US4654472A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic component package with multiconductive base forms for multichannel mounting
Assignee: Individual
•
Filing: 1984-12-17
•
Granted: 1987-03-31
•
Expires: 2004-12-17
Abstract
Abstract An improved electronic component or integrated circuit (IC) package characterized by an extraordinary small size for the number of input-output (I/O) leads which are available and capable of use on surface mounted, Flat Pack, hybrid, or through hole (DIP) printed circuit boards. The package has one or more cylindrical or shaped forms at the base, with a flange to provide a stop in order to limit the insertion travel in those circuit boards having through holes, and a top body which is used to house the electronic device. The forms, which protrude down from the upper body (housing), have one or more conductive lead segments, either pins or printed circuit types, running longitudinally and continuing through the housing to the upper body. Each lead segment is connected directly to the electronic device or attached via an additonal lead to a pad on the electronic device, mounted on the upper body. A cover to seal the device is provided. Grooves in the body or on the cover aid in handling the device, either manually or by automatic machinery, are provided. These grooves also provide gripping areas for top hat heat sinks.
Inventors
- 👤 Samuel Goldfarb
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 17:51
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/306; H05K3/308; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/153; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09645; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2201/10704; H05K2201/10742; H05K2201/10886; H05K2201/10893; H10W44/00; H10W44/20; H10W44/203; H10W44/209; H10W44/212; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W90/00; H10W90/701; H10W90/751; H10W90/753; H10W90/754; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10S; Y10S439/00; Y10S439/931
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
112 words
A housing for coupling electronic circuits inserted therein to a printed circuit board comprising: an upper body having a component region for locating said electronic circuits; and at least one form protruding from said upper body, at least one of which is a cylinder having a cylinder axis, said at least one form constructed for insertion into mating areas on one surface of said printed circuit board, each of said at least one form having an outer periphery with one or more electrical conductive segments on said outer periphery, said electrical conductive segments extending into said component region for coupling said electronic circuits to said one surface of said printed circuit board.
Claim 2
Dependent Claim
112 words
A housing for coupling electronic circuits inserted therein to a printed circuit board comprising: an upper body having a component region for locating said electronic circuits; and at least one form protruding from said upper body, at least one of which is a cylinder having a cylinder axis, said at least one form constructed for insertion into mating areas on one surface of said printed circuit board, each of said at least one form having an outer periphery with one or more electrical conductive segments on said outer periphery, said electrical conductive segments extending into said component region for coupling said electronic circuits to said one surface of said printed circuit board.
Claim 3
Dependent Claim
28 words
A housing in accordance with claim 1 wherein at least one of said one or more electrical conductive segments is positioned to be parallel with said cylinder axis.
Claim 4
Dependent Claim
29 words
A housing in accordance with claim 2 wherein at least one of said electrical conductive segments has dimensions that differ from dimensions of other of said electrical conductive segments.
Claim 5
Dependent Claim
20 words
A housing in accordance with claim 1 further including a cover, positionable on and hermetically sealable with said upper body.
Claim 6
Dependent Claim
13 words
A housing in accordance with claim 4 wherein said cover includes gripping grooves.
Claim 7
Dependent Claim
16 words
A housing in accordance with claim 5 further including heat sinks positioned in said gripping grooves.
Claim 8
Dependent Claim
14 words
A housing in accordance with claim 6 wherein said upper body contains gripping grooves.
Claim 9
Dependent Claim
24 words
A housing in accordance with claim 4 wherein said upper body, said cover, and said at least one form are constructed of non-conductive material.
Claim 10
Dependent Claim
22 words
A housing in accordance with claim 1 wherein each of said at least one form contains a flange adjacent said upper body.
Claim 11
Dependent Claim
52 words
A housing in accordance with claim 1 wherein said at least one form comprises at least two forms, said at least two forms being circular cylinders and at least one of said at least two forms is of a diameter that differs from diameters of other of said at least two forms.
Claim 12
Dependent Claim
33 words
A housing in accordance with claim 10 further including a grounding pin having a circular cylinder geometric configuration and extending through said upper body into said component region for grounding said electronic circuits.
Claim 13
Dependent Claim
21 words
A housing in accordance with claim 1 wherein at least one of said at least one form contains a keying segment.
Claim 14
Dependent Claim
21 words
A housing in accordance with claim 1 wherein at least one of said at least one form contains a hollow segment.
Claim 15
Dependent Claim
20 words
A housing in accordance with claim 13 wherein said hollow segment is filled with solder, thereby forming a conductive segment.
Claim 16
Dependent Claim
74 words
A housing in accordance with claim 1 wherein: said upper body and said at least one form are constructed of nonconductive material; said upper body possesses a base having holes bored therethrough; said electrical conductive segments comprise conductive material continuously extending through said holes and along channels formed in said at least one form and aligned with said holes; and further includes a block, for mounting said electronic circuits, positioned in said component region.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-03-30 | 1990-09-29 | 1991-03-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-03-30 | 1994-09-29 | 1995-03-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-03-30 | 1998-09-29 | 1999-03-31 | $7700.00 | Window Closed / Lapsed |