Patent US6081376A successfully refreshed from Google Patents.
Patent US5475262A successfully refreshed from Google Patents.
US5475262A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Functional substrates for packaging semiconductor chips
Assignee: Fujitsu Ltd
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Filing: 1993-07-27
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Granted: 1995-12-12
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Expires: 2013-07-27
Abstract
Abstract A semiconductor device is manufactured by subdividing the chip carrier into a plurality of functional substrates, such as a signal connection substrate, a capacitor substrate, a resistor substrate and a power supply substrate. The several substrates are individually manufactured and tested before they are assembled. Advantageously, the manufacturing and testing of the substrates are carried out in parallel, so as to reduce manufacturing time of the semiconductor device. Each substrate has a top interconnect layer and a bottom interconnect layer. Each interconnect layer has a plurality of bond pads in an identical pattern. The pads are formed using the same design rules, structure, pitch, diameter and fabrication process for each layer. This identity allows the different functional substrates to be electrically interchanged without changing the interconnection layers. Although changes internal in the substrate may be required.
Inventors
- 👤 Wen-chou V. Wang
- 👤 William T. Chou
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:59
CPC Classifications
H; H10; H10W; H10W42/00; H10W44/00; H10W44/401; H10W70/00; H10W70/60; H10W70/611; H10W90/00; H10W90/401; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
224 words
A multi-chip module, comprising: an interconnection substrate for accommodating at least one integrated circuit element thereon, where each integrated circuit element comprises: at least one first substrate having a bottom interconnect layer that is coupled to the interconnection substrate and having a single type of predetermined passive electrical functional elements, wherein the passive electrical functional elements are selected from the group consisting of electrical signal conductors, capacitors, and resistors; and at least one second substrate having a bottom interconnect layer that is coupled to a top interconnect layer of the first substrate, said second substrate capable of being independently created and having a single type of predetermined passive electrical functional elements, wherein the electrical functional elements of the second substrate are selected from the group consisting of electrical signal connectors, capacitors, and resistors, wherein the electrical functional elements of the second substrate are of a type different than the electrical functional elements of the first substrate, wherein at least one semiconductor chip is coupled to a top interconnect layer of the second substrate, and wherein integrated circuits of said semiconductor chip are in electrical contact with the electrical functional elements of the first and second substrate; and a plurality of intra-substrate connectors interposed between corresponding top and bottom interconnect layers, wherein the top and bottom interconnect layers have substantially identical patterns of electrical contacts.
Claim 2
Dependent Claim
224 words
A multi-chip module, comprising: an interconnection substrate for accommodating at least one integrated circuit element thereon, where each integrated circuit element comprises: at least one first substrate having a bottom interconnect layer that is coupled to the interconnection substrate and having a single type of predetermined passive electrical functional elements, wherein the passive electrical functional elements are selected from the group consisting of electrical signal conductors, capacitors, and resistors; and at least one second substrate having a bottom interconnect layer that is coupled to a top interconnect layer of the first substrate, said second substrate capable of being independently created and having a single type of predetermined passive electrical functional elements, wherein the electrical functional elements of the second substrate are selected from the group consisting of electrical signal connectors, capacitors, and resistors, wherein the electrical functional elements of the second substrate are of a type different than the electrical functional elements of the first substrate, wherein at least one semiconductor chip is coupled to a top interconnect layer of the second substrate, and wherein integrated circuits of said semiconductor chip are in electrical contact with the electrical functional elements of the first and second substrate; and a plurality of intra-substrate connectors interposed between corresponding top and bottom interconnect layers, wherein the top and bottom interconnect layers have substantially identical patterns of electrical contacts.
Claim 3
Dependent Claim
15 words
A multi-chip module as claimed in claim 1, wherein said intra-substrate connectors are through-hole connectors.
Claim 4
Dependent Claim
26 words
A multi-chip module as claimed in claim 1, wherein said electrical contacts are selected from the group consisting of solder bumps, elastomer bumps and gold bumps.
Claim 5
Dependent Claim
23 words
An integrated circuit device as claimed in claim 1, wherein said at least one second substrate includes a substrate of power supply circuits.
Claim 6
Dependent Claim
109 words
A multi-chip module comprising: an interconnection substrate; and a plurality of integrated circuit elements, each integrated circuit element being coupled to the interconnection substrate, wherein each integrated circuit element includes: a semiconductor chip; and at least one functional substrate, wherein each functional substrate comprises a single type of passive electrical functional elements wherein each functional substrate in each integrated circuit, element includes different types of passive electrical functional elements, wherein at least one functional substrate is coupled to the interconnection substrate, wherein the semiconductor chip is coupled to a functional substrate, and wherein the electrical functional elements of each functional substrate are in electrical contact with the semiconductor chip.
Claim 7
Dependent Claim
109 words
A multi-chip module comprising: an interconnection substrate; and a plurality of integrated circuit elements, each integrated circuit element being coupled to the interconnection substrate, wherein each integrated circuit element includes: a semiconductor chip; and at least one functional substrate, wherein each functional substrate comprises a single type of passive electrical functional elements wherein each functional substrate in each integrated circuit, element includes different types of passive electrical functional elements, wherein at least one functional substrate is coupled to the interconnection substrate, wherein the semiconductor chip is coupled to a functional substrate, and wherein the electrical functional elements of each functional substrate are in electrical contact with the semiconductor chip.
Claim 8
Dependent Claim
25 words
The multi-chip module of claim 5 wherein each functional substrate comprises a top interconnect layer, a bottom interconnect layer and a plurality of intra-substrate connectors.
Claim 9
Dependent Claim
19 words
The multi-chip module of claim 6, wherein the top interconnect layer and the bottom interconnect layer are substantially identical.
Claim 10
Dependent Claim
23 words
The multi-chip module of claim 6, wherein the top interconnect layer and the bottom interconnect layer have substantially identical patterns of intra-substrate connectors.
Claim 11
Dependent Claim
199 words
An inventory for assembling a multi-chip module for accommodating a plurality of integrated circuit elements, wherein the inventory comprises a plurality of each of the following: (a) a resistor substrate incorporating a plurality of thin film resistors formed on the substrate and a plurality of bonding pads on each face of the resistor substrate, the resistors being connected to at least a portion of the bonding pads; (b) a capacitor substrate incorporating a plurality of thin film capacitors formed on the substrate and a plurality of bonding pads on each face of the capacitor substrate, the capacitors being connected to at least a portion of the bonding pads; (c) an interconnection substrate comprising a plurality of bonding pads on at least one face of the interconnection substrate, and interconnections on the substrate making electrical connections between at least a portion of the bonding pads; and (d) integrated circuit chips adapted to be carried by one of the resistor or capacitor substrate, and having bonding pads connected to bonding pads of the carrying substrate, wherein the bonding pads on each face of each substrate and bonding pads on each integrated circuit chip are in an identical pattern for face-to-face interconnection.
Claim 12
Dependent Claim
199 words
An inventory for assembling a multi-chip module for accommodating a plurality of integrated circuit elements, wherein the inventory comprises a plurality of each of the following: (a) a resistor substrate incorporating a plurality of thin film resistors formed on the substrate and a plurality of bonding pads on each face of the resistor substrate, the resistors being connected to at least a portion of the bonding pads; (b) a capacitor substrate incorporating a plurality of thin film capacitors formed on the substrate and a plurality of bonding pads on each face of the capacitor substrate, the capacitors being connected to at least a portion of the bonding pads; (c) an interconnection substrate comprising a plurality of bonding pads on at least one face of the interconnection substrate, and interconnections on the substrate making electrical connections between at least a portion of the bonding pads; and (d) integrated circuit chips adapted to be carried by one of the resistor or capacitor substrate, and having bonding pads connected to bonding pads of the carrying substrate, wherein the bonding pads on each face of each substrate and bonding pads on each integrated circuit chip are in an identical pattern for face-to-face interconnection.
Claim 13
Dependent Claim
29 words
The multi-chip module of claim 5, wherein the passive electrical functional elements for each functional substrate are selected from the group consisting of resistors, capacitors, and electrical signal conductors.
Claim 14
Dependent Claim
141 words
A multi-chip module comprising: an interconnection substrate having a plurality of signal traces; a plurality of integrated circuit elements connected with the interconnection substrate, wherein each integrated circuit element comprises: a first functional substrate comprising a plurality of passive functional electrical elements of a single type and coupled to the interconnection substrate; at least one second functional substrate comprising a plurality of passive functional electrical elements of a single type, wherein the functional elements of each second functional substrate are different than the functional elements in both the first functional substrate and other second functional substrates, wherein at least one second functional substrate is coupled to first functional substrate; and a semiconductor chip of integrated circuits carried by a second functional substrate and in electrical contact with the functional electrical elements of the first functional substrate and each second functional substrate.
Claim 15
Dependent Claim
141 words
A multi-chip module comprising: an interconnection substrate having a plurality of signal traces; a plurality of integrated circuit elements connected with the interconnection substrate, wherein each integrated circuit element comprises: a first functional substrate comprising a plurality of passive functional electrical elements of a single type and coupled to the interconnection substrate; at least one second functional substrate comprising a plurality of passive functional electrical elements of a single type, wherein the functional elements of each second functional substrate are different than the functional elements in both the first functional substrate and other second functional substrates, wherein at least one second functional substrate is coupled to first functional substrate; and a semiconductor chip of integrated circuits carried by a second functional substrate and in electrical contact with the functional electrical elements of the first functional substrate and each second functional substrate.
Claim 16
Dependent Claim
69 words
The multi-chip module as recited in claim 11 comprising: a top layer on a top surface of each first and second functional substrate; a bottom interconnect layer on a bottom surface of each first and second functional substrate; and a plurality of intra-substrate electrical connectors arranged in each top and bottom interconnect layer in a substantially identical pattern to facilitate interchanging attachment between the second and first functional substrates.
Claim 17
Dependent Claim
32 words
The multi-chip module as recited in claim 11 wherein each first and second functional substrate comprises passive functional electrical elements selected from the group consisting of resistors, capacitors, and electrical signal conductors.
References Cited (Backward Citations)
US3748548A
Cited
US4649417A
Cited
US5082802A
Cited
US4945399A
Cited
EP0268111A2
Cited
US4949163A
Cited
EP0379404A2
Cited
US5055907A
Cited
US5013687A
Cited
EP0414204A2
Cited
US4991000A
Cited
US5032896A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-12-11 | 1999-06-12 | 1999-12-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-12-11 | 2003-06-12 | 2003-12-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-12-11 | 2007-06-12 | 2007-12-12 | $7700.00 | Window Closed / Lapsed |