Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
69 words
A surface emitting semiconductor laser comprising: a GRINSCH SQW laser structure including an active SQW layer between a pair of GRINSCH layers on a substrate, said active layer having a horizontal laser cavity therein; and a pair of parallel grooves etched in said substrate through said SQW and GRINSCH layers, each such groove including a substantially vertical oscillating mirror and a substantially 45° beam deflector for said laser cavity.
Claim 2
Dependent Claim
69 words
A surface emitting semiconductor laser comprising: a GRINSCH SQW laser structure including an active SQW layer between a pair of GRINSCH layers on a substrate, said active layer having a horizontal laser cavity therein; and a pair of parallel grooves etched in said substrate through said SQW and GRINSCH layers, each such groove including a substantially vertical oscillating mirror and a substantially 45° beam deflector for said laser cavity.
Claim 3
Dependent Claim
17 words
The surface emitting semiconductor laser claimed in claim 1 wherein said GRINSCH SQW laser structure is pseudomorphic.
Claim 4
Dependent Claim
26 words
The surface emitting semiconductor laser claimed in claim 2 wherein the active layer is thin enough to permit accommodation of pseudomorphic lattice mismatch by elastic deformation.
Claim 5
Dependent Claim
32 words
The surface emitting semiconductor laser claimed in claim 2 wherein the thickness of the active layer is below the limit for strain-induced relaxation of pseudomorphic lattice mismatch through formation of misfit dislocations.
Claim 6
Dependent Claim
35 words
The surface emitting semiconductor laser claimed in claim 1 wherein said GRINSCH SQW laser structure comprises: Al.sub.× Ga 1- × As GRINSCH layers; and 5 an GaAs or Al.sub.× Ga 1- × As active layer.
Claim 7
Dependent Claim
32 words
The surface emitting semiconductor laser claimed in claim 1 wherein said GRINSCH SQW laser comprises: Al.sub.× Ga 1- × As GRINSCH layers; and a pseudomorphic In.sub.× Ga 1- × As active layer.
Claim 8
Dependent Claim
24 words
The surface emitting semiconductor laser claimed in claim 1 wherein the substrate is transparent to the wavelength of light resonant in said laser cavity.
Claim 9
Dependent Claim
20 words
The surface emitting semiconductor laser claimed in claim 1, further comprising: an upper cladding layer doped with zinc or beryllium.
Claim 10
Dependent Claim
19 words
The surface emitting semiconductor laser claimed in claim 8, further comprising: a cap layer doped with zinc or beryllium.
Claim 11
Dependent Claim
19 words
The surface emitting semiconductor laser claimed in claim 1, further comprising: a cap layer doped with zinc or beryllium.
Claim 12
Dependent Claim
17 words
The surface emitting semiconductor laser claimed in claim 1, further comprising: a buffer layer doped with silicon.
Claim 13
Dependent Claim
18 words
The surface emitting semiconductor laser claimed in claim 1, further comprising: a lower cladding layer doped with silicon.
Claim 14
Dependent Claim
18 words
The surface emitting semiconductor laser claimed in claim 1, further comprising: a lower cladding layer doped with silicon.
Claim 15
Independent Claim
59 words
The method of fabricating surface emitting semiconductor lasers, comprising the steps of: forming a GRINSCH SQW laser structure having an active layer with a horizontal laser cavity in a substrate; and etching a pair of parallel grooves in the substrate, each such groove including a substantially vertical oscillating mirror and a substantially 45° beam deflector for said laser cavity.
Claim 16
Independent Claim
59 words
The method of fabricating surface emitting semiconductor lasers, comprising the steps of: forming a GRINSCH SQW laser structure having an active layer with a horizontal laser cavity in a substrate; and etching a pair of parallel grooves in the substrate, each such groove including a substantially vertical oscillating mirror and a substantially 45° beam deflector for said laser cavity.
Claim 17
Dependent Claim
28 words
The method claimed in claim 14 wherein the step of etching the grooves further comprises: applying a tilted angle ion beam to said substrate to etch each groove.