
Dependent Claim
21 words
An interconnect as claimed in Claim 2, wherein said programmable junctions are coplanar with the upper layer of said wire segments.
Claim 10
Dependent Claim
18 words
An interconnect as claimed in Claim 2, wherein said first and second sets of wire segments are orthogonal.
Claim 11
Dependent Claim
25 words
An interconnect as claimed in Claim 8, wherein said programming tracks are parallel and extend at a 45 degree angle to said orthogonal wire segments.
Claim 12
Dependent Claim
16 words
An interconnect as claimed in Claim 3, wherein said customization layer further comprises additional wire segments.
Claim 13
Independent Claim
96 words
A method for forming an interconnect for receiving and electrically connecting electrical components, comprising the steps of: preparing a programmable interconnect for connecting electrical components, comprising a first set of essentially parallel wire segments, a second set of essentially parallel wire segments non-planar and non-parallel to said first set of wire segments, a plurality of accessible programmable junctions formed from the terminal ends of intersecting wire segments, said plurality of programmable junctions forming a plurality of diagonally extending programming tracks; and customizing said programmable interconnect by selectively for linking said wire segments at said programmable junctions.
Claim 14
Independent Claim
96 words
A method for forming an interconnect for receiving and electrically connecting electrical components, comprising the steps of: preparing a programmable interconnect for connecting electrical components, comprising a first set of essentially parallel wire segments, a second set of essentially parallel wire segments non-planar and non-parallel to said first set of wire segments, a plurality of accessible programmable junctions formed from the terminal ends of intersecting wire segments, said plurality of programmable junctions forming a plurality of diagonally extending programming tracks; and customizing said programmable interconnect by selectively for linking said wire segments at said programmable junctions.
Claim 15
Independent Claim
110 words
A method for forming an interconnect for receiving and electrically connecting electrical components, comprising the steps of: preparing a programmable interconnect for connecting electrical components, comprising a first set of essentially parallel wire segments, a second set of essentially parallel wire segments non planar and non-parallel to said first set of wire segments, a plurality of accessible programmable junctions formed from the terminal ends of intersecting wire segments, said plurality of programmable junctions forming a plurality of diagonally extending programming tracks, and means for linking said wire segments at said programmable junctions; and customizing said programmable interconnect by removing said linking means between selective terminal ends of said wire segments.
Claim 16
Independent Claim
110 words
A method for forming an interconnect for receiving and electrically connecting electrical components, comprising the steps of: preparing a programmable interconnect for connecting electrical components, comprising a first set of essentially parallel wire segments, a second set of essentially parallel wire segments non planar and non-parallel to said first set of wire segments, a plurality of accessible programmable junctions formed from the terminal ends of intersecting wire segments, said plurality of programmable junctions forming a plurality of diagonally extending programming tracks, and means for linking said wire segments at said programmable junctions; and customizing said programmable interconnect by removing said linking means between selective terminal ends of said wire segments.
Claim 17
Dependent Claim
85 words
A tape automated bonding chip design, comprising: a carrier film; an integrated circuit chip positioned on said carrier film; and a plurality of leads extending parallel from said chip and attached to said carrier film, said plurality of leads comprising an inner lead bonding portion and an outer lead bonding portion which includes a bondsite area, wherein the bondsite areas of adjacent leads are staggered, with respect to one another, along a generally diagonally extending axis joining the center points of each of said bondsites.
Claim 18
Dependent Claim
85 words
A tape automated bonding chip design, comprising: a carrier film; an integrated circuit chip positioned on said carrier film; and a plurality of leads extending parallel from said chip and attached to said carrier film, said plurality of leads comprising an inner lead bonding portion and an outer lead bonding portion which includes a bondsite area, wherein the bondsite areas of adjacent leads are staggered, with respect to one another, along a generally diagonally extending axis joining the center points of each of said bondsites.
Claim 19
Dependent Claim
22 words
A chip design as claimed in Claim 13, further comprising a window through said carrier film corresponding to each of said boundaries.
Claim 20
Dependent Claim
21 words
A chip design as claimed in Claim 13, wherein said staggered rows of bondsites repeat along the width of the chip.
Claim 21
Dependent Claim
23 words
A chip design as claimed in Claim 14, wherein said window comprises a continuous window along an entire row of said staggered bondsites.
Claim 22
Independent Claim
66 words
A method for bonding the outer leads of a tape automated bonding chip to an underlying interconnect having generally diagonally extending programming tracks, comprising the step of bonding an integrated circuit chip to an underlying interconnect at a plurality of bondsites of adjacent leads, said bondsites being staggered with respect to one another along a diagonal center line extending through the center points of said bondsites.
Claim 23
Independent Claim
66 words
A method for bonding the outer leads of a tape automated bonding chip to an underlying interconnect having generally diagonally extending programming tracks, comprising the step of bonding an integrated circuit chip to an underlying interconnect at a plurality of bondsites of adjacent leads, said bondsites being staggered with respect to one another along a diagonal center line extending through the center points of said bondsites.
Claim 24
Independent Claim
25 words
A method as claimed in Cliam 17, wherein said bonding comprises providing a solder bump to electrically connect said bondsite lead to said underlying interconnect.
Claim 25
Dependent Claim
36 words
A method as claimed in Claim 18, where said chip comprises a carrier film supporting said leads, said film comprising windows corresponding to said bondsites to allow for direct contact between said lead and said interconnect.
Claim 26
Dependent Claim
35 words
A method as claimed in Claim 18, comprising the further step of placing a solder mask between said inteconnect and said chip and aligning said chip, said mask and said interconnect to form said boundaries.
References Cited (Backward Citations)
No citation records indexed.
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