US5476716A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flame retardant epoxy molding compound, method and encapsulated device
Assignee: Henkel Loctite Corp
•
Filing: 1993-03-01
•
Granted: 1995-12-19
•
Expires: 2013-03-01
Abstract
Abstract A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a halogen (which can be part of the resin or the hardener), and an oxidizing refractory metal oxide, preferably on oxidizing metal oxide of an element selected from the Group VIA of the Periodic Table. The flame retardant epoxy molding compounds when used to encapsulated semiconductor devices have synergistic flame retardant properties.
Inventors
- 👤 Anthony A. Gallo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 01:16
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; C; C08; C08G; C08G59/00; C08G59/18; C08G59/20; C08G59/22; C08G59/30; C08K; C08K3/00; C08K3/18; C08K3/20; C08K3/22; C08L; C08L63/00; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31511
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
204 words
A method for encapsulating a semiconductor device, said method comprising the steps of: (1) heating a thermosetting epoxy molding compound to a liquid state, and (2) encapsulating a semiconductor device with said thermosetting epoxy molding compound heated to a liquid state, and (3) cooling said encapsulated semiconductor device wherein said epoxy molding comprises: (a) about 5-25 percent by weight of compound of an epoxy; (b) about 4-20 percent by weight of compound of a resin hardener; (c) an effective amount of a catalyst for the reaction between said epoxy resin and said hardener in an amount of from about 0.1 to 10% by weight of the combined weight of epoxy and hardener; (d) an effective amount of a mold release agent for the release of the cured molding compound from a mold in an amount of between about 0.01 and about 2 percent by weight of compound; (e) between about 50 and 85 percent by weight of compound of a filler; and (f) a flame retardant system of: (1) a refractory metal oxide; (2) a reactive organic compound containing halogen, said reactive organic compound being a separate compound or being contained in one or more of said components (a)-(e) of said epoxy molding compound.
Claim 2
Independent Claim
204 words
A method for encapsulating a semiconductor device, said method comprising the steps of: (1) heating a thermosetting epoxy molding compound to a liquid state, and (2) encapsulating a semiconductor device with said thermosetting epoxy molding compound heated to a liquid state, and (3) cooling said encapsulated semiconductor device wherein said epoxy molding comprises: (a) about 5-25 percent by weight of compound of an epoxy; (b) about 4-20 percent by weight of compound of a resin hardener; (c) an effective amount of a catalyst for the reaction between said epoxy resin and said hardener in an amount of from about 0.1 to 10% by weight of the combined weight of epoxy and hardener; (d) an effective amount of a mold release agent for the release of the cured molding compound from a mold in an amount of between about 0.01 and about 2 percent by weight of compound; (e) between about 50 and 85 percent by weight of compound of a filler; and (f) a flame retardant system of: (1) a refractory metal oxide; (2) a reactive organic compound containing halogen, said reactive organic compound being a separate compound or being contained in one or more of said components (a)-(e) of said epoxy molding compound.
Claim 3
Dependent Claim
19 words
The method of claim 1, wherein said epoxy is about 10-17 percent by weight of the epoxy molding compound.
Claim 4
Dependent Claim
12 words
The method of claim 1 wherein said hardener is a phenolic novolac.
Claim 5
Dependent Claim
11 words
The method of claim 1 wherein said hardener is an anhydride.
Claim 6
Dependent Claim
31 words
The method of claim 1 wherein said hardener is a polyanhydride of a maleic monomer and at least one alkyl styrene monomer or prepolymer of the polyanhydride and the epoxy resin.
Claim 7
Dependent Claim
21 words
The method of claim 1 wherein said epoxy molding compound comprises at least about 50 weight percent of an inorganic filler.
Claim 8
Dependent Claim
11 words
The method of claim 6 wherein said inorganic filler includes silica.
Claim 9
Dependent Claim
21 words
The method of claim 7 wherein said epoxy molding compound comprises between about 60 and about 80 weight percent inorganic filler.
Claim 10
Dependent Claim
15 words
The method of claim 1 wherein said epoxy molding compound includes a silane coupling agent.
Claim 11
Dependent Claim
14 words
The method according to claim 1 wherein said epoxy molding compound includes a colorant.
Claim 12
Dependent Claim
16 words
The method of claim 1 wherein said reactive organic compound containing halogen is a bromophenol-formaldehyde novolac.
Claim 13
Dependent Claim
19 words
The method of claim 1 wherein said reactive organic compound containing halogen is a polyglycidyl ether of bromophenol-formaldehyde novolac.
Claim 14
Dependent Claim
18 words
The method according to claim 1, wherein said reactive organic compound containing halogen is a bromophenol epoxy novolac.
Claim 15
Dependent Claim
19 words
The method according to claim 1, wherein said reactive organic compound containing halogen is a meta-brominated cresol epoxy novolac.
Claim 16
Dependent Claim
18 words
The method according to claim 1, wherein said reactive organic compound containing halogen is part of said epoxy.
Claim 17
Dependent Claim
20 words
The method according to claim 1, wherein said reactive organic compound containing a halogen is part of said resin hardener.
Claim 18
Dependent Claim
25 words
The method according to claim 1, wherein said reactive organic compound containing halogen contains about 0.5-1.5 percent of halogen by weight of the molding compound.
Claim 19
Dependent Claim
27 words
The method according to claim 1, wherein said refractory metal oxide is an oxidizing metal oxide of an element selected from Group VIA of the Periodic Table.
Claim 20
Dependent Claim
25 words
The method according to claim 18, wherein said oxidizing metal oxide of an element selected from Group VIA of the Periodic Table is tungsten trioxide.
Claim 21
Dependent Claim
25 words
The method according to claim 18, wherein said oxidizing metal oxide of an element selected from Group VIA of the Periodic Table is molybdenum trioxide.
Claim 22
Dependent Claim
21 words
The method according to claim 1, wherein said flame retardant system includes about 0.4-2.0 percent of an oxidizing refractory metal oxide.
Claim 23
Dependent Claim
24 words
The method according to claim 1, wherein said flame retardant system includes about 0.40-0.80 percent of antimony pentoxide by weight of the molding compound.
Claim 24
Dependent Claim
23 words
The method according to claim 22, wherein said flame retardant system contains about 0.03-0.06 percent of sodium by weight of the antimony pentoxide.
Claim 25
Dependent Claim
27 words
The method according to claim 22, wherein the said flame retardant system contains about 0.02-3.20 percent of magnesium aluminum carbonate hydrate by weight of the molding compound.
Claim 26
Dependent Claim
14 words
The method of claim 1 wherein said semiconductor device is a treated silicon wafer.
Claim 27
Dependent Claim
21 words
The method of claim 1 wherein said semiconductor device is selected from the group consisting of transistors, diodes and integrated circuits.
Claim 28
Dependent Claim
10 words
A semiconductor device encapsulated by the method of claim 1.
Claim 29
Dependent Claim
10 words
A semiconductor device encapsulated by the method of claim 3.
Claim 30
Dependent Claim
10 words
A semiconductor device encapsulated by the method of claim 6.
Claim 31
Dependent Claim
10 words
A semiconductor device encapsulated by the method of claim 14.
Claim 32
Dependent Claim
10 words
A semiconductor device encapsulated by the method of claim 18.
Claim 33
Dependent Claim
10 words
A semiconductor device encapsulated by the method of claim 19.
Claim 34
Dependent Claim
10 words
A semiconductor device encapsulated by the method of claim 20.
Claim 35
Dependent Claim
10 words
A semiconductor device encapsulated by the method of claim 21.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-12-18 | 1999-06-19 | 1999-12-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-12-18 | 2003-06-19 | 2003-12-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-12-18 | 2007-06-19 | 2007-12-19 | $7700.00 | Window Closed / Lapsed |