Patent US5610431A successfully refreshed from Google Patents.
US5610431A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Covers for micromechanical sensors and other semiconductor devices
Assignee: Charles Stark Draper Laboratory Inc
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Filing: 1995-05-12
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Granted: 1997-03-11
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Expires: 2015-05-12
Abstract
Abstract A cover for a micromechanical device through which input/output connections to the device are made. The cover includes at least two doped semiconductor standoffs supporting an insulative layer. One or more metalized vias extend from a top surface of the insulative layer, or from a bottom surface of the base, to a respective standoff. Electrical connection is made to the covered device through the metalized vias and doped semiconductor standoffs. The covered chip may be vacuum sealed by providing a ring-like standoff which borders the covered device when the cover is bonded to the base. The resulting covered chip is adaptable for various chip mounting techniques, including flip chip mounting, side mounting combined with either tape automated bonding (TAB) or conductive epoxy connections, or epoxy chip attachment with wire bonding connections. In one embodiment, conductive bumps are formed on the top surface of the insulative cover layer to accommodate flip chip mounting. In another embodiment, conductive traces are run across the top surface of the insulative layer to interconnect the vias to respective edge positioned pads which are electrically interconnected by one of various techniques to pads on a wiring board.
Inventors
- 👤 Jacob H. Martin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 10:08
CPC Classifications
G; G01; G01P; G01P1/00; G01P1/02; G01P1/023; G01P15/00; G01P15/02; G01P15/08; G01P15/0802; H; H10; H10W; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5524
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
59 words
A cover for a micromechanical device comprising: at least two conductive supports; and an insulative layer having a top surface and a bottom surface disposed over said at least two conductive supports, said insulative layer having at least one metalized via disposed therethrough to extend from said top insulative layer surface to a respective one of said conductive supports.
Claim 2
Dependent Claim
59 words
A cover for a micromechanical device comprising: at least two conductive supports; and an insulative layer having a top surface and a bottom surface disposed over said at least two conductive supports, said insulative layer having at least one metalized via disposed therethrough to extend from said top insulative layer surface to a respective one of said conductive supports.
Claim 3
Dependent Claim
20 words
The cover recited in claim 1 wherein said at least two conductive supports are comprised of silicon doped with boron.
Claim 4
Dependent Claim
14 words
The cover recited in claim 1 wherein said insulative layer is comprised of PYREX™.
Claim 5
Dependent Claim
32 words
The cover recited in claim 1 further comprising at least one conductive bump disposed on said top surface of said insulative layer in electrical contact with said at least one metalized via.
Claim 6
Dependent Claim
34 words
The cover recited in claim 1 wherein said top surface of said insulative layer has at least one conductive trace thereon for electrically interconnecting said at least one metalized via to a conductive pad.
Claim 7
Dependent Claim
20 words
The cover recited in claim 5 wherein said conductive pad is positioned adjacent to an edge of said insulative layer.
Claim 8
Dependent Claim
76 words
A micromechanical structure comprising: a base supporting a micromechanical device; and a cover bonded to a top surface of said base, said cover comprising: at least two conductive supports; and an insulative layer having a top surface and a bottom surface disposed over said at least two conductive supports, said insulative layer having a metalized via disposed therethrough to extend from said top surface of said insulative layer to a respective one of said conductive supports.
Claim 9
Dependent Claim
76 words
A micromechanical structure comprising: a base supporting a micromechanical device; and a cover bonded to a top surface of said base, said cover comprising: at least two conductive supports; and an insulative layer having a top surface and a bottom surface disposed over said at least two conductive supports, said insulative layer having a metalized via disposed therethrough to extend from said top surface of said insulative layer to a respective one of said conductive supports.
Claim 10
Dependent Claim
15 words
The micromechanical structure recited in claim 7 wherein said device is a micromechanical inertial sensor.
Claim 11
Dependent Claim
21 words
The micromechanical structure recited in claim 7 wherein said at least two conductive supports are comprised of silicon doped with boron.
Claim 12
Dependent Claim
16 words
The micromechanical structure recited in claim 7 wherein said cover is anodically bonded to said base.
Claim 13
Dependent Claim
16 words
The micromechanical structure recited in claim 7 wherein said cover is diffusion bonded to said base.
Claim 14
Dependent Claim
15 words
The micromechanical structure recited in claim 7 wherein said insulative layer is comprised of PYREX™.
Claim 15
Dependent Claim
14 words
The micromechanical structure recited in claim 7 wherein said base is comprised of PYREX™.
Claim 16
Dependent Claim
33 words
The micromechanical structure recited in claim 7 further comprising at least one conductive bump disposed on said top surface of said insulative layer in electrical contact with said at least one metalized via.
Claim 17
Dependent Claim
34 words
The micromechanical structure recited in claim 7 wherein said top surface of said insulative layer has at least one conductive trace thereon for electrically interconnecting said at least one via to a conductive pad.
Claim 18
Dependent Claim
21 words
The micromechanical structure recited in claim 15 wherein said conductive pad is positioned adjacent to an edge of said micromechanical structure.
References Cited (Backward Citations)
US4548078A
Cited
US4680606A
Cited
US4861420A
Cited
US4996082A
Cited
US4744863A
Cited
US4853669A
Cited
US4764244A
Cited
US4744249A
Cited
US5013396A
Cited
US5207103A
Cited
US5343064A
Cited
US4904978A
Cited
US4874499A
Cited
US5101669A
Cited
US4855544A
Cited
US4996627A
Cited
US5075253A
Cited
US5335544A
Cited
US5165289A
Cited
US5326726A
Cited
JPH04147679A
Cited
US5295395A
Cited
US5318652A
Cited
JPH04312980A
Cited
US5233874A
Cited
US5233871A
Cited
US5323051A
Cited
US5264075A
Cited
US5296408A
Cited
US5324683A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-03-10 | 2000-09-09 | 2001-03-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-03-10 | 2004-09-09 | 2005-03-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-03-10 | 2008-09-09 | 2009-03-11 | $7700.00 | Window Closed / Lapsed |