Multi-level assemblies for interconnecting integrated circuits

Claim 1

A multi-level electrical assembly for coupling at least one integrated circuit having a plurality of electrically conductive leads to at least one attachment area of a circuit board comprising: (a) an interconnect board, comprising an electrically insulating printed circuit board having a top surface, a flat bottom surface, and a plurality of holes; (b) a pin carrier, comprised of an electrically insulating, homogeneous, plastic material, disposed generally parallel to the interconnect board and including a plurality of plastic locator posts that are aligned with the holes of the interconnect board; (c) a plurality of electrically conductive pins extending through the pin carrier and held by the pin carrier parallel to each other, perpendicular with the pin carrier, and in relative positions predetermined so as to align with receptacles of a circuit board and measured relative to the locator posts; (d) a plurality of electrically conductive receiving devices comprising a first set of pads configured to receive leads of an integrated circuit supported on one of the surfaces of the interconnect board; (e) a second plurality of electrically conductive flat pads on the bottom surface of the interconnect board, each of which are placed at a measured position relative to the holes of the interconnect board; (f) a plurality of contacts comprising surface-attach joints that electrically couple ends of selected of the pins to the pads and physically holding the pin ends against the pads, wherein no portion of the pins extends beyond the flat bottom surface of the interconnect board; and (g) a plurality of electrically conductive pathways, at least in part supported by the interconnect board, at least some of which pathways electrically couple at least one of the contacts to at least one of the receiving devices.