Patent US2285874A successfully refreshed from Google Patents.
Patent US5360942A successfully refreshed from Google Patents.
US5360942A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-chip electronic package module utilizing an adhesive sheet
Assignee: Advanced Technology Interconnect Inc
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Filing: 1993-11-16
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Granted: 1994-11-01
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Expires: 2013-11-16
Abstract
Abstract There is provided a module for supporting a plurality of semiconductor devices within an electronic package. The module has a support substrate and an apertured substrate laminated together with a polymer adhesive. A plurality of semiconductor devices are disposed within apertures formed in the apertured substrate and bonded to the support substrate by that same polymer adhesive.
Inventors
- 👤 Paul R. Hoffman
- 👤 Dexin Liang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 22:58
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/417; H10W70/464; H10W70/468; H10W70/60; H10W70/67; H10W70/68; H10W72/00; H10W72/30; H10W74/00; H10W74/10; H10W74/111; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W90/00; H10W90/811; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/351; H10W72/353; H10W72/354; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
65 words
A module for an electronic package, comprising: a support substrate; an apertured substrate adjacent said support substrate, said apertured substrate containing at least one aperture; a polymer adhesive disposed between and bonded to both said support substrate and to said apertured substrate; and at least one semiconductor device disposed within said at least one aperture and bonded to said support substrate by said polymer adhesive.
Claim 2
Dependent Claim
65 words
A module for an electronic package, comprising: a support substrate; an apertured substrate adjacent said support substrate, said apertured substrate containing at least one aperture; a polymer adhesive disposed between and bonded to both said support substrate and to said apertured substrate; and at least one semiconductor device disposed within said at least one aperture and bonded to said support substrate by said polymer adhesive.
Claim 3
Dependent Claim
23 words
The module of claim 1 wherein said polymer adhesive is a unitary layer extending for substantially the entire surface of the apertured substrate.
Claim 4
Dependent Claim
29 words
The module of claim 2 wherein said polymer adhesive is filled with a material selected from the group consisting of silver, aluminum oxide, aluminum nitride, silicon carbide and diamond.
Claim 5
Dependent Claim
14 words
The module of claim 3 wherein said polymer adhesive is a thermosetting polymer resin.
Claim 6
Dependent Claim
14 words
The module of claim 3 wherein said polymer adhesive is a thermoplastic polymer resin.
Claim 7
Dependent Claim
14 words
The module of claim 5 wherein said support substrate is a leadframe die paddle.
Claim 8
Dependent Claim
19 words
The module of claim 5 wherein said support substrate is an extension of the base of an electronic package.
Claim 9
Dependent Claim
105 words
An electronic package, comprising: a base component; a cover component; a leadframe disposed between said base component and said cover component and bonded to both by a first dielectric sealant, said leadframe containing a plurality of leads approaching a central region and a support substrate disposed within said central region; an apertured substrate adjacent said support substrate, said apertured substrate containing at least one aperture; a polymer adhesive disposed between and bonded to both said support substrate and to said apertured substrate; and at least one semiconductor device disposed within said at least one aperture and bonded to said support substrate by said polymer adhesive.
Claim 10
Dependent Claim
105 words
An electronic package, comprising: a base component; a cover component; a leadframe disposed between said base component and said cover component and bonded to both by a first dielectric sealant, said leadframe containing a plurality of leads approaching a central region and a support substrate disposed within said central region; an apertured substrate adjacent said support substrate, said apertured substrate containing at least one aperture; a polymer adhesive disposed between and bonded to both said support substrate and to said apertured substrate; and at least one semiconductor device disposed within said at least one aperture and bonded to said support substrate by said polymer adhesive.
Claim 11
Dependent Claim
24 words
The electronic package of claim 8 wherein said polymer adhesive is a unitary layer extending for substantially the entire surface of the apertured substrate.
Claim 12
Dependent Claim
30 words
The electronic package of claim 9 wherein said polymer adhesive is filled with a material selected from the group consisting of silver, aluminum oxide, aluminum nitride, silicon carbide and diamond.
Claim 13
Dependent Claim
15 words
The electronic package of claim 10 wherein said polymer adhesive is a thermoplastic polymer resin.
Claim 14
Dependent Claim
30 words
The electronic package of claim 11 wherein said base component and said cover component are individually selected from the group consisting of aluminum, aluminum alloys, aluminum composites and aluminum compounds.
Claim 15
Dependent Claim
23 words
The electronic package of claim 12 wherein said base component and said cover component are an aluminum alloy coated with an anodization layer.
Claim 16
Dependent Claim
14 words
The module of claim 13 wherein said support substrate is a leadframe die paddle.
Claim 17
Dependent Claim
19 words
The module of claim 13 wherein said support substrate is an extension of the base of an electronic package.
Claim 18
Dependent Claim
91 words
An electronic package, comprising: a leadframe containing a plurality of leads approaching a central region and a support substrate disposed within said central region; an apertured substrate adjacent said support substrate, said apertured substrate containing at least one aperture; a polymer adhesive disposed between and bonded to both said support substrate and to apertured substrate; at least one semiconductor device disposed within said at least one aperture and bonded to said support substrate by said polymer adhesive; and a molding resin encapsulating a portion of said leads and said central portion.
Claim 19
Dependent Claim
91 words
An electronic package, comprising: a leadframe containing a plurality of leads approaching a central region and a support substrate disposed within said central region; an apertured substrate adjacent said support substrate, said apertured substrate containing at least one aperture; a polymer adhesive disposed between and bonded to both said support substrate and to apertured substrate; at least one semiconductor device disposed within said at least one aperture and bonded to said support substrate by said polymer adhesive; and a molding resin encapsulating a portion of said leads and said central portion.
Claim 20
Dependent Claim
24 words
The electronic package of claim 16 wherein said polymer adhesive is a unitary layer extending for substantially the entire surface of the apertured substrate.
Claim 21
Dependent Claim
30 words
The electronic package of claim 17 wherein said polymer adhesive is filled with a material selected from the group consisting of silver, aluminum oxide, aluminum nitride, silicon carbide and diamond.
Claim 22
Dependent Claim
15 words
The electronic package of claim 18 wherein said polymer adhesive is a thermoplastic polymer resin.
Claim 23
Dependent Claim
14 words
The electronic package of claim 19 wherein said molding resin is a thermosetting epoxy.
Claim 24
Independent Claim
57 words
A method for the assembly of an electronic module, comprising the steps of: bonding an apertured substrate having at least one aperture to a support substrate with a first polymer adhesive; disposing at least one semiconductor device into said at least one aperture; and bonding said semiconductor device to said support substrate with said first polymer adhesive.
Claim 25
Independent Claim
57 words
A method for the assembly of an electronic module, comprising the steps of: bonding an apertured substrate having at least one aperture to a support substrate with a first polymer adhesive; disposing at least one semiconductor device into said at least one aperture; and bonding said semiconductor device to said support substrate with said first polymer adhesive.
Claim 26
Dependent Claim
25 words
The method of claim 21 wherein both said apertured substrate and said semiconductor device are bonded to said support substrate in the same thermal cycle.
Claim 27
Dependent Claim
23 words
The method of claim 21 wherein said apertured substrate and said semiconductor device are bonded to said support substrate in separate thermal cycles.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-10-31 | 1998-05-02 | 1998-11-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-10-31 | 2002-05-02 | 2002-11-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-10-31 | 2006-05-02 | 2006-11-01 | $7700.00 | Window Closed / Lapsed |