Patent US5594282A successfully refreshed from Google Patents.
US5594282A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Resin sealing type semiconductor device and method of making the same
Assignee: Seiko Epson Corp
•
Filing: 1994-12-14
•
Granted: 1997-01-14
•
Expires: 2014-12-14
Abstract
Abstract A resin sealing type semiconductor device has first and second heat radiating portions located on opposite sides of a semiconductor element. The first heat radiating portion has an element placing surface. A plurality of leads are disposed at a given distance from the semiconductor element, and connected to the electrode pads through wires. The second heat radiating portion is located in non-contact with the semiconductor element, leads and wires. A first insulating portion is located between the first heat radiating portion and the leads. A second insulating portion is located between the second heat radiating portion and the leads. Preferably, the first insulating portion is formed continuously on one side of the first heat radiating portion, and the second insulating portion on one side of the second heat radiating portion. A space enclosed by these insulating and heat radiating portions houses the semiconductor element, the wires and the tips of the leads.
Inventors
- 👤 Tetsuya Otsuki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 06:23
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W40/10; H10W72/00; H10W72/50; H10W74/00; H10W74/01; H10W74/016; H10W74/10; H10W74/111; H10W74/121; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/731; H10W90/737; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
168 words
A resin sealing type semiconductor device comprising: a first heat radiating portion having an element placing surface; a semiconductor element bonded onto said element placing surface of said first heat radiating portion; a plurality of leads; a first insulating portion fixed between said first heat radiating portion and said plurality of leads; wires that electrically connect said plurality of leads to electrode pads of said semiconductor element; a second heat radiating portion located opposite to said first heat radiating portion, said second heat radiating portion not contacting said semiconductor element, said plurality of leads and said wires; a second insulating portion located between said second heat radiating portion and said plurality of leads, said first and second heat radiating portions and said first and second insulating portions enclosing said semiconductor element, wires and a portion of each of said plurality of leads; and a resin sealing portion formed at least on an exterior of said first and second heat radiating portions and said first and second insulating portions.
Claim 2
Dependent Claim
168 words
A resin sealing type semiconductor device comprising: a first heat radiating portion having an element placing surface; a semiconductor element bonded onto said element placing surface of said first heat radiating portion; a plurality of leads; a first insulating portion fixed between said first heat radiating portion and said plurality of leads; wires that electrically connect said plurality of leads to electrode pads of said semiconductor element; a second heat radiating portion located opposite to said first heat radiating portion, said second heat radiating portion not contacting said semiconductor element, said plurality of leads and said wires; a second insulating portion located between said second heat radiating portion and said plurality of leads, said first and second heat radiating portions and said first and second insulating portions enclosing said semiconductor element, wires and a portion of each of said plurality of leads; and a resin sealing portion formed at least on an exterior of said first and second heat radiating portions and said first and second insulating portions.
Claim 3
Dependent Claim
72 words
A resin sealing type semiconductor device as defined in claim 1, wherein said first insulating portion is formed continuously on one surface of said first heat radiating portion, said second insulating portion being formed continuously on one surface of said second heat radiating portion, and wherein a space enclosed by said insulating and heat radiating portions houses said semiconductor element, said wires and said portion of each of said plurality of leads.
Claim 4
Dependent Claim
29 words
A resin sealing type semiconductor device as defined in claim 2, wherein within said space, at least the surface of said semiconductor element is coated with a resin layer.
Claim 5
Dependent Claim
29 words
A resin sealing type semiconductor device as defined in claim 3, wherein said resin layer has a linear expansion coefficient ranging between 1.0×10 -6 cm/°C. and 2.0×10 -5 cm/°C.
Claim 6
Dependent Claim
46 words
A resin sealing type semiconductor device as defined in claim 3, wherein at least one of said first and second heat radiating portions includes at least one resin pouring aperture formed therethrough, and wherein said space is substantially filled with the resin layer through said aperture.
Claim 7
Dependent Claim
33 words
A resin sealing type semiconductor device as defined in claim 1, wherein said resin sealing portion comprises a material having a linear expansion coefficient ranging between 1.0×10 -5 cm/°C. and 2.0×10 -5 cm/°C.
Claim 8
Dependent Claim
33 words
A resin sealing type semiconductor device as defined in claim 6, wherein said resin sealing portion comprises a material having a linear expansion coefficient ranging between 1.3×10 -5 cm/°C. and 1.6×10 -5 cm/°C.
Claim 9
Dependent Claim
47 words
A resin sealing type semiconductor device as defined in claim 1, wherein at least one of said first and second heat radiating portions has an enlarged-diameter base and a protruding portion whose diameter is smaller than that of said base, said protruding portion including an exposed surface.
Claim 10
Dependent Claim
51 words
A resin sealing type semiconductor device as defined in claim 8, wherein at least one of said first and second heat radiating portions includes a corrosion inhibiting layer formed on said exposed surface thereof, said corrosion inhibiting layer being formed of a material different from that of said heat radiating portion.
Claim 11
Dependent Claim
32 words
A resin sealing type semiconductor device as defined in claim 6 wherein at least one of said first and second heat radiating portions includes a recess formed in an exposed surface thereof.
Claim 12
Dependent Claim
53 words
A resin sealing type semiconductor device as defined in claim 6, wherein at least one of said first and second heat radiating portions has an enlarged-diameter base and a protruding portion whose diameter is smaller than that of said base, wherein an undercut is formed on a side surface of said protruding portion.
Claim 13
Dependent Claim
76 words
A resin sealing type semiconductor device as defined in claim 1, wherein at least one of said first and second heat radiating portions includes a peripheral protruding edge continuously formed on the surface thereof facing said semiconductor element and protruding out of a main plane of the heat radiating portion in a direction towards said semiconductor element, and wherein at least one of the first and second insulating portions is formed on said peripheral protruding edge.
Claim 14
Dependent Claim
20 words
A resin sealing type semiconductor device as defined in claim 2, wherein an inert gas is encapsulated in said space.
Claim 15
Dependent Claim
27 words
A resin sealing type semiconductor device as defined in claim 13, wherein said inert gas is selected from the group consisting of argon gas and nitrogen gas.
References Cited (Backward Citations)
US3212569A
Cited
US3290564A
Cited
US3965277A
Cited
US4151543A
Cited
JPS54124678A
Cited
JPS56122134A
Cited
JPS57136352A
Cited
JPS5812341A
Cited
JPS59207645A
Cited
EP0164794A2
Cited
JPS61166051A
Cited
JPS6297358A
Cited
US4684975A
Cited
JPS63179557A
Cited
JPS63240053A
Cited
US4942497A
Cited
US5050040A
Cited
US5157478A
Cited
JPH02307251A
Cited
US5208188A
Cited
EP0436126A2
Cited
JPH03222464A
Cited
JPH0410558A
Cited
JPH0411758A
Cited
JPH0427145A
Cited
US5227662A
Cited
JPH04230056A
Cited
US5202288A
Cited
JPH04174551A
Cited
US5229643A
Cited
JPH0491458A
Cited
US5105259A
Cited
JPH04158556A
Cited
US5252855A
Cited
JPH04199664A
Cited
JPH04316357A
Cited
US5172213A
Cited
US5200809A
Cited
US5444025A
Cited
JPH05160304A
Cited
JPH05211262A
Cited
US5328870A
Cited
US5455462A
Cited
US5262927A
Cited
US5381042A
Cited
JPH0653390A
Cited
JPH0697321A
Cited
JPH0697326A
Cited
US5367196A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-01-14 | 2000-07-15 | 2001-01-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-01-14 | 2004-07-15 | 2005-01-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-01-14 | 2008-07-15 | 2009-01-14 | $7700.00 | Window Closed / Lapsed |