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US4971928A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of making a light emitting semiconductor having a rear reflecting surface

Assignee: Motors Liquidation Co
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Filing: 1990-01-16
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Granted: 1990-11-20
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Expires: 2010-01-16
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Abstract

Abstract A light emitting semiconducting structure is formed over a light reflecting surface using epitaxial growth techniques. The light reflecting surface is provided by an appropriate metal layer intermediately disposed between two dielectric layers, this multi-layer structure is disposed intermediate between an underlying substrate and the overlaying light emitting semiconducting components. The light reflecting surface provides enhanced photon reflectance for the light emitting device. The active region of the light emitting device is formed using epitaxial growth techniques.

Inventors

  • 👤 Brian K. Fuller

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 05:37
CPC Classifications
H; H10; H10H; H10H20/00; H10H20/80; H10H20/81; H10H20/814; H10H20/01; H10H20/011; H10H20/013; H10H20/0133; H10H20/01335; Y; Y10; Y10S; Y10S148/00; Y10S148/026; Y10S148/095; Y10S148/106

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 140 words
A method for forming a light emitting semiconducting structure comprising the following steps: providing a substrate of appropriate semiconductive material, conductivity and crystallographic orientation; patterning a reflecting structure which overlays said substrate, said patterned reflecting structure comprising a reflecting layer disposed between two dielectric layers such that a first dielectric layer contacts said substrate, said reflecting structure being patterned so as to expose at least one region of said underlying substrate; epitaxially growing a material crystallographically compatible with said substrate from said substrate in said exposed region of said substrate to a height approximately equal to the thickness of said reflecting structure and then continuing epitaxial growth of said material laterally over said reflecting structure to form an active region; and providing appropriate components and metallic contacts over said active region so as to form the light emitting semiconducting structure.
Claim 2
Independent Claim 140 words
A method for forming a light emitting semiconducting structure comprising the following steps: providing a substrate of appropriate semiconductive material, conductivity and crystallographic orientation; patterning a reflecting structure which overlays said substrate, said patterned reflecting structure comprising a reflecting layer disposed between two dielectric layers such that a first dielectric layer contacts said substrate, said reflecting structure being patterned so as to expose at least one region of said underlying substrate; epitaxially growing a material crystallographically compatible with said substrate from said substrate in said exposed region of said substrate to a height approximately equal to the thickness of said reflecting structure and then continuing epitaxial growth of said material laterally over said reflecting structure to form an active region; and providing appropriate components and metallic contacts over said active region so as to form the light emitting semiconducting structure.
Claim 3
Independent Claim 168 words
A method for forming a light emitting semiconducting structure comprising the following steps: providing a substrate of gallium arsenide, silicon, or other material characterized by n-type conductivity; patterning a sandwiched reflecting structure which overlays said substrate, said patterned sandwiched reflecting structure comprising a gold reflecting layer disposed between two dielectric layers of silicon oxide, such that a first dielectric layer contacts said substrate, said sandwiched reflecting structure being patterned so as to expose at least one region of said underlying substrate; epitaxially growing a material chosen from the group consisting of boron, aluminum, indium, gallium, arsenic, phosphorus, nitrogen in the III-V family of light-emitting compounds, and other III-VI, IV, and IV-VI lighter emitters from said substrate in said exposed region of said substrate to a height roughly equal to the thickness of said sandwiched reflecting structure and then continuing said epitaxial growth in a lateral direction over said sandwiched reflecting structure to from an active region; and providing appropriate p-type conductivity contacts over said laterally grown active region.
Claim 4
Independent Claim 168 words
A method for forming a light emitting semiconducting structure comprising the following steps: providing a substrate of gallium arsenide, silicon, or other material characterized by n-type conductivity; patterning a sandwiched reflecting structure which overlays said substrate, said patterned sandwiched reflecting structure comprising a gold reflecting layer disposed between two dielectric layers of silicon oxide, such that a first dielectric layer contacts said substrate, said sandwiched reflecting structure being patterned so as to expose at least one region of said underlying substrate; epitaxially growing a material chosen from the group consisting of boron, aluminum, indium, gallium, arsenic, phosphorus, nitrogen in the III-V family of light-emitting compounds, and other III-VI, IV, and IV-VI lighter emitters from said substrate in said exposed region of said substrate to a height roughly equal to the thickness of said sandwiched reflecting structure and then continuing said epitaxial growth in a lateral direction over said sandwiched reflecting structure to from an active region; and providing appropriate p-type conductivity contacts over said laterally grown active region.
Claim 5
Dependent Claim 31 words
A method for forming a light emitting semiconducting structure as recited in claim 1 wherein said substrate is characterized by p-type conductivity and and said contacts are characterized by n-type conductivity.
Claim 6
Dependent Claim 30 words
A method for forming a light emitting semiconducting structure as recited in claim 1 wherein said substrate is silicon, or given a sufficiently small pattern size, an amorphous glass substrate.
Claim 7
Dependent Claim 40 words
A method for forming a light emitting semiconducting structure as recited in claim 1 wherein said epitaxially grown material is gallium arsenide, indium-gallium-phosphide, aluminum-indium-gallium-phosphide, indium-gallium-phosphide-arsenide, aluminum-indium-gallium-phosphide-arsenide, aluminum-gallium-arsenide, aluminum-gallium-arsenide-phosphide, gallium-arsenide-phosphide, gallium-nitride, aluminum-gallium-nitride, aluminum-indium-gallium-nitride, aluminum-nitride, indium-nitride, indium-gallium-nitride, boron-nitride, or any combination thereof.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1993-11-19 1994-05-21 1994-11-20 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1997-11-19 1998-05-21 1998-11-20 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2001-11-19 2002-05-21 2002-11-20 $7700.00 Window Closed / Lapsed

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