US5504354A — Interconnect substrate with circuits for field-pr…

Claim 1

Independent Claim 194 words

Structure comprising: an interconnect substrate; a plurality of component contacts formed on said interconnect substrate for receipt of electronic components; a plurality of electrically conductive traces formed on said interconnect substrate, each trace being electrically connected to a corresponding one of said component contacts; and at least one integrated circuit mounted on a selected portion of said interconnect substrate, said at least one integrated circuit comprising a plurality of separate conductive leads extending in one direction, at least one of said conductive leads being divided into at least two electrically separate conductive segments, at least one of said conductive leads or segments being electrically connected to a corresponding one of said electrically conductive traces formed on said interconnect substrate, said at least one integrated circuit also containing a plurality of electrically programmable elements for forming electrically conductive paths between selected ones of said corresponding conductive leads or segments on said at least one integrated circuit, said at least one integrated circuit thereby being configurable by a user to interconnect selected electrically conductive traces on said interconnect substrate to achieve a desired electrical function from the electronic components to be connected to said interconnect substrate.

Claim 2

Dependent Claim 194 words

Structure comprising: an interconnect substrate; a plurality of component contacts formed on said interconnect substrate for receipt of electronic components; a plurality of electrically conductive traces formed on said interconnect substrate, each trace being electrically connected to a corresponding one of said component contacts; and at least one integrated circuit mounted on a selected portion of said interconnect substrate, said at least one integrated circuit comprising a plurality of separate conductive leads extending in one direction, at least one of said conductive leads being divided into at least two electrically separate conductive segments, at least one of said conductive leads or segments being electrically connected to a corresponding one of said electrically conductive traces formed on said interconnect substrate, said at least one integrated circuit also containing a plurality of electrically programmable elements for forming electrically conductive paths between selected ones of said corresponding conductive leads or segments on said at least one integrated circuit, said at least one integrated circuit thereby being configurable by a user to interconnect selected electrically conductive traces on said interconnect substrate to achieve a desired electrical function from the electronic components to be connected to said interconnect substrate.

Claim 3

Dependent Claim 17 words

Structure as in claim 1 wherein said interconnect substrate contains more than one layer of conductive traces.

Claim 4

Dependent Claim 38 words

Structure as in claim 1 wherein at least some of said plurality of component contacts comprise a plurality of pads on said interconnect substrate, each pad being appropriate for receipt of a conductive lead of an electronic component.

Claim 5

Dependent Claim 24 words

Structure as in claim 3 wherein each pad comprises conductive material and is electrically connected to a corresponding one of said electrically conductive traces.

Claim 6

Dependent Claim 38 words

Structure as in claim 3 including a multiplicity of electronic components mounted on said interconnect substrate, each electronic component possessing at least two electrical leads, each electrical lead contacting a corresponding pad selected from said plurality of pads.

Claim 7

Dependent Claim 17 words

Structure as in claim 5 wherein said multiplicity of electronic components comprises at least one integrated circuit.

Claim 8

Dependent Claim 40 words

Structure as in claim 3 wherein at least some of said pads on said interconnect substrate comprise trace pads, each trace pad being connected to a corresponding one of said plurality of electrically conductive traces formed on said interconnect substrate.

Claim 9

Dependent Claim 52 words

Structure as in claim 7 wherein each trace pad is connected by a conductive lead to a conductive via formed through said interconnect substrate, said conductive via containing conductive material therein so as to form an electrical contact with a corresponding one of said electrically conductive traces formed on said interconnect substrate.

Claim 10

Dependent Claim 58 words

Structure as in claim 1 wherein said interconnect substrate comprises: a first portion thereof containing conductive traces for interconnecting electronic components formed thereon without the use of a programmable integrated circuit; and a second portion thereof containing at least one programmable interconnect circuit for interconnecting electronic components formed on at least said second portion of said interconnect substrate.

Claim 11

Dependent Claim 46 words

Structure as in claim 9 including means for transmitting control signals to said at least one programmable interconnect circuit to control the configuration of said at least one programmable interconnect circuit so as to control the interconnection of the conductive traces formed on said interconnect substrate.

Claim 12

Dependent Claim 13 words

Structure as in claim 1 wherein said electrically programmable elements are irreversibly programmable.

Claim 13

Dependent Claim 157 words

Structure comprising: an interconnect substrate; a plurality of component contacts formed on said interconnect substrate for receipt of electronic components; a plurality of electrically conductive traces formed on said interconnect substrate, each trace being electrically connected to a corresponding one of said component contacts; and at least one integrated circuit mounted on a selected portion of said interconnect substrate, said at least one integrated circuit comprising a plurality of separate conductive leads extending in one direction, at least one of said conductive leads being divided into at least two electrically separate conductive segments, at least one of said conductive leads or segments being electrically connected to a corresponding one of said electrically conductive traces on said interconnect substrate, said at least one integrated circuit containing active devices for testing at least one of (1) said conductive leads (2) said conductive traces (3) said electronic components to be mounted on corresponding ones of said plurality of component contacts.

Claim 14

Dependent Claim 157 words

Structure comprising: an interconnect substrate; a plurality of component contacts formed on said interconnect substrate for receipt of electronic components; a plurality of electrically conductive traces formed on said interconnect substrate, each trace being electrically connected to a corresponding one of said component contacts; and at least one integrated circuit mounted on a selected portion of said interconnect substrate, said at least one integrated circuit comprising a plurality of separate conductive leads extending in one direction, at least one of said conductive leads being divided into at least two electrically separate conductive segments, at least one of said conductive leads or segments being electrically connected to a corresponding one of said electrically conductive traces on said interconnect substrate, said at least one integrated circuit containing active devices for testing at least one of (1) said conductive leads (2) said conductive traces (3) said electronic components to be mounted on corresponding ones of said plurality of component contacts.

Claim 15

Dependent Claim 26 words

Structure as in claim 12 including at least one programmable integrated circuit mounted on said interconnect substrate to interconnect selected traces formed on said interconnect substrate.

Claim 16

Dependent Claim 133 words

A programmable interconnect chip for use in interconnecting electronic components formed on an interconnect substrate, said chip comprising: a first layer of separate conductive leads formed in a first direction over the surface of said chip, portions of selected ones of said conductive leads being connected to pads over the surface of said programmable interconnect chip, each of said pads being adapted for contact to a corresponding contact on the interconnect substrate; a second layer of separate conductive leads formed over said programmable interconnect chip in a second direction not parallel to said first direction, at least one conductive lead in at least one of said layers of conductive leads being divided into at least two electrically separate conductive segments; and means for electrically interconnecting selected ones of said conductive leads or segments.

Claim 17

Dependent Claim 133 words

A programmable interconnect chip for use in interconnecting electronic components formed on an interconnect substrate, said chip comprising: a first layer of separate conductive leads formed in a first direction over the surface of said chip, portions of selected ones of said conductive leads being connected to pads over the surface of said programmable interconnect chip, each of said pads being adapted for contact to a corresponding contact on the interconnect substrate; a second layer of separate conductive leads formed over said programmable interconnect chip in a second direction not parallel to said first direction, at least one conductive lead in at least one of said layers of conductive leads being divided into at least two electrically separate conductive segments; and means for electrically interconnecting selected ones of said conductive leads or segments.

Claim 18

Dependent Claim 58 words

Structure as in claim 14 wherein said programmable interconnect chip includes: electrically programmable elements; means for electrically connecting selected ones of said conductive leads or segments by means of said electrically programmable elements; and means for programming said electrically programmable elements in said interconnect chip so as to form desired interconnections between selected contacts on said interconnect substrate.

Claim 19

Dependent Claim 129 words

A diagnostic and test chip for use in testing electronic components and conductive traces formed on an interconnect substrate, said diagnostic and test chip comprising: a selected plurality of IO leads for use in transmitting selected signals; a multiplicity of devices formed in said diagnostic and test chip, said diagnostic and test chip comprising a plurality of separate conductive leads extending in one direction, at least one of said conductive leads being divided into at least two electrically separate conductive segments, said devices being connected to a selected number of said electronic components and said conductive traces thereby to allow signals to be applied to said plurality of IO leads to test at least one of (1) the electronic components (2) the conductive traces contained on said interconnect substrate.

Claim 20

Dependent Claim 129 words

A diagnostic and test chip for use in testing electronic components and conductive traces formed on an interconnect substrate, said diagnostic and test chip comprising: a selected plurality of IO leads for use in transmitting selected signals; a multiplicity of devices formed in said diagnostic and test chip, said diagnostic and test chip comprising a plurality of separate conductive leads extending in one direction, at least one of said conductive leads being divided into at least two electrically separate conductive segments, said devices being connected to a selected number of said electronic components and said conductive traces thereby to allow signals to be applied to said plurality of IO leads to test at least one of (1) the electronic components (2) the conductive traces contained on said interconnect substrate.

Claim 21

Dependent Claim 26 words

Structure as in claim 16 including a number of semiconductor circuit chips or electronic components connected on bonding pads formed on the surface of said substrate.

Claim 22

Dependent Claim 205 words

A diagnostic and test chip for use in testing at least one of (1) electronic components and (2) conductive traces formed on an interconnect substrate, said diagnostic and test chip comprising: a plurality of separate conductive leads extending in one direction, at least one of said conductive leads being divided into at least two electrically separate conductive segments; means for providing access by a user to a first plurality of IO leads to said diagnostic and test chip and to a second plurality of IO leads to said diagnostic and test chip; first means for storing data input into said test chip by a user; means for sampling selected electronic components formed on said interconnect substrate to determine the state of these electronic components; means for comparing the data sampled from said electronic components to the data stored in said first means for storing data to determine whether or not a match between said sampled and stored data has occurred; second means for storing the data available from said electronic components in response to a match being detected between the data stored in said first means for storing and the sampled data; and means for outputting the data stored in said second means for storing.

Claim 23

Dependent Claim 205 words

A diagnostic and test chip for use in testing at least one of (1) electronic components and (2) conductive traces formed on an interconnect substrate, said diagnostic and test chip comprising: a plurality of separate conductive leads extending in one direction, at least one of said conductive leads being divided into at least two electrically separate conductive segments; means for providing access by a user to a first plurality of IO leads to said diagnostic and test chip and to a second plurality of IO leads to said diagnostic and test chip; first means for storing data input into said test chip by a user; means for sampling selected electronic components formed on said interconnect substrate to determine the state of these electronic components; means for comparing the data sampled from said electronic components to the data stored in said first means for storing data to determine whether or not a match between said sampled and stored data has occurred; second means for storing the data available from said electronic components in response to a match being detected between the data stored in said first means for storing and the sampled data; and means for outputting the data stored in said second means for storing.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1999-04-02	1999-10-02	2000-04-02	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2003-04-02	2003-10-02	2004-04-02	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2007-04-02	2007-10-02	2008-04-02	$7700.00	Window Closed / Lapsed

Interconnect substrate with circuits for field-programmability and testing of multichip modules and hybrid circuits

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