Method of forming a mask pattern for the production of transistor

Claim 1

A method for forming a mask pattern comprising the steps of: depositing a mask layer made of low softening point materials on a surface of a semiconductor substrate; forming an opening in the mask layer; etching the semiconductor substrate through the opening in the mask layer; and heating the semiconductor substrate with the mask layer, thereby softening and fluidifying the mask layer so as to cause a part of the mask layer proximate the opening to expand toward the opening so as to narrow a width of the opening.

Claim 2

A method for forming a mask pattern comprising the steps of: depositing a mask layer made of low softening point materials on a surface of a semiconductor substrate; forming an opening in the mask layer; etching the semiconductor substrate through the opening in the mask layer; and heating the semiconductor substrate with the mask layer, thereby softening and fluidifying the mask layer so as to cause a part of the mask layer proximate the opening to expand toward the opening so as to narrow a width of the opening.

Claim 3

A method for producing a compound semiconductor device , said method comprising the steps of: implanting impurities of a predetermined conductive type with high density in regions for forming a source region and a drain region in a compound semiconductor substrate; implanting impurities of the same predetermined conductive type with high density in a shallow region including a portion between the source and the drain regions so as to form a first region; implanting impurities of the same predetermined conductive type with low density in a same region as the first region and being deeper than the first region but shallower than the source and drain regions so as to form a second region; depositing a mask layer made of low softening point materials on a surface of a semiconductor substrate; forming an opening in the mask layer; etching the semiconductor substrate through the opening in the mask layer so as to form a groove insulation layer with a depth deeper than that of the first region and shallower than that of the second region, in a middle portion between the source and drain regions, remaining a predetermined width of the first regions in both sides of the groove, one end portion of each first region being in contact with the source and drain regions respectively; heating the compound semiconductor substrate so as to soften and fluidify the insulation layers so as to have the insulation layers hang down from the upper portions of the first regions int the groove; and forming a gate electrode in Schottky contact with the upper surface of the second region on the bottom of the groove exposed between the insulation layers.

Claim 4

A method for producing a compound semiconductor device , said method comprising the steps of: implanting impurities of a predetermined conductive type with high density in regions for forming a source region and a drain region in a compound semiconductor substrate; implanting impurities of the same predetermined conductive type with high density in a shallow region including a portion between the source and the drain regions so as to form a first region; implanting impurities of the same predetermined conductive type with low density in a same region as the first region and being deeper than the first region but shallower than the source and drain regions so as to form a second region; depositing a mask layer made of low softening point materials on a surface of a semiconductor substrate; forming an opening in the mask layer; etching the semiconductor substrate through the opening in the mask layer so as to form a groove insulation layer with a depth deeper than that of the first region and shallower than that of the second region, in a middle portion between the source and drain regions, remaining a predetermined width of the first regions in both sides of the groove, one end portion of each first region being in contact with the source and drain regions respectively; heating the compound semiconductor substrate so as to soften and fluidify the insulation layers so as to have the insulation layers hang down from the upper portions of the first regions int the groove; and forming a gate electrode in Schottky contact with the upper surface of the second region on the bottom of the groove exposed between the insulation layers.