Patent US5015207A successfully refreshed from Google Patents.
US5015207A
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US
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Multi-path feed-thru lead and method for formation thereof
Assignee: ISOTRONICS Inc A CORP OF DELAWARE
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Filing: 1989-12-28
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Granted: 1991-05-14
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Expires: 2009-12-28
Abstract
Abstract A multi-path feed-thru lead is disclosed that provides increased conductive pathway density and that has particular utility in combination with microcircuit packages housing hybrid and semiconductor discrete and integrated circuit chips. The multi-path feed-thru leads have a configuration that facilitates sealing thereof in the apertures of microcircuit packages to provide increased conductive path density. The multi-path feed-thru lead according to the present invention includes an insulative substrate having a predetermined geometric configuration and includes an extended intermediate portion and first and second end portions configured to define a plurality of bonding pads that facilitate wire bonding to the circuitry housed in the package and to external circuitry, respectively. A plurality of discrete metalized conductive pathways are formed on the intermediate portion ad first and second end portions of the insulative substrate. In one preferred method of forming the multi-path feed-thru lead of the present invention, the external surface of the insulative substrate is first metalized and then selected portions of metalization are removed to form the plurality of discrete conductive pathways. The multi-path feed-thru lead of the present invention thereby provides multiple conductive pathways on a single substrate member.
Inventors
- 👤 Richard A. Koepke
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 20:16
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H01; H01R; H01R13/00; H01R13/02; H01R13/04; H01R24/00; H01R24/86; H01R43/00; H01R43/16; H05; H05K; H05K3/00; H05K3/30; H05K3/306; H05K3/308; H10W70/01; H10W70/05; H10W70/095; H10W70/62; H10W70/63; H10W70/635; H01R2107/00; Y; Y10; Y10S; Y10S439/00; Y10S439/931; Y10S439/933; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49156; Y10T29/49204; Y10T29/49224
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
124 words
A multi-path feed-thru lead providing increased conductive pathway density, comprising: an insulative substrate having a predetermined configuration, said insulative substrate including an extended intermediate portion and first and second end portions, said first and second end portions having configurations defining a first and second plurality of bonding pads, respectively; a plurality of metalized conductive pathways formed on said intermediate portion and said plurality of bonding pads defined by said first and second end portions, respectively, of said insulative substrate; adjacent ones of said metalized conductive pathways being defined and separated by exposed strips of said insulative substrate; and conductive interconnect trace means formed in said exposed strips of said insulative substrate for electrically interconnecting at least one adjacent pair of said metalized conductive pathways.
Claim 2
Dependent Claim
124 words
A multi-path feed-thru lead providing increased conductive pathway density, comprising: an insulative substrate having a predetermined configuration, said insulative substrate including an extended intermediate portion and first and second end portions, said first and second end portions having configurations defining a first and second plurality of bonding pads, respectively; a plurality of metalized conductive pathways formed on said intermediate portion and said plurality of bonding pads defined by said first and second end portions, respectively, of said insulative substrate; adjacent ones of said metalized conductive pathways being defined and separated by exposed strips of said insulative substrate; and conductive interconnect trace means formed in said exposed strips of said insulative substrate for electrically interconnecting at least one adjacent pair of said metalized conductive pathways.
Claim 3
Dependent Claim
54 words
A method of forming the multi-path feed-thru lead of claim 1 wherein: said plurality of metalized conductive pathways and said conductive interconnect trace means are formed by selectively metalizing said extended intermediate portion and said first and second plurality of bonding pads of said first and second end portions, respectively, of said insulative substrate.
Claim 4
Dependent Claim
106 words
A method of forming the multi-path feed-thru lead of claim 1 wherein said plurality of metalized conductive pathways and said conductive interconnect trace means are selectively formed by: metalizing the exterior surface of said insulative substrate; and selectively removing portions of said metalized exterior surface from said extended intermediate portion and said first and second plurality of bonding pads of said first and second end portions, respectively, of said insulative substrate to form said exposed strips defining and separating said plurality of metalized conductive pathways and to form said conductive interconnect trace means for electrically interconnecting at least one adjacent pair of said metalized conductive pathways.
Claim 5
Dependent Claim
33 words
The multi-path feed-thru lead of claim 1, wherein: said insulative substrate has a predetermined coefficient of thermal expansion compatible with an insulative preform used in microelectronic circuit packaging for providing hermetic sealing therein.
Claim 6
Dependent Claim
17 words
The multi-path feed-thru lead of claim 4, wherein: said insulative substrate is fabricated from a ceramic material.
Claim 7
Dependent Claim
12 words
The multi-path feed-thru of claim 5, wherein said ceramic material is alumina.
Claim 8
Dependent Claim
175 words
A multi-path feed-thru lead providing increased conductive pathway density, comprising: an insulative substrate having a predetermined configuration including an extended intermediate portion and first and second end portions, said first and second ned portions having configurations defining a first and second plurality of bonding pads, respectively; said extended intermediate portion having a plurality of planar sides arranged to define a polygonal cross-sectional configuration for said extended intermediate portion; each of said first and second end portions having a plurality of inwardly tapered planar sides terminating in an end face and arranged to define a polygonal frustum cross-sectional configuration, said inwardly tapered planar sides defining said defining said plurality of bonding pads; each of said planar sides of said intermediate portion being contiguous with respective ones of said plurality of bonding pads of said first and second end portions; and a plurality of metalized conductive pathways formed on said intermediate portion and said first and second end portions, respectively; adjacent ones of said metalized pathways being defined and separated by exposed strips of said insulative substrate.
Claim 9
Dependent Claim
175 words
A multi-path feed-thru lead providing increased conductive pathway density, comprising: an insulative substrate having a predetermined configuration including an extended intermediate portion and first and second end portions, said first and second ned portions having configurations defining a first and second plurality of bonding pads, respectively; said extended intermediate portion having a plurality of planar sides arranged to define a polygonal cross-sectional configuration for said extended intermediate portion; each of said first and second end portions having a plurality of inwardly tapered planar sides terminating in an end face and arranged to define a polygonal frustum cross-sectional configuration, said inwardly tapered planar sides defining said defining said plurality of bonding pads; each of said planar sides of said intermediate portion being contiguous with respective ones of said plurality of bonding pads of said first and second end portions; and a plurality of metalized conductive pathways formed on said intermediate portion and said first and second end portions, respectively; adjacent ones of said metalized pathways being defined and separated by exposed strips of said insulative substrate.
Claim 10
Dependent Claim
89 words
The multi-path feed-thru lead of claim 7 wherein said plurality of metalized conductive pathways are formed on said planar sides of said intermediate portion and said inwardly tapered planar sides of said first and second end portions defining said plurality of bonding pads, and further wherein each said exposed strip of insulative substrate defining and separating said metalized conductive pathways includes edge portions between adjacent said planar sides of said intermediate portion and edge portions between adjacent said tapered planar sides of said first and second end portions, respectively.
Claim 11
Independent Claim
110 words
A method for forming a multi-path feed-thru lead, comprising: forming an insulative substrate having a predetermined configuration including an extended intermediate portion and first and second end portions having configurations defining a first and second plurality of bonding pads, respectively; forming a plurality of metalized conductive pathways on said intermediate portion and said first and second plurality of bonding pads of said first and second end portions, respectively, of said insulative substrate, adjacent ones of said metalized conductive pathways being defined and separated by respective exposed strips of said insulative substrate; and forming at least one conductive metalized interconnecting trace between adjacent said metalized conductive pathways for electrical interconnection therebetween.
Claim 12
Independent Claim
110 words
A method for forming a multi-path feed-thru lead, comprising: forming an insulative substrate having a predetermined configuration including an extended intermediate portion and first and second end portions having configurations defining a first and second plurality of bonding pads, respectively; forming a plurality of metalized conductive pathways on said intermediate portion and said first and second plurality of bonding pads of said first and second end portions, respectively, of said insulative substrate, adjacent ones of said metalized conductive pathways being defined and separated by respective exposed strips of said insulative substrate; and forming at least one conductive metalized interconnecting trace between adjacent said metalized conductive pathways for electrical interconnection therebetween.
Claim 13
Independent Claim
124 words
A method for forming a multi-path feed-thru lead, comprising: forming an insulative substrate having a predetermined configuration including an extended intermediate portion and first and second end portions having configurations defining a first and second plurality of bonding pads, respectively; selectively metalizing said extended intermediate portion and said first and second plurality of bonding pads of said first and second end portions, respectively, of said insulative substrate to form a plurality of metalized conductive pathways, adjacent ones of said metalized conductive pathways being defined and separated by respective exposed strips of said insulative substrate; and selectively metalizing said extended intermediate portion of said insulative substrate to form at least one conductive metalized interconnecting trace between said adjacent metalized conductive pathways for electrical interconnection therebetween.
Claim 14
Independent Claim
124 words
A method for forming a multi-path feed-thru lead, comprising: forming an insulative substrate having a predetermined configuration including an extended intermediate portion and first and second end portions having configurations defining a first and second plurality of bonding pads, respectively; selectively metalizing said extended intermediate portion and said first and second plurality of bonding pads of said first and second end portions, respectively, of said insulative substrate to form a plurality of metalized conductive pathways, adjacent ones of said metalized conductive pathways being defined and separated by respective exposed strips of said insulative substrate; and selectively metalizing said extended intermediate portion of said insulative substrate to form at least one conductive metalized interconnecting trace between said adjacent metalized conductive pathways for electrical interconnection therebetween.
Claim 15
Dependent Claim
66 words
The method of claim 9 wherein said selective metalizing step further comprises the steps of: metalizing said insulative substrate to form a metalized insulative substrate; and selectively stripping metalization from said metalized insulative substrate to form said respectively exposed strips of said insulative substrate, said respective exposed strips of said insulative substrate defining and separating adjacent ones of said metalized conductive pathways of said insulative substrate.
Claim 16
Independent Claim
118 words
A method for forming a multi-path feed-thru lead, comprising: forming an insulative substrate having a predetermined configuration including an extended intermediate portion and first and second end portions having configurations defining a first and second plurality of bonding pads, respectively; metalizing said insulative substrate to form a metalized insulative substrate; and selectively stripping metalization from said metalized insulative substrate to form respective exposed strips of said insulative substrate defining and separating adjacent metalized conductive pathways of said metalized insulative substrate wherein said selective metalizing stripping step further includes: selectively stripping metalization from said metalized insulative substrate to form at least one conductive interconnect trace between an adjacent pair of said metalized conductive pathways to provide electrical interconnection therebetween.
Claim 17
Independent Claim
118 words
A method for forming a multi-path feed-thru lead, comprising: forming an insulative substrate having a predetermined configuration including an extended intermediate portion and first and second end portions having configurations defining a first and second plurality of bonding pads, respectively; metalizing said insulative substrate to form a metalized insulative substrate; and selectively stripping metalization from said metalized insulative substrate to form respective exposed strips of said insulative substrate defining and separating adjacent metalized conductive pathways of said metalized insulative substrate wherein said selective metalizing stripping step further includes: selectively stripping metalization from said metalized insulative substrate to form at least one conductive interconnect trace between an adjacent pair of said metalized conductive pathways to provide electrical interconnection therebetween.
Claim 18
Dependent Claim
175 words
A multi-path feed-thru lead providing increased conductive pathway density, comprising: an insulative substrate having a predetermined configuration including an extended intermediate portion and first and second end portions, said first and second end portions having configurations defining a first and second plurality of bonding pads, respectively; said extended intermediate portion having a plurality of planar sides arranged to define a polygonal cross-sectional configuration for said extended intermediate portion; each of said first and second portions including a plurality of inwardly tapered planar sides terminating in an end face, said inwardly tapered planar sides defining said plurality of bonding pads; each of said planar sides of said intermediate portion being contiguous with respective ones of said plurality of bonding pads of said first and second end portions; and a plurality of metalized conductive pathways formed on said intermediate portion and said plurality of bonding pads defined by said first and second end portions, respectively, of said insulative substrate; adjacent ones of said metalized conductive pathways being defined and separated by exposed strips of said insulative substrate.
Claim 19
Dependent Claim
175 words
A multi-path feed-thru lead providing increased conductive pathway density, comprising: an insulative substrate having a predetermined configuration including an extended intermediate portion and first and second end portions, said first and second end portions having configurations defining a first and second plurality of bonding pads, respectively; said extended intermediate portion having a plurality of planar sides arranged to define a polygonal cross-sectional configuration for said extended intermediate portion; each of said first and second portions including a plurality of inwardly tapered planar sides terminating in an end face, said inwardly tapered planar sides defining said plurality of bonding pads; each of said planar sides of said intermediate portion being contiguous with respective ones of said plurality of bonding pads of said first and second end portions; and a plurality of metalized conductive pathways formed on said intermediate portion and said plurality of bonding pads defined by said first and second end portions, respectively, of said insulative substrate; adjacent ones of said metalized conductive pathways being defined and separated by exposed strips of said insulative substrate.
Claim 20
Independent Claim
173 words
A method for forming a multi-path feed-thru lead, comprising: forming an insulative substrate having a predetermined configuration including an extended intermediate portion and first and second end portions having configurations defining a first and second plurality of bonding pads, respectively; said extended intermediate portion having a plurality of planar sides arranged to define a polygonal cross-sectional configuration for said extended intermediate portion; each of said first and second end portions including a plurality of inwardly tapered planar sides terminating in an end face, said inwardly tapered planar sides defining said plurality of bonding pads; each of said planar sides of said intermediate portion being contiguous with respective ones of said plurality of bonding pads of said first and second end portions; and forming a plurality of metalized conductive pathways on said intermediate portion and said first and second plurality of bonding pads of said first and second end portions, respectively, of said insulative substrate, adjacent ones of said metalized conductive pathways being defined and separated by respective exposed strips of said insulative substrate.
Claim 21
Independent Claim
173 words
A method for forming a multi-path feed-thru lead, comprising: forming an insulative substrate having a predetermined configuration including an extended intermediate portion and first and second end portions having configurations defining a first and second plurality of bonding pads, respectively; said extended intermediate portion having a plurality of planar sides arranged to define a polygonal cross-sectional configuration for said extended intermediate portion; each of said first and second end portions including a plurality of inwardly tapered planar sides terminating in an end face, said inwardly tapered planar sides defining said plurality of bonding pads; each of said planar sides of said intermediate portion being contiguous with respective ones of said plurality of bonding pads of said first and second end portions; and forming a plurality of metalized conductive pathways on said intermediate portion and said first and second plurality of bonding pads of said first and second end portions, respectively, of said insulative substrate, adjacent ones of said metalized conductive pathways being defined and separated by respective exposed strips of said insulative substrate.
Claim 22
Dependent Claim
25 words
The method of claim 14, further comprising: forming at least one conductive metalized interconnecting trace between adjacent said metalized conductive pathways for electrical interconnection therebetween.
Claim 23
Dependent Claim
24 words
The method of claim 14, wherein: said inwardly tapered planar sides defining said bonding pads are arranged to define a polygonal frustum cross-sectional configuration.
Claim 24
Dependent Claim
25 words
The method of claim 16, further comprising: forming at least one conductive metalized interconnecting trace between adjacent said metalized conductive pathways for electrical interconnection therebetween.
References Cited (Backward Citations)
US3148356A
Cited
US4176901A
Cited
US4406062A
Cited
US4320438A
Cited
US4412093A
Cited
US4750031A
Cited
US4633573A
Cited
US4594473A
Cited
US4506108A
Cited
US4751199A
Cited
US4654472A
Cited
US4649229A
Cited
US4821151A
Cited
US4720915A
Cited
US4830620A
Cited
US4716082A
Cited
US4835120A
Cited
US4761518A
Cited
US4788382A
Cited
US4841101A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1994-05-13 | 1994-11-12 | 1995-05-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-05-13 | 1998-11-12 | 1999-05-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-05-13 | 2002-11-12 | 2003-05-14 | $7700.00 | Window Closed / Lapsed |