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US5234860A Expired / Lapsed US ⏱️ 0.0 years remaining

Thinning of imaging device processed wafers

Assignee: Eastman Kodak Co
•
Filing: 1992-03-19
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Granted: 1993-08-10
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Expires: 2012-03-19
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Abstract

Abstract A process for supporting an image sensor wafer includes providing a support oxide layer on one surface of a support wafer and an etch resistant layer on the opposite surface. The support oxide layer is bonded to the image sensor oxide layer.

Inventors

  • 👤 Ronald M. Gluck

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 21:36
CPC Classifications
H; H10; H10P; H10P90/00; H10P90/19; H10P90/1904; H10P90/1906; H10P90/1914; H10F; H10F39/00; H10F39/10; H10F39/12; H10F39/15; H10F39/153; Y; Y10; Y10S; Y10S148/00; Y10S148/012; Y10S438/00; Y10S438/977

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 149 words
A process for oxide-to-oxide bonding a first initially non-planar oxide surface of a silicon image sensor wafer having a second surface of a thinnable substrate to one oxide surface of a silicon support wafer, comprising the steps of: (a) forming a planarized oxide over the first initially non-planar oxide surface of the image sensor wafer opposite said second surface; (b) providing a planarized oxide on said one surface of the support wafer and a thinning-protective surface on the second surface of the support wafer; (c) hydrating the planarized oxide surfaces of th image sensor wafer and the support wafer; (d) bonding the hydrated planarized oxide on the first surface of the image sensor wafer to the hydrated planarized oxide on the one surface of the support wafer whereby the image sensor wafer is supported; and (e) thinning the thinnable substrate on said second surface of said image sensor wafer.
Claim 2
Dependent Claim 149 words
A process for oxide-to-oxide bonding a first initially non-planar oxide surface of a silicon image sensor wafer having a second surface of a thinnable substrate to one oxide surface of a silicon support wafer, comprising the steps of: (a) forming a planarized oxide over the first initially non-planar oxide surface of the image sensor wafer opposite said second surface; (b) providing a planarized oxide on said one surface of the support wafer and a thinning-protective surface on the second surface of the support wafer; (c) hydrating the planarized oxide surfaces of th image sensor wafer and the support wafer; (d) bonding the hydrated planarized oxide on the first surface of the image sensor wafer to the hydrated planarized oxide on the one surface of the support wafer whereby the image sensor wafer is supported; and (e) thinning the thinnable substrate on said second surface of said image sensor wafer.
Claim 3
Dependent Claim 51 words
The process of claim 1 wherein the step of forming the planarized oxide over the first initially non-planar oxide surface of the image sensor wafer includes providing a spin-on-glass layer over said first surface, whereby said first oxide surface of the image sensor wafer is covered by the planarized glass layer.
Claim 4
Dependent Claim 12 words
The process of claim 2 wherein the planarized glass layer is polished.
Claim 5
Dependent Claim 51 words
The process of claim 1 including bonding the hydrated planarized oxide on the first surface of the image sensor wafer to the hydrated planarized oxide on the one surface of the support wafer by means of hydrogen bonds created by providing OH - groups in each oxide in said hydrating step.
Claim 6
Dependent Claim 34 words
The process o claim 1 wherein the bonding step includes aligning the hydrated planarized oxide surfaces of the image sensor wafer and the support wafer, and applying pressure to cause hydrogen bonds to form.

References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1996-08-09 1997-02-08 1997-08-10 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2000-08-09 2001-02-08 2001-08-10 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2004-08-09 2005-02-08 2005-08-10 $7700.00 Window Closed / Lapsed

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