Abstract The disclosure relates to a glass or ceramic filled glass dualin-line header wherein the leads on the lead frame extend perpendicular to the plane of the glass and closely adjacent the sides of the glass during fabrication. The leads of the lead frame are bonded to the glass along three surfaces thereof to provide superior standoff sheer reliability and resistance to header cracking, resulting in loss of hermeticity. The glass on the upper surface of the lead frame extends to the edge of the header. A larger cavity for reception of a semiconductor chip is provided due to smaller lead lengths on the glass surface. The leads of the lead frame include a window which extends within the glass and outwardly, thereby providing a seal within the window to provide stronger lead anchoring and to provide the header with better stress capability.
A header for use with semiconductor devices comprising: a lead frame including a plurality of leads, said lead frame having a substantially planar central area and respective opposite substantially planar side areas integral with said central area and arranged in perpendicular relationship with respect thereto and extending in the same direction, each of said leads included in said lead frame having a portion thereof disposed in the planar central area of said lead frame and having with a bend therein to dispose the remaining lead portion thereof in one of the opposite side areas of said lead frame, each of said leads having with an opening extending therethrough and located across said bend in said lead defining a window extending across said bend, a body of glass bonded to said lead frame along three different planes so as to encase said central area of said lead frame and partially encasing the opposite side areas of said lead frame, said glass body extending through the respective windows in each of said leads and filling said windows presenting opposite sides of said glass body in substantially flush relationship with the portions of said leads disposed in the opposite side areas of said lead frame.
Claim 2
Dependent Claim
202 words
A header for use with semiconductor devices comprising: a lead frame including a plurality of leads, said lead frame having a substantially planar central area and respective opposite substantially planar side areas integral with said central area and arranged in perpendicular relationship with respect thereto and extending in the same direction, each of said leads included in said lead frame having a portion thereof disposed in the planar central area of said lead frame and having with a bend therein to dispose the remaining lead portion thereof in one of the opposite side areas of said lead frame, each of said leads having with an opening extending therethrough and located across said bend in said lead defining a window extending across said bend, a body of glass bonded to said lead frame along three different planes so as to encase said central area of said lead frame and partially encasing the opposite side areas of said lead frame, said glass body extending through the respective windows in each of said leads and filling said windows presenting opposite sides of said glass body in substantially flush relationship with the portions of said leads disposed in the opposite side areas of said lead frame.
Claim 3
Dependent Claim
34 words
A header as set forth in claim 1 wherein each of said leads has an intermediate enlarged area located on opposite sides of the bend therein and in which the window-defining opening is located.