US5296408A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Fabrication method for vacuum microelectronic devices
Assignee: International Business Machines Corp
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Filing: 1992-12-24
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Granted: 1994-03-22
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Expires: 2012-12-24
Abstract
Abstract A fabrication method for a microstructure having a vacuum sealed cavity therein including the process steps of forming an aluminum filled cavity in a body of silicon material and heating the structure such that the aluminum is absorbed into the silicon material leaving a vacuum in the cavity. In one embodiment of the invention a cavity is etched into a silicon wafer and filled with aluminum. A silicon dioxide layer is formed over the aluminum filled cavity and the structure is heated to produce the vacuum cavity.
Inventors
- 👤 Robert R. Wilbarg
- 👤 Claude Johnson, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 06:24
CPC Classifications
G; G01; G01L; G01L9/00; G01L9/0041; G01L9/0042; H; H01; H01J; H01J9/00; H01J9/24; H10; H10W; H10W10/00; H10W10/01; H10W10/021; H10W10/20; Y; Y10; Y10S; Y10S148/00; Y10S148/05
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
68 words
A method for fabricating a microstructure incorporating a vacuum cavity therein comprising the steps of: Step 1 forming a body of silicon material having an enclosed cavity therein filled with aluminum, Step 2 heating said body of silicon material containing said aluminum filled cavity to cause said aluminum in said cavity to be absorbed into said body of silicon material and leave a vacuum remaining in said cavity.
Claim 2
Independent Claim
68 words
A method for fabricating a microstructure incorporating a vacuum cavity therein comprising the steps of: Step 1 forming a body of silicon material having an enclosed cavity therein filled with aluminum, Step 2 heating said body of silicon material containing said aluminum filled cavity to cause said aluminum in said cavity to be absorbed into said body of silicon material and leave a vacuum remaining in said cavity.
Claim 3
Dependent Claim
46 words
A method for fabricating a microstructure according to claim 1 wherein said Step 1 includes etching a cavity into the surface of a silicon wafer, filling said cavity with aluminum and then disposing an oxide layer over said silicon wafer surface and said aluminum filled cavity.
Claim 4
Dependent Claim
30 words
A method for fabricating a microstructure according to claim 2 wherein a thin layer of insulating material is disposed over said silicon wafer prior to said etching in Step 1.
Claim 5
Dependent Claim
33 words
A method for fabricating a microstructure according to claim 2 wherein a functional element is disposed in said cavity in said silicon wafer prior to filling said cavity with aluminum in Step 2.
Claim 6
Dependent Claim
32 words
A method for fabricating a microstructure according to claim 1 wherein Step 1 includes forming a body of aluminum on a silicon surface and disposing silicon material totally around said aluminum body.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-03-21 | 1997-09-20 | 1998-03-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-03-21 | 2001-09-20 | 2002-03-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-03-21 | 2005-09-20 | 2006-03-22 | $7700.00 | Window Closed / Lapsed |