US4282136A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flame retardant epoxy molding compound method and encapsulated device
Assignee: BP Corp North America Inc
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Filing: 1979-04-09
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Granted: 1981-08-04
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Expires: 1999-04-09
Abstract
Abstract The high temperature stability of devices encapsulated with a flame retardant epoxy molding compound is improved by including in the encapsulant as synergistic flame retardant a halogen-containing organic compound (preferably of the reactive type) and antimony pentoxide. The encapsulant may be prepared from an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, the halogen-containing organic compound (which may be part of the resin or the hardener) and antimony pentoxide. Such encapsulants, when used to encapsulate semiconductor devices, have improved high temperature compatability compared to similar molding compounds with antimony trioxide or antimony tetraoxide.
Inventors
- 👤 Earl R. Hunt
- 👤 Robert K. Rosler
- 👤 James O. Peterson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 06:29
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H10W74/473; C; C08; C08G; C08G59/00; C08G59/18; C08G59/40; C08K; C08K3/00; C08K3/18; C08K3/20; C08K3/22; C08K3/2279; C08L; C08L63/00; C09; C09K; C09K21/00; C09K21/14; H10W74/01
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
120 words
In a method of encapsulating a semiconductor device wherein a thermosetting epoxy molding compound is cured in a liquid state in a mold surrounding a semiconductor device, said epoxy molding compound comprising a mixture of an epoxy, a hardener selected from phenol-derived and substituted phenol-derived resin, carboxylic acid anhydride and amine hardeners, a catalyst, a mold release agent, optionally a filler, optionally a colorant, optionally a coupling agent and a flame retardant system which may include one or more of the other ingredient; the improvement wherein the flame retardant system comprises about one percent antimony pentoxide by weight of molding compound and from about 1.3 to about 1.6 percent of a reactive bromine-containing organic compound by weight of molding compound.
Claim 2
Dependent Claim
120 words
In a method of encapsulating a semiconductor device wherein a thermosetting epoxy molding compound is cured in a liquid state in a mold surrounding a semiconductor device, said epoxy molding compound comprising a mixture of an epoxy, a hardener selected from phenol-derived and substituted phenol-derived resin, carboxylic acid anhydride and amine hardeners, a catalyst, a mold release agent, optionally a filler, optionally a colorant, optionally a coupling agent and a flame retardant system which may include one or more of the other ingredient; the improvement wherein the flame retardant system comprises about one percent antimony pentoxide by weight of molding compound and from about 1.3 to about 1.6 percent of a reactive bromine-containing organic compound by weight of molding compound.
Claim 3
Dependent Claim
12 words
The method of claim 1 wherein said hardener is a phenolic novolac.
Claim 4
Dependent Claim
11 words
The method of claim 1 wherein said hardener is an anhydride.
Claim 5
Dependent Claim
31 words
The method of claim 3 wherein said hardener is a polyanhydride of a maleic monomer and at least one alkyl sytrene monomer or prepolymers of the polyanhydride and the epoxy resin.
Claim 6
Dependent Claim
21 words
The method of claim 1 wherein said epoxy molding compound comprises at least about 50 weight percent of an inorganic filler.
Claim 7
Dependent Claim
11 words
The method of claim 5 wherein said inorganic filler includes silica.
Claim 8
Dependent Claim
20 words
The method of claim 6 wherein said epoxy molding compound comprises between about 55 and about 75 weight percent silica.
Claim 9
Dependent Claim
15 words
The method of claim 5 wherein said epoxy molding compound includes a silane coupling agent.
Claim 10
Dependent Claim
67 words
The method of claim 1 wherein said epoxy molding compound comprises: (a) about 1-50 weight percent epoxy; (b) about 1-40 weight percent of a phenol-derived or substituted phenol-derived resin hardener; (c) an effective amount of a catalyst for the reaction between said epoxy resin and said hardener; and (d) an effective amount of a mold release agent for release of the cured encapsulated device from the mold.
Claim 11
Dependent Claim
52 words
The method of claim 9 wherein said epoxy is about 5-25 weight percent of said epoxy molding compound, said phenol-derived or substituted phenol-derived resin hardener is about 5-20 weight percent said epoxy molding compound and said epoxy molding compound further comprises between about 50 and about 85 weight percent of a filler.
Claim 12
Dependent Claim
13 words
The method of claim 9 wherein said halogen-containing organic compound is tetrabromobisphenol A.
Claim 13
Dependent Claim
17 words
The method of claim 9 wherein said halogen-containing organic compound is a diglycidyl ether of tetrabromobisphenol A.
Claim 14
Dependent Claim
16 words
The method of claim 9 wherein said bromine-containing organic compound is part of said epoxy resin.
Claim 15
Dependent Claim
21 words
The method of claim 9 wherein said bromine-containing organic compound is part of said phenol-derived or substituted phenol derived resin hardener.
Claim 16
Dependent Claim
16 words
The method of claim 1 wherein said bromine-containing organic compound is part of said epoxy resin.
Claim 17
Dependent Claim
15 words
The method of claim 1 wherein said bromine-containing organic compound is part of said hardener.
Claim 18
Dependent Claim
14 words
The method of claim 1 wherein said semiconductor device is a treated silicon wafer.
Claim 19
Dependent Claim
21 words
The method of claim 1 wherein said semiconductor device is selected from the group consisting of transistors, diodes and integrated circuits.
Claim 20
Dependent Claim
168 words
An epoxy molding compound comprising: (a) about 5-25 percent by weight of compound of an epoxy; (b) about 5-20 percent by weight of compound of a phenol-derived or a substituted phenol derived resin hardener; (c) an effective amount of a catalyst for the reaction between said epoxy resin and said hardener in an amount of from about 0.1 to 5% by weight of the combined weight of epoxy and hardener; (d) an effective amount of a mold release agent for the release of the cured molding compound from a mold in an amount of between about 0.01 and about 2 percent by weight of compound; (e) between about 50 and about 85 percent by weight of compound of a filler; and (f) a flame retardant system of: (1) about one percent antimony pentoxide by weight of molding compound and (2) from about 1.3 to about 1.6 percent of a reactive organic bromine-containing compound by weight of molding compound which may include one or more of the other components.
Claim 21
Dependent Claim
168 words
An epoxy molding compound comprising: (a) about 5-25 percent by weight of compound of an epoxy; (b) about 5-20 percent by weight of compound of a phenol-derived or a substituted phenol derived resin hardener; (c) an effective amount of a catalyst for the reaction between said epoxy resin and said hardener in an amount of from about 0.1 to 5% by weight of the combined weight of epoxy and hardener; (d) an effective amount of a mold release agent for the release of the cured molding compound from a mold in an amount of between about 0.01 and about 2 percent by weight of compound; (e) between about 50 and about 85 percent by weight of compound of a filler; and (f) a flame retardant system of: (1) about one percent antimony pentoxide by weight of molding compound and (2) from about 1.3 to about 1.6 percent of a reactive organic bromine-containing compound by weight of molding compound which may include one or more of the other components.
Claim 22
Dependent Claim
16 words
The epoxy molding compound of claim 19 wherein said reactive bromine-containing organic compound is tetrabromobisphenol A.
Claim 23
Dependent Claim
20 words
The epoxy molding compound of claim 19 wherein said reactive bromine-containing organic compound is a diglycidyl ether of tetrabromobisphenol A.
Claim 24
Dependent Claim
17 words
The epoxy molding compound of claim 19 wherein said bromine-containing organic compound is part of said epoxy.
Claim 25
Dependent Claim
22 words
The epoxy molding compound of claim 19 wherein said bromine-containing organic compound is part of said phenol-derived or substituted phenol-derived resin hardener.
Claim 26
Dependent Claim
21 words
A semiconductor device encapsulated by the method of claim 1, claim 2, claim 5, claim 9, claim 10, or claim 18.
References Cited (Backward Citations)
US4042550A
Cited
US4123398A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-08-03 | 1985-02-02 | 1985-08-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-08-03 | 1989-02-02 | 1989-08-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-08-03 | 1993-02-02 | 1993-08-04 | $7700.00 | Window Closed / Lapsed |