Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs

Claim 2

A semiconductor casing, comprising: a base component formed of a ceramic-glass-metal composite material; a lid component formed of a ceramic-glass-metal composite material; said composite having a structure comprisinq substantially a matrix of glass with ceramic particles and metallic particles dispersed therein; a metallic leadframe embedded into said base component, said leadframe having at least one hole therethrough with said composite material therein whereby the bonded area of said leadframe is increased and said leadframe is interlocked in said composite material of said base member; and a sealing glass bonding said base component to said lid component.

Claim 3

The semiconductor casing of claim 1 wherein said at least one hole in said leadframe has a collar extending out of the plane through the surface of the leadframe to increase the bonded area as compared to that of the hole without a collar.

Claim 4

The semiconductor casing of claim 2 further including said base component having a cavity adapted to receive a semiconductor device, a metallic pad embedded in said base component with a surface exposed to said cavity, said pad being adapted to have a semiconductor device bonded thereto, said metallic pad being a part of said leadframe.

Claim 5

The semiconductor casing of claim 3 further including said metallic pad being larger than said cavity whereby the edges of said pad are completely surrounded by said composite material.

Claim 6

The semiconductor casing of claim 1 wherein said leadframe is completely embedded by said composite material.

Claim 7

The semiconductor casing of claim 1 wherein said composite material comprises an effective amount up to about 25 volume % of metallic particles for enhancing the flow characteristics of said composite; from about 15 to about 50 volume % of a lass for adhering said composite together; and the balance essentially ceramic particles.

Claim 8

The semiconductor casing of claim 6 including said ceramic particles comprising from about 20 to about 80 vol. percent of said composite.

Claim 9

The semiconductor casing of claim 7 including said ceramic particles being selected from the group consisting of Al 2 O 3 , SiC, BeO, TiO 2 , ZrO 2 , MgO, AlN, Si 3 N 4 , BN and mixtures thereof.

Claim 10

The semiconductor casing of claim 8 including said metallic particles being selected from the group consisting of aluminum, copper, iron, silver, gold, stainless steel and alloys thereof.

Claim 11

The semiconductor casing of claim 9 further including the glass matrix being from the group consisting of vitreous and devitrified glass.

Claim 12

The semiconductor casing of claim 10 including said glass matrix being selected from the group consisting of silicate, borosilicate, phosphate, zinc-borosilicate, soda-lime-silica, lead-silicate and lead-zinc-borate glasses.

Claim 13

The process of forming a semiconductor casing, comprising the steps of:

Claim 14

The process of forming a semiconductor casing, comprising the steps of:

Claim 15

providing a base component having a cavity adapted to receive a semiconductor device and a lid component, said base and lid components formed of a ceramic-glass-metal composite material; said composite material having a structure comprising substantially a matrix of glass with ceramic particles and metal particles dispersed therein; providing a metallic leadframe having at least one hole therethrough to receive said composite material whereby the area bonded to the composite material is increased; embedding said leadframe into said base component whereby said composite material is pressed into said at least one hole so that said leadframe is interlocked in said composite material of said base member; disposing a sealing glass between said base component and said lid component; heating said lid component, said base component and said sealing glass to a temperature where said sealing glass is in the liquid state; pressing said base and lid components together; and solidifying said sealing glass to bond said base component to said lid component.

Claim 16

providing a base component having a cavity adapted to receive a semiconductor device and a lid component, said base and lid components formed of a ceramic-glass-metal composite material; said composite material having a structure comprising substantially a matrix of glass with ceramic particles and metal particles dispersed therein; providing a metallic leadframe having at least one hole therethrough to receive said composite material whereby the area bonded to the composite material is increased; embedding said leadframe into said base component whereby said composite material is pressed into said at least one hole so that said leadframe is interlocked in said composite material of said base member; disposing a sealing glass between said base component and said lid component; heating said lid component, said base component and said sealing glass to a temperature where said sealing glass is in the liquid state; pressing said base and lid components together; and solidifying said sealing glass to bond said base component to said lid component.

Claim 17

The process of claim 12 further including the step of forming said at least one hole in said leadframe with a collar extending out of the plane through the surface of the leadframe to increase the bonded area as compared to that of a hole without a collar.

Claim 18

The process of claim 12 further including the step of completely embedding said leadframe with said composite material.

Claim 19

The process of claim 12 wherein said composite material comprises an effective amount up to about 25 volume % of metallic particles for enhancing the flow characteristics of said composite: from about 15 to about 50 volume % of a glass for adhering said composite together; and the balance essentially ceramic particles.

Claim 20

The process of claim 15 including the step of selecting said ceramic particles to comprise from about 20 to about 80 vol. percent of said composite.

Claim 21

The process of claim 16 including the step of selecting said ceramic particles from the group consisting of Al 2 O 3 , SiC, BeO, TiO 2 , ZrO 2 , MgO, AlN, Si 3 N 4 , BN and mixtures thereof.

Claim 22

The process of claim 17 including the step of selecting said metallic particles from the group consisting of aluminum, copper, iron, silver, gold, stainless steel and alloys thereof.

Claim 23

The process of claim 18 further including the step of selecting the glass for adhering said composite from the group consisting of vitreous and devitrified glass.

Claim 24

The process of claim 19 further including the step of selecting said glass matrix from the group consisting of silicate, borosilicate, phosphate, zinc-borosilicate, soda-lime-silica, lead-silicate and lead-zinc-borate glasses.

Claim 25

The process of forming a semiconductor casing, comprising the steps of: providing a base component having four-sides formed of a ceramic-glass-metal composite material, said composite material having a structure comprising substantially a matrix of glass with ceramic particles and metal particles dispersed therein; providing a metallic leadframe, said leadframe comprising a plurality of leads having a first layer of aluminum cladding on at least one surface of the leadframe extending along the length of the leads; embedding said leadframe into said base component whereby the ends of said leads extend outward from four sides of said base component; and selectively etching the first layer of aluminum cladding from at least a section of the ends of said leads extending outward from said base component, said section extending from an outermost end of the leads to a point closer to the base component.

Claim 26

The process of forming a semiconductor casing, comprising the steps of: providing a base component having four-sides formed of a ceramic-glass-metal composite material, said composite material having a structure comprising substantially a matrix of glass with ceramic particles and metal particles dispersed therein; providing a metallic leadframe, said leadframe comprising a plurality of leads having a first layer of aluminum cladding on at least one surface of the leadframe extending along the length of the leads; embedding said leadframe into said base component whereby the ends of said leads extend outward from four sides of said base component; and selectively etching the first layer of aluminum cladding from at least a section of the ends of said leads extending outward from said base component, said section extending from an outermost end of the leads to a point closer to the base component.

Claim 27

The process of claim 21 including the step of bending the ends of said leads prior to the step of etching whereby the ends of said leads can be dipped into a solution of etchant without the etchant having substantial contact with said base component.

Claim 28

The process of claim 22 including the steps of selecting said leadframe with a second layer of aluminum cladding on a second surface of the leadframe, said second layer extending along the length of the leads; and selectively etching the second layer of aluminum cladding from said section of the ends of said leads extending outward from said base component, whereby said section of the first layer of aluminum cladding and the second layer of aluminum cladding remains to form a solder stop on said leads.

Claim 29

The process of claim 22 including the step of forming said first layer of aluminum cladding as a stripe.

Claim 30

The process of claim 22 including the step of providing said leadframe having at least one hole therethrough having said composite material therein whereby the area bonded to the composite material is increased.

Claim 31

The process of claim 25 further including the step of forming said at least one hole in said leadframe with a collar extending out of the plane through the surface of the leadframe to increase the bonded area as compared to that of the hole without a collar.

Claim 32

The process of claim 25 further including the step of completely embedding said leadframe with said composite material.