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US5534445A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of fabricating a polysilicon thin film transistor

Assignee: 3M Co
•
Filing: 1995-05-23
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Granted: 1996-07-09
•
Expires: 2015-05-23
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Abstract

Abstract A process for producing a polysilicon thin film transistor includes hydrogenating the thin film transistor and depositing an atomic hydrogen-containing layer on the thin film transistor. The thin film transistor is characterized by leakage current rates as low as 10 -13 A.

Inventors

  • 👤 Nang T. Tran
  • 👤 Michael P. Keyes

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-06 04:12
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/60; H10D30/67; H10D30/6729; H10D30/673; H10D30/6731; H10D30/01; H10D30/021; H10D30/031; H10D30/0312; H10D30/0314; H10D30/0321; H10D30/674; H10D30/6741; H10D30/6743; H10D30/6745; H10P; H10P95/00; H10P95/94

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 142 words
A process for making a hydrogenated polysilicon thin film transistor comprising the steps of: providing a substrate; depositing a layer of amorphous silicon on the substrate; annealing said layer of amorphous silicon to form a first polysilicon layer; patterning the first polysilicon layer to form islands; growing a layer of silicon dioxide on the islands to form a gate dielectric layer; depositing and patterning a second layer of polysilicon; doping the first and second polysilicon layers to form a source, a drain, and a gate; depositing and patterning a metal layer to provide a source contact, a drain contact, and a gate contact for the respective source, drain, and gate and thereby forming a polysilicon thin film transistor; annealing said polysilicon thin film transistor; hydrogenating the polysilicon thin film transistor; and depositing an atomic hydrogen-containing layer on the polysilicon thin film transistor.
Claim 2
Dependent Claim 142 words
A process for making a hydrogenated polysilicon thin film transistor comprising the steps of: providing a substrate; depositing a layer of amorphous silicon on the substrate; annealing said layer of amorphous silicon to form a first polysilicon layer; patterning the first polysilicon layer to form islands; growing a layer of silicon dioxide on the islands to form a gate dielectric layer; depositing and patterning a second layer of polysilicon; doping the first and second polysilicon layers to form a source, a drain, and a gate; depositing and patterning a metal layer to provide a source contact, a drain contact, and a gate contact for the respective source, drain, and gate and thereby forming a polysilicon thin film transistor; annealing said polysilicon thin film transistor; hydrogenating the polysilicon thin film transistor; and depositing an atomic hydrogen-containing layer on the polysilicon thin film transistor.
Claim 3
Dependent Claim 18 words
The process of claim 1 wherein said atomic hydrogen-containing layer includes a hydrogenated form of a silicon compound.
Claim 4
Dependent Claim 20 words
The process of claim 1 wherein said atomic hydrogen-containing layer contains 10 19 to 10 22 atoms/cm 3 of hydrogen.
Claim 5
Dependent Claim 17 words
The process according to claim 1, wherein the hydrogenating step occurs after depositing the atomic hydrogen-containing layer.
Claim 6
Dependent Claim 17 words
The process according to claim 1, wherein the hydrogenating step occurs before depositing the atomic hydrogen-containing layer.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-07-09 2000-01-08 2000-07-09 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-07-09 2004-01-08 2004-07-09 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-07-09 2008-01-08 2008-07-09 $7700.00 Window Closed / Lapsed

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