EP0329018A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Customizable circuitry
Assignee: Microelectronics and Computer Technology Corp
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Filing: 1989-02-09
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Granted: —
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Expires: 2009-02-09
Abstract
Abstract A customizable circuit using a programmable interconnect and a compatible tape design for tape automated bonding of chips to the circuitry. The programmable interconnect comprises layers of wires, with one layer of wires forming overlap regions with the adjacent layer of wires. The wires can be selectively linked later to form the desired interconnect. The selective linkage represents the customization of an otherwise undedicated interconnect. The TAB chip bonding design uses a carrier tape to bond the integrated circuit chips to the programmable interconnect. Also disclosed is a method for forming the interconnect.
Inventors
- 👤 Lawrence Norman Smith
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-29 17:52
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/06; H05K1/00; H05K1/02; H05K1/0286; H05K1/0287; H05K1/0289
Claims Analysis
Total Claims: 38
Claim 1
Independent Claim
140 words
A customizable circuitry, comprising: an interconnect for connecting electrical components, comprising: a first set of essentially parallel wires forming a regular structure which is repeated stepwise across said interconnect, a second set of essentially parallel wires forming a regular structure which is repeated stepwise across said interconnect, said second set of wires being non-planar and non-parallel to and forming areas of wire overlap with said first set of wires, means for connecting overlapping wires at said areas of overlap, and means, positioned about said interconnect, for bonding said interconnect to an attached electrical component; and an electrical component bonded to said interconnect at a plurality of bondsites by leads extending from said electrical component, wherein said bondsites are positioned in an area array comprising a plurality of parallel rows and wherein there is a plurality of said wires between bondsites.
Claim 2
Dependent Claim
140 words
A customizable circuitry, comprising: an interconnect for connecting electrical components, comprising: a first set of essentially parallel wires forming a regular structure which is repeated stepwise across said interconnect, a second set of essentially parallel wires forming a regular structure which is repeated stepwise across said interconnect, said second set of wires being non-planar and non-parallel to and forming areas of wire overlap with said first set of wires, means for connecting overlapping wires at said areas of overlap, and means, positioned about said interconnect, for bonding said interconnect to an attached electrical component; and an electrical component bonded to said interconnect at a plurality of bondsites by leads extending from said electrical component, wherein said bondsites are positioned in an area array comprising a plurality of parallel rows and wherein there is a plurality of said wires between bondsites.
Claim 3
Dependent Claim
102 words
An interconnect for connecting electrical components, comprising: a first set of essentially parallel wires forming a regular structure which is repeated stepwise across said interconnect; a second set of essentially parallel wires forming a regular structure which is repeated stepwise across said interconnect, said second set of wires being non-planar and non-parallel to and forming areas of wire overlap with said first set of wires, means for connecting overlapping wires at said areas of overlap; and means, positioned about the interconnect, for bonding the interconnect to an attached electrical component wherein there is a plurality of said wires between said bonding means.
Claim 4
Dependent Claim
102 words
An interconnect for connecting electrical components, comprising: a first set of essentially parallel wires forming a regular structure which is repeated stepwise across said interconnect; a second set of essentially parallel wires forming a regular structure which is repeated stepwise across said interconnect, said second set of wires being non-planar and non-parallel to and forming areas of wire overlap with said first set of wires, means for connecting overlapping wires at said areas of overlap; and means, positioned about the interconnect, for bonding the interconnect to an attached electrical component wherein there is a plurality of said wires between said bonding means.
Claim 5
Dependent Claim
12 words
An interconnect as claimed in Claim 2, further comprising a conductive plane.
Claim 6
Dependent Claim
18 words
An interconnect as claimed in Claim 3, further comprising access areas through the interconnect to said conductive plane.
Claim 7
Dependent Claim
15 words
An interconnect as claimed in Claim 3, wherein said conductive plane is a power plane.
Claim 8
Dependent Claim
15 words
An interconnect as claimed in Claim 3, wherein said conductive plane is a ground plane.
Claim 9
Dependent Claim
16 words
An interconnect as claimed in Claim 2, further comprising a power plane and a ground plane.
Claim 10
Dependent Claim
19 words
An interconnect as claimed in Claim 2, further comprising a power plane, a ground plane, and a resistor plane.
Claim 11
Dependent Claim
18 words
An interconnect as claimed in Claim 4, wherein said access areas are in proximity to said bonding means.
Claim 12
Dependent Claim
24 words
An interconnect as claimed in Claim 2, further comprising an insulation layer separating said first set of wires and said second set of wires.
Claim 13
Dependent Claim
26 words
An interconnect as claimed in Claim 10, wherein said insulation layer comprises a plurality of strips of insulation extending along one of said set of wires.
Claim 14
Dependent Claim
22 words
An interconnect as claimed in Claim 11, wherein said insulative strips have sloped side surfaces of increasing width from top to bottom.
Claim 15
Dependent Claim
19 words
An interconnect as claimed in Claim 2, wherein said bonding means extends through the interconnect to said conductive plane.
Claim 16
Dependent Claim
15 words
An interconnect as claimed in Claim 2, wherein said bonding means is a bonding pad.
Claim 17
Dependent Claim
19 words
An interconnect as claimed in Claim 2, wherein said bonding means comprises a recess for receiving a bonding element.
Claim 18
Dependent Claim
30 words
An interconnect as claimed in Claim 15, wherein said bonding element extends through the interconnect and electrically connects with a conductive extension extending from the opposite side of the interconnect.
Claim 19
Dependent Claim
20 words
An interconnect as claimed in Claim 5, wherein said power plane comprises a plurality of strips extending along the interconnect.
Claim 20
Dependent Claim
14 words
An interconnect as claimed in Claim 17, wherein said power strips have different voltages.
Claim 21
Dependent Claim
16 words
An interconnect as claimed in Claim 17, wherein said power strips extend diagonally along the interconnect.
Claim 22
Dependent Claim
14 words
An interconnect as claimed in Claim 2, wherein said wires comprise a conductive material.
Claim 23
Dependent Claim
14 words
An interconnect as claimed in Claim 20, wherein said conductive material is a metal.
Claim 24
Dependent Claim
24 words
An interconnect as claimed in Claim 21, wherein said metal is selected from the group consisting of copper, aluminum, silver, gold, tungsten and molybdenum.
Claim 25
Dependent Claim
12 words
An interconnect as claimed in Claim 22, wherein said metal is copper.
Claim 26
Dependent Claim
20 words
An interconnect as claimed in Claim 10, wherein said insulation is selected from a material having a low dielectric constant.
Claim 27
Dependent Claim
20 words
An interconnect as claimed in Claim 24, wherein said insulation is selected from a polyimide, silicon oxide, or silicon nitride.
Claim 28
Dependent Claim
13 words
An interconnect as claimed in Claim 25, wherein said insulation comprises a polyimide.
Claim 29
Dependent Claim
142 words
An interconnect for connecting electrical components, comprising: a conductive plane; a first set of essentially parallel wires forming a regular structure which is repeated stepwise across said interconnect; an insulation layer extending between said conductive plane and said first set of wires; a second set of essentially parallel wires forming a regular structure which is repeated stepwise across said interconnect, said second set of wires being non-planar and non-parallel to said first set of wires and forming areas of overlap of said wires; means for connecting overlapping wires at said areas of overlap; and strips of insulation extending between said first and second set of wires in the direction of the top set of wires; and means, positioned about the interconnect, for bonding the interconnect to an attached electrical component wherein there is a plurality of said wires between said bonding means.
Claim 30
Dependent Claim
142 words
An interconnect for connecting electrical components, comprising: a conductive plane; a first set of essentially parallel wires forming a regular structure which is repeated stepwise across said interconnect; an insulation layer extending between said conductive plane and said first set of wires; a second set of essentially parallel wires forming a regular structure which is repeated stepwise across said interconnect, said second set of wires being non-planar and non-parallel to said first set of wires and forming areas of overlap of said wires; means for connecting overlapping wires at said areas of overlap; and strips of insulation extending between said first and second set of wires in the direction of the top set of wires; and means, positioned about the interconnect, for bonding the interconnect to an attached electrical component wherein there is a plurality of said wires between said bonding means.
Claim 31
Independent Claim
97 words
A method for forming an interconnect for receiving and electrically connecting electrical components, comprising the steps of: preparing a programmable interconnect for connecting electrical components, comprising a first set of essentially parallel wires, a second set of essentially parallel wires non-planar and non-parallel to and forming areas of wire overlap with said first set of wires and means positioned about said interconnect for bonding said interconnect to an attached electrical component; and customizing said programmable interconnect by selectively connecting said wires at said overlap areas and selectively cutting said wires to form a plurality of wire segments.
Claim 32
Independent Claim
97 words
A method for forming an interconnect for receiving and electrically connecting electrical components, comprising the steps of: preparing a programmable interconnect for connecting electrical components, comprising a first set of essentially parallel wires, a second set of essentially parallel wires non-planar and non-parallel to and forming areas of wire overlap with said first set of wires and means positioned about said interconnect for bonding said interconnect to an attached electrical component; and customizing said programmable interconnect by selectively connecting said wires at said overlap areas and selectively cutting said wires to form a plurality of wire segments.
Claim 33
Dependent Claim
23 words
A method as claimed in Claim 28, wherein said selective connecting step includes adding a metal link between said wires to be connected.
Claim 34
Dependent Claim
16 words
A method as claimed in Claim 28, wherein said selective cutting step comprises etching select wires.
Claim 35
Dependent Claim
110 words
A tape automated bonding design, comprising: a carrier film; an integrated circuit chip positioned on said carrier film; a plurality of leads extending outwardly from said chip and attached to said carrier film, said plurality of leads comprising an inner lead bonding portion and an outer lead bonding portion which includes a bondsite, wherein said bondsites from a group of adjacent leads are positioned in a row extending essentially orthogonal to said chip and wherein saidn bondsites from the adjacent groups of leads form silimar orthogonal rows of bondsites; and access areas extending through said carrier film at said bondsites for providing access to said bondsites from an underlying interconnect.
Claim 36
Dependent Claim
110 words
A tape automated bonding design, comprising: a carrier film; an integrated circuit chip positioned on said carrier film; a plurality of leads extending outwardly from said chip and attached to said carrier film, said plurality of leads comprising an inner lead bonding portion and an outer lead bonding portion which includes a bondsite, wherein said bondsites from a group of adjacent leads are positioned in a row extending essentially orthogonal to said chip and wherein saidn bondsites from the adjacent groups of leads form silimar orthogonal rows of bondsites; and access areas extending through said carrier film at said bondsites for providing access to said bondsites from an underlying interconnect.
Claim 37
Dependent Claim
17 words
A tape design as claimed in Claim 31. wherein adjacent leads form a laterally extending bondsite row.
Claim 38
Dependent Claim
22 words
A tape design as claimed in Claim 31, further comprising bonding pads attached to said bondsites for bonding to said underlying interconnect.
References Cited (Backward Citations)
No citation records indexed.
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