US5163499A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming electronic packages
Assignee: Lanxide Technology Co LP
•
Filing: 1990-05-09
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Granted: 1992-11-17
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Expires: 2010-05-09
Abstract
Abstract The present invention relates to the formation of a macrocomposite body by spontaneously infiltrating a permeable mass of filler material or a preform with molten matrix metal and bonding the spontaneously infiltrated material to at least one second material such as a ceramic or ceramic containing body and/or a metal or metal containing body. Particularly, an infiltration enhancer and/or infiltration enhancer precursor and/or infiltrating atmosphere are in communication with a filler material or a preform, at least at some point during the process, which permits molten matrix metal to spontaneously infiltrate the filler material or preform. Moreover, prior to infiltration, the filler material or preform is placed into contact with at least a portion of a second material such that after infiltration of the filler material or preform, the infiltrated material is bonded to the second material, thereby forming a sealable electronic package.
Inventors
- 👤 Marc S. Newkirk
- 👤 Danny R. White
- 👤 Christopher R. Kennedy
- 👤 Alan S. Nagelberg
- 👤 Michael K. Aghajanian
- 👤 Robert J. Wiener
- 👤 Steven D. Keck
- 👤 John T. Burke
- 👤 Peter M. Engelgau
- 👤 Cheng-Tsin Lee
- 👤 Michael A. Rocazella
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 14:40
CPC Classifications
C; C04; C04B; C04B35/00; C04B35/622; C04B35/64; C04B35/65; C04B35/652; C22; C22C; C22C1/00; C22C1/10; C22C1/1005; C22C1/1015; C22C1/1036; C22C1/1057; C22C1/1063; C22C47/00; C22C47/02; C22C47/06; H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/257; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W99/00
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
196 words
A method for producing a sealable electronic package comprising: juxtaposing at least one material selected from the group consisting of at least one weldable body of material and at least one electrically insulating material relative to a mass of filler material or preform; juxtaposing a body of matrix metal relative to said mass of filler material or preform such that said matrix metal, when molten, will spontaneously infiltrate said mass of filler material or preform up to said at least one material to form a macrocomposite body comprising a metal matrix composite body integrally bonded to said at least one material; heating said matrix metal in an infiltrating atmosphere to a temperature above the melting point of said matrix metal but below the melting point of said filler material or preform; spontaneously infiltrating at least a portion of said mass of filler material or preform with said matrix metal up to at least a portion of said at least one material; and cooling said matrix metal to a temperature below said melting point of the matrix metal., while said matrix metal is in contact with said at least one material, thereby forming said sealable electronic packaging.
Claim 2
Independent Claim
196 words
A method for producing a sealable electronic package comprising: juxtaposing at least one material selected from the group consisting of at least one weldable body of material and at least one electrically insulating material relative to a mass of filler material or preform; juxtaposing a body of matrix metal relative to said mass of filler material or preform such that said matrix metal, when molten, will spontaneously infiltrate said mass of filler material or preform up to said at least one material to form a macrocomposite body comprising a metal matrix composite body integrally bonded to said at least one material; heating said matrix metal in an infiltrating atmosphere to a temperature above the melting point of said matrix metal but below the melting point of said filler material or preform; spontaneously infiltrating at least a portion of said mass of filler material or preform with said matrix metal up to at least a portion of said at least one material; and cooling said matrix metal to a temperature below said melting point of the matrix metal., while said matrix metal is in contact with said at least one material, thereby forming said sealable electronic packaging.
Claim 3
Dependent Claim
34 words
The method of claim 1, wherein said weldable body of material comprises at least one seam weldable body of material selected from the group consisting of a metal matrix composite body, copper, and aluminum.
Claim 4
Dependent Claim
41 words
The method of claim 2, wherein both said at least one seam weldable body of material and said at least one electrically insulating material are juxtaposed to said filler material or preform prior to spontaneously infiltrating said filler material or preform.
Claim 5
Dependent Claim
15 words
The method of claim 3, wherein said at least one electrically insulating material comprises alumina.
Claim 6
Dependent Claim
12 words
The method of claim 3, wherein said electrically insulating material comprises mullite.
Claim 7
Dependent Claim
15 words
The method of claim 3, wherein said electrically insulating material contains an electrically conductive material.
Claim 8
Dependent Claim
33 words
The method of claim 3, wherein said electrically insulating material contains an electrical conductor therein, said electrical conductor and said electrically insulating material forming a hermetic seal therebetween during said spontaneously infiltrating step.
Claim 9
Dependent Claim
35 words
The method of claim 2, wherein at least a portion of said macrocomposite body is coated by at least one process selected from the group consisting of sputtering, electroless plating, electoplating and ion vapor deposition.
Claim 10
Dependent Claim
33 words
The method of claim 1, wherein said weldable body of material comprises at least one laser weldable body of material selected from the group consisting of aluminum and aluminum metal matrix composite bodies.
Claim 11
Dependent Claim
20 words
The method of claim 2, wherein said weldable body of material functions as a weldable lip on said electronic package.
Claim 12
Dependent Claim
18 words
The method of claim 8, wherein said coating assists in seam sealing said macrocomposite body to another body.
Claim 13
Dependent Claim
29 words
The method of claim 1, wherein said electrically insulating material is located in a wall of said macrocomposite body and functions as an insulating area in said electronic package.
Claim 14
Dependent Claim
16 words
The method of claim 12, wherein the electronic chip is affixed to said electrical insulating area.
Claim 15
Dependent Claim
16 words
The method of claim 8, wherein at least two layers are deposited on said macrocomposite body.
Claim 16
Dependent Claim
28 words
The method of claim 8, wherein said coating comprises at least one material selected from the group consisting of gold, nickel, tin, zinc, epoxy, resins and mixtures thereof.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-11-17 | 1996-05-18 | 1996-11-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-11-17 | 2000-05-18 | 2000-11-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-11-17 | 2004-05-18 | 2004-11-17 | $7700.00 | Window Closed / Lapsed |